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21. 发明授权

US06642109B2 Method of manufacturing a flash memory cell 失效
公开(公告)号：US06642109B2
公开(公告)日：2003-11-04
申请号：US10283073
申请日：2002-10-30
申请人： Seung Cheol Lee , Sang Wook Park
发明人： Seung Cheol Lee , Sang Wook Park
IPC分类号： H01L218247
CPC分类号： H01L27/115 , H01L27/11521
摘要： A method of manufacturing a flash memory cell in which an ion implantation process is performed before a cleaning process for etching a protrusion of a trench insulating film to a nipple shape. As a result, the etch rate at a portion except for portions in which a moat will occur along the trench insulating film is increased. Therefore, generation of the moat in the trench insulating film can be prevented and spacing of the floating gate can be optimized.

22. 发明授权

US6137162A Chip stack package 有权
标题翻译：芯片堆栈封装
公开(公告)号：US6137162A
公开(公告)日：2000-10-24
申请号：US307657
申请日：1999-05-10
申请人： Sang Wook Park , Sung Bum Park
发明人： Sang Wook Park , Sung Bum Park
IPC分类号： H01L23/02 , H01L23/10 , H01L23/485 , H01L23/495 , H01L25/065 , H01L25/10 , H01L23/48
CPC分类号： H01L24/02 , H01L23/49575 , H01L25/0657 , H01L25/10 , H01L2224/0401 , H01L2224/48247 , H01L2225/06551 , H01L2225/06586 , H01L2225/06593 , H01L24/48 , H01L2924/00014 , H01L2924/00015 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07811 , H01L2924/14 , H01L2924/181 , H01L2924/30105
摘要： Disclosed is a chip stack package having a remarkably short interconnection paths between the semiconductor chips and external device, and between the respective semiconductor chips. The chip stack package comprises: at least two semiconductor chips disposed in series vertically in the package, wherein bonding pads are disposed at both sides of the respective semiconductor chips and vertically open slots are formed in the bonding pads; lead frames inserted into the slots of the respective semiconductor chips so as to electrically connect the respective bonding pads; and an epoxy compound for molding the resultant structure entirely so as to expose an interconnection portion of the respective lead frames.
摘要翻译：公开了一种在半导体芯片和外部设备之间以及各个半导体芯片之间具有非常短的互连路径的芯片堆叠封装。芯片堆叠封装包括：至少两个半导体芯片在封装中垂直放置，其中焊盘设置在各个半导体芯片的两侧，并且在焊盘中形成垂直开放的槽; 将引线框架插入到各个半导体芯片的槽中，以便电连接相应的焊盘; 以及用于将所得结构整体模制以暴露各个引线框架的互连部分的环氧化合物。

23. 发明授权

US06008541A Packaged integrated circuit device 失效
标题翻译：封装集成电路器件
公开(公告)号：US06008541A
公开(公告)日：1999-12-28
申请号：US60140
申请日：1998-04-15
申请人： Sang Wook Park , Hyung Gil Baig
发明人： Sang Wook Park , Hyung Gil Baig
IPC分类号： H01L23/28 , H01L23/485 , H01L23/495 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/05 , H01L23/49517 , H01L2224/04042 , H01L2224/05599 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48599 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14
摘要： Disclosed herein is a packaged integrated circuit device having symmetrical structure to minimize package warpage and to prevent the formation of voids. The packaged integrated circuit device includes an integrated circuit chip having pads in the form of the respective grooves on its both sides opposite to each other. Each pad groove in the integrated circuit chip is formed such that it penetrates vertically the integrated circuit chip. The surface of each pad groove is coated with solder. A plurality of inner lead structures each including an inner lead and a stopper are inserted into the pad grooves and are electrically connected with the pads. In each of the inner lead structures, solder is coated on a surface of portion being in contact with the pads. Each inner lead has a plate shape and is inserted vertically into the respective pad grooves. Each stopper has a plate shape and is formed in the respective inner leads such that it is laid horizontally upon the upper surface of the integrated circuit chip to prevent the inner lead from breaking away from the pads. In one embodiment, on a top end of the respective inner leads is placed the top portion of each of the outer leads to be electrically connected to the respective inner leads, and each of the stoppers is formed at middle height portion of the respective inner leads.
摘要翻译：这里公开了具有对称结构的封装集成电路器件，以最小化封装翘曲并防止形成空隙。封装的集成电路器件包括集成电路芯片，其具有在彼此相对的两侧上的相应凹槽形式的焊盘。集成电路芯片中的每个焊盘槽形成为使得其垂直地穿透集成电路芯片。每个焊盘槽的表面涂覆有焊料。每个包括内部引线和止动件的内部引线结构被插入到所述焊盘槽中并且与所述焊盘电连接。在每个内部引线结构中，焊料涂覆在与焊盘接触的部分的表面上。每个内引线具有板形并且垂直地插入相应的焊盘槽中。每个止动件具有板形，并且形成在相应的内引线中，使得其水平地放置在集成电路芯片的上表面上，以防止内引线从焊盘断开。在一个实施例中，在各个内引线的顶端放置每个外引线的顶部电连接到相应的内引线，并且每个止动件形成在各内引线的中间高度部分。

