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21. 发明申请

US20060059684A1 Method of manufacturing a heat dissipating device 失效
公开(公告)号：US20060059684A1
公开(公告)日：2006-03-23
申请号：US11069743
申请日：2005-03-01
申请人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Chi Liang
发明人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Chi Liang
IPC分类号： B23P15/26 , B21D53/06
CPC分类号： B23K1/0012 , B23K2101/06 , B23K2101/14 , B23P2700/10 , F28D15/0275 , H01L21/4882 , H01L23/427 , H01L2924/0002 , Y10T29/49353 , Y10T29/49368 , Y10T29/49369 , Y10T29/49373 , Y10T29/49377 , Y10T29/49378 , Y10T29/49393 , H01L2924/00
摘要： A method of manufacturing a heat dissipating device, the method includes steps: a) affording a heat pipe, a solid solder bar and a heat sink, wherein the heat sink includes a base defining a groove at a side thereof; b) placing the solder bar and the heat pipe, in turn, into the groove of the heat sink; c) heating to melt the solder bar and simultaneously pressing the heat pipe to have an outer surface of the heat pipe coplanar with said side where the groove is defined; and d) cooling to achieve the heat dissipating device wherein the solder bar is evenly distributed between the heat pipe and the base.

22. 发明申请

US20050201064A1 Locking device for heat dissipating device 失效
标题翻译：散热装置锁紧装置
公开(公告)号：US20050201064A1
公开(公告)日：2005-09-15
申请号：US10930550
申请日：2004-08-31
申请人： Chun-Chi Chen , Shi-Wen Zhou , Hsieh-Kun Lee
发明人： Chun-Chi Chen , Shi-Wen Zhou , Hsieh-Kun Lee
IPC分类号： H01L23/32 , H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , Y10T24/42 , Y10T24/44026 , H01L2924/00
摘要： A locking device for mounting a heat sink to a CPU mounted on a printed circuit board, includes a first locking member extending the heat sink and the circuit board and having a block for pressing the heat sink, an operating member pivotably connected to the first locking member, a second locking member extending the heat sink and the circuit board and pivotably connected to the operating member, and an actuating structure formed between the first and second locking members. The first and second locking members each includes a hook located below the circuit board. The operating member is pivotable about the first locking member to drive the second locking member to move upwardly and to cause the actuating structure to simultaneously drive the first and second locking members to move away from each other, whereby the hooks engage below the circuit board.
摘要翻译：一种用于将散热器安装到安装在印刷电路板上的CPU的锁定装置，包括延伸散热器和电路板并具有用于按压散热器的块的第一锁定构件，可枢转地连接到第一锁定件的操作构件构件，延伸所述散热器和所述电路板并可枢转地连接到所述操作构件的第二锁定构件，以及形成在所述第一和第二锁定构件之间的致动结构。第一和第二锁定构件各自包括位于电路板下方的钩。操作构件可围绕第一锁定构件枢转以驱动第二锁定构件向上移动，并且使致动构件同时驱动第一和第二锁定构件以彼此远离地移动，由此钩接合在电路板下方。

23. 发明申请

US20050135064A1 Locking device for heat dissipating device 失效
标题翻译：散热装置锁紧装置
公开(公告)号：US20050135064A1
公开(公告)日：2005-06-23
申请号：US10892796
申请日：2004-07-16
申请人： Chun-Chi Chen , Shi-Wen Zhou , Hsieh-Kun Lee
发明人： Chun-Chi Chen , Shi-Wen Zhou , Hsieh-Kun Lee
IPC分类号： H01L23/34 , H01L23/40 , H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , Y10T24/42 , H01L2924/00
摘要： A locking device for mounting a heat sink to a CPU mounted on a printed circuit board, includes a back plate mounted below the circuit board and having a plurality of fasteners extending upwardly beyond the circuit board, and a plurality of retainers. Each retainer includes an operating member resting on a heat sink, a locking member extending through the operating member, and a pushing member extending through the locking member. The locking member includes a locking structure extending through the heat sink to engage with one of the fasteners. The pushing member includes a taper bottom portion. The pushing member is downward movable to cause the taper bottom portion to disengage the locking structure from the one of the fasteners.
摘要翻译：用于将散热器安装到安装在印刷电路板上的CPU的锁定装置包括安装在电路板下方并具有向上延伸超过电路板的多个紧固件的背板和多个保持器。每个保持器包括搁置在散热器上的操作构件，延伸穿过操作构件的锁定构件和延伸穿过锁定构件的推动构件。锁定构件包括延伸穿过散热器以与其中一个紧固件接合的锁定结构。推动构件包括锥形底部。推动构件向下移动以使得锥形底部部分将锁定结构与其中一个紧固件分离。