24. 发明授权

US08765358B2 Water-soluble resin composition and method of forming fine patterns by using the same 失效
标题翻译：水溶性树脂组合物及使用其形成精细图案的方法
公开(公告)号：US08765358B2
公开(公告)日：2014-07-01
申请号：US13171623
申请日：2011-06-29
申请人： Sang Wook Park , So Jung Park , Dong-Chul Seo
发明人： Sang Wook Park , So Jung Park , Dong-Chul Seo
IPC分类号： G03F7/40 , G03F7/30 , G03F7/20 , C08F232/04 , C08F222/38
CPC分类号： G03F7/405 , C08F220/56 , C08F220/58 , C08F220/60 , C08F232/08 , C08F2220/281 , C08F2220/282
摘要： A water-soluble resin composition for forming fine patterns comprising water-soluble polymer represented by Chemical Formula 1 as below and the first water-soluble solvent, is coated and heated on a photoresist layer having at least one contact hole to reduce a size of the at least one contact hole. (In Chemical Formula 1, each of R1, R2, R3 and R5 independently represents an alkyl group of C1-30 or an cyclo alkyl group of C3-30 which respectively have one selected from the group consisting of hydrogen, an ether group, an ester group, a carbonyl group, an acetal, an epoxy group, a nitril group, an amine group, and an aldehyde group; each of R4, R6, R7 and R8 independently represents hydrogen or a methyl group; n represents an integer of 0 to 5; a represents a real number of 0.05 to 0.5; each of b, c and d respectively represents a real number of 0 to 0.7; and a+b+c+d=1).
摘要翻译：用于形成包含如下化学式1所示的水溶性聚合物的精细图案的水溶性树脂组合物和第一水溶性溶剂在具有至少一个接触孔的光致抗蚀剂层上被涂覆和加热，以减小至少一个接触孔。（在化学式1中，R1，R2，R3和R5各自独立地表示C1-30的烷基或C3-30的环烷基，其分别具有选自氢，醚基，酯基，羰基，缩醛，环氧基，腈基，胺基和醛基; R 4，R 6，R 7和R 8各自独立地表示氢或甲基; n表示0 至5; a表示0.05至0.5的实数; b，c和d分别表示0至0.7的实数; a + b + c + d = 1）。

25. 发明授权

US08704991B2 Liquid crystal display device capable of compensatng for a resistance variation in a link unit 有权
标题翻译：液晶显示装置能补偿连杆单元的电阻变化
公开(公告)号：US08704991B2
公开(公告)日：2014-04-22
申请号：US11444152
申请日：2006-05-30
申请人： Sung Soo Chang , Hyung Beom Shin , Sang Wook Park
发明人： Sung Soo Chang , Hyung Beom Shin , Sang Wook Park
IPC分类号： G02F1/1333 , G02F1/1343 , G02F1/1345
CPC分类号： G02F1/1345
摘要： Provided is an LCD capable of compensating for a resistance variation in a link unit. The resistance variations in the gate lines, data lines and common lines are reduced to minimize the signal distortion in the LCD. Accordingly, it is possible to enhance the image quality characteristics of the LCD. The resistance variation can be reduced by adjusting the number or the size of contact holes in the link unit.
摘要翻译：提供了能够补偿链路单元中的电阻变化的LCD。减少栅极线，数据线和公共线中的电阻变化，以最小化LCD中的信号失真。因此，可以提高LCD的图像质量特性。可以通过调整连杆单元中接触孔的数量或尺寸来减小电阻变化。

26. 发明申请

US20130072187A1 DUAL MODE COMMUNICATIONS DEVICE AND METHOD OF IMPROVING DATA RATE THEREOF 失效
标题翻译：双模通信设备及其提高数据速率的方法
公开(公告)号：US20130072187A1
公开(公告)日：2013-03-21
申请号：US13331887
申请日：2011-12-20
申请人： Chul Hwan YOON , Seong Geun Kim , Youn Suk Kim , Sung Jae Yoon , Jae Hyouck Choi , Dae Seok Jang , Sang Wook Park
发明人： Chul Hwan YOON , Seong Geun Kim , Youn Suk Kim , Sung Jae Yoon , Jae Hyouck Choi , Dae Seok Jang , Sang Wook Park
IPC分类号： H04W88/06 , H04W4/00
CPC分类号： H04B1/401 , H04B1/0067 , H04W88/06
摘要： There are provided a dual mode communications device and a method of improving a data rate thereof. The dual mode communications device according to the embodiment of the present invention may include a selection unit 100 connecting antenna terminals to receive terminals or transmit terminals, a receive path circuit unit allowing RF receive signals from each of the first and second antennas to pass therethrough, a transmit path circuit unit providing RF transmit signals to the transmit terminals of the selection unit, an RF circuit unit converting the RF receive signals from the receive path circuit unit into baseband signals and converting the baseband signals to be transmitted into the RF transmit signals, and a baseband circuit unit performing control and signal processing of the selection unit in a single communications mode among a dual mode and a single mode.
摘要翻译：提供了双模式通信设备和提高其数据速率的方法。根据本发明实施例的双模式通信设备可以包括将天线终端连接到接收终端或发射终端的选择单元100，允许来自第一和第二天线中的每一个的RF接收信号的接收路径电路单元通过，发送路径电路单元，向所述选择单元的发送端提供RF发送信号; RF电路单元，将来自所述接收路径电路单元的RF接收信号变换为基带信号，并将要发送的基带信号变换为所述RF发送信号; 以及基带电路单元，在双模和单模中以单通信模式进行所述选择单元的控制和信号处理。

27. 发明申请

US20130016361A1 STAGE APPARATUS 审中-公开
标题翻译：阶段装置
公开(公告)号：US20130016361A1
公开(公告)日：2013-01-17
申请号：US13547387
申请日：2012-07-12
申请人： Sang Wook Park , In Bae Jang , Sang Don Jang , Oui Serg Kim
发明人： Sang Wook Park , In Bae Jang , Sang Don Jang , Oui Serg Kim
IPC分类号： G01B11/14
CPC分类号： G01B5/0004 , G01B11/002
摘要： The stage apparatus includes a stage having a range of movement on a stage base, an interferometer and a fixed mirror that are installed outside the stage on the stage base, and a first movable mirror disposed on the stage to reflect light, which is introduced from the interferometer, toward the fixed mirror, and to reflect the light, which is received after being reflected by the fixed mirror, to the interferometer.
摘要翻译：舞台装置包括：舞台基座上的移动范围，安装在舞台基座的舞台外部的干涉仪和固定镜;以及设置在舞台上以反射光的第一可移动镜，其从干涉仪朝向固定镜，并且将被固定镜反射后接收的光反射到干涉仪。

28. 发明申请

US20120234497A1 DEBONDER TO MANUFACTURE SEMICONDUCTOR AND DEBONDING METHOD THEREOF 审中-公开
标题翻译：制造半导体的制约因素及其制约方法
公开(公告)号：US20120234497A1
公开(公告)日：2012-09-20
申请号：US13418795
申请日：2012-03-13
申请人： Il Young Han , Ho Geon Song , Sang Wook Park , Ji-Seok Hong
发明人： Il Young Han , Ho Geon Song , Sang Wook Park , Ji-Seok Hong
IPC分类号： B32B38/10
CPC分类号： H01L21/67092 , H01L21/6835 , H01L24/16 , H01L24/32 , H01L24/73 , H01L24/799 , H01L24/94 , H01L24/96 , H01L24/98 , H01L25/0652 , H01L2221/6834 , H01L2221/68372 , H01L2221/68381 , H01L2224/16145 , H01L2224/32145 , H01L2224/73204 , H01L2224/7999 , H01L2224/94 , H01L2225/06513 , H01L2225/06541 , H01L2225/06565 , H01L2924/01006 , H01L2924/01033 , H01L2924/12042 , H01L2924/14 , Y10T156/11 , Y10T156/19 , H01L2224/81 , H01L2924/00
摘要： A debonder to manufacture a semiconductor that includes: a stage to support a carrier wafer that is attached to a chip stack assembly by a temporary adhesive layer coated on the surface of the carrier wafer; a chuck arranged above the stage to selectively secure the chip stack assembly; a lifting unit to lift the chuck from the stage; a lateral driving unit to move the chuck laterally with respect to the stage; and a controller to control the lifting unit and the lateral driving unit.
摘要翻译：一种制造半导体的剥离器，包括：支撑通过涂覆在载体晶片的表面上的临时粘合剂层附着到芯片堆叠组件的载体晶片的载物台; 卡盘，布置在平台上方以选择性地固定芯片堆叠组件; 提升装置，用于将卡盘从舞台上抬起; 横向驱动单元，用于相对于所述平台横向移动所述卡盘; 以及控制器，用于控制提升单元和横向驱动单元。

29. 发明授权

US07968670B2 Polyimide resin and liquid crystal alignment layer and polyimide film using the same 有权
标题翻译：聚酰亚胺树脂和液晶取向层及使用其的聚酰亚胺膜
公开(公告)号：US07968670B2
公开(公告)日：2011-06-28
申请号：US12517972
申请日：2007-12-13
申请人： Hak Gee Jung , Sang Wook Park , Hyo Jun Park
发明人： Hak Gee Jung , Sang Wook Park , Hyo Jun Park
IPC分类号： C08G63/00 , C08G63/02
CPC分类号： C08G73/1039 , C08G73/1042 , C08G73/1067 , G02F1/133723 , Y10T428/1023
摘要： Disclosed is a polyimide resin, which is colorless and transparent and has superior properties, including mechanical properties and heat stability, and thus is usable in various fields, including semiconductor insulating films, TFT-LCD insulating films, transparent electrode films, passivation films, liquid crystal alignment layers, optical communication materials, protective films for solar cells, and flexible display substrates. Also, a liquid crystal alignment layer and a polyimide film using the polyimide resin are provided.
摘要翻译：公开了一种无色透明的聚酰亚胺树脂，具有机械性能和热稳定性等优异性能，因此可用于各种领域，包括半导体绝缘膜，TFT-LCD绝缘膜，透明电极膜，钝化膜，液体晶体取向层，光通信材料，太阳能电池用保护膜和柔性显示基板。此外，提供了使用聚酰亚胺树脂的液晶取向层和聚酰亚胺膜。

30. 发明申请

US20100062711A1 BLUETOOTH DEVICE AND METHOD OF SEARCHING FOR PERIPHERAL BLUETOOTH DEVICE 有权
标题翻译：蓝牙设备和外围蓝牙设备的搜索方法
公开(公告)号：US20100062711A1
公开(公告)日：2010-03-11
申请号：US12546116
申请日：2009-08-24
申请人： Sang Wook Park
发明人： Sang Wook Park
IPC分类号： H04B7/00
CPC分类号： H04W8/005
摘要： A Bluetooth device and a method of searching for a peripheral Bluetooth device using a previous search results are provided. The method of searching for a peripheral Bluetooth device includes: acquiring, if input instructing the start of an initial search is received, initial search address information and initial search device information about at least one peripheral Bluetooth device in a preset period; storing the acquired initial search address information and initial search device information in a storage unit; acquiring, if a request for searching for a peripheral device for performing Bluetooth communication is input, address information of a found peripheral Bluetooth device; determining whether address information corresponding to the acquired address information of the found peripheral Bluetooth device exists in the storage unit; and notifying a user, if address information corresponding to the acquired address information of the found peripheral Bluetooth device exists in the storage unit, of the stored initial search device information of the found peripheral device corresponding to the address information.
摘要翻译：提供了使用先前搜索结果来搜索外围蓝牙设备的蓝牙设备和方法。搜索外围蓝牙装置的方法包括：如果接收到指示开始初始搜索的输入，则在预设时段内获取关于至少一个外围蓝牙装置的初始搜索地址信息和初始搜索装置信息; 将所获取的初始搜索地址信息和初始搜索设备信息存储在存储单元中; 如果输入了用于搜索用于执行蓝牙通信的外围设备的请求，则获取所找到的外围蓝牙设备的地址信息; 确定与所获取的所找到的外围蓝牙装置的地址信息相对应的地址信息是否存在于存储单元中; 并且如果在存储单元中存在与所获取的外围设备蓝牙装置的所获取的地址信息相对应的地址信息，则通知给用户对应于所述地址信息的所找到的外围设备的所存储的初始搜索设备信息。

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