24. 发明授权

US08365810B2 Active heat sink for use with electronic device 失效
标题翻译：主动散热器，用于电子设备
公开(公告)号：US08365810B2
公开(公告)日：2013-02-05
申请号：US12496653
申请日：2009-07-02
申请人： Shou-Biao Xu , Shi-Wen Zhou , Chun-Chi Chen
发明人： Shou-Biao Xu , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： F28D15/02
CPC分类号： H01L23/427 , F28D15/0208 , F28D15/0275 , F28F1/34 , F28F13/125 , F28F2215/00 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat sink includes a heat conducting base, a heat conducting shaft thermally connected to and rotating with respect to the base, and a plurality of fins. The shaft includes a heat absorbing section thermally connected to the base and a heat dissipating section connected with the heat absorbing section. The fins are disposed on the heat dissipating section of the shaft.
摘要翻译：散热器包括导热基座，热连接并相对于基座旋转的导热轴和多个翅片。轴包括热连接到基座的热吸收部分和与吸热部分连接的散热部分。翅片设置在轴的散热部分上。

25. 发明授权

US08296947B2 Heat sink and method of manufacturing the same 有权
标题翻译：散热器及其制造方法
公开(公告)号：US08296947B2
公开(公告)日：2012-10-30
申请号：US12506213
申请日：2009-07-20
申请人： Peng Liu , Guo Chen , Shi-Wen Zhou , Chun-Chi Chen
发明人： Peng Liu , Guo Chen , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： B21D53/02 , H05K7/20
CPC分类号： B21D53/085 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A heat sink includes a base with a plurality of recesses defined therein, a plurality of columned fins each having a head and a body extending from the head, and a cover joining with the base. Each head is received in and higher than a corresponding recess of the base. The heads are sandwiched between the cover and the base, whereby the columned fins are secured on the base. A portion of the cover contacting the head of each of the columned fins protrudes to form a deformed part. A method of manufacturing the heat sink is also disclosed.
摘要翻译：散热器包括：基部，其具有限定在其中的多个凹部;多个柱状散热片，各自具有从头部延伸的头部和主体;以及与基部接合的盖。每个头部被接收在基座的相应凹部中并且高于基座的相应凹部。头部被夹在盖和基座之间，由此将柱状翅片固定在基座上。接触每个柱状翅片的头部的盖的一部分突出以形成变形部分。还公开了一种制造散热器的方法。

26. 发明授权

US08220527B2 Heat dissipation device with heat pipe 有权
标题翻译：散热装置带热管
公开(公告)号：US08220527B2
公开(公告)日：2012-07-17
申请号：US12056295
申请日：2008-03-27
申请人： Peng Liu , Shi-Wen Zhou , Chun-Chi Chen , Yi-Jiun Li
发明人： Peng Liu , Shi-Wen Zhou , Chun-Chi Chen , Yi-Jiun Li
IPC分类号： F28D15/02
CPC分类号： F28D15/0233
摘要： A heat dissipation device includes a heat spreader for thermally engaging with a heat generating electronic device, a heat sink assembly located above the heat spreader, and first and second heat pipes connecting with the heat spreader and the heat sink assembly. Each of the first and second heat pipes comprises an evaporation section engaged in the heat spreader, two arc-shaped condensation sections thermally inserted in the heat sink assembly, and two connecting sections interconnecting corresponding condensation sections and the evaporation section. The condensation sections are coplanar with each other and located in a same circle. The condensation sections of the first heat pipe extend in a clockwise direction, while the condensation sections of the second heat pipe extend in an anticlockwise direction.
摘要翻译：散热装置包括用于与发热电子设备热接合的散热器，位于散热器上方的散热器组件，以及与散热器和散热器组件连接的第一和第二热管。第一和第二热管中的每一个包括接合在散热器中的蒸发部分，热插入散热器组件中的两个弧形冷凝部分和互连相应的冷凝部分和蒸发部分的两个连接部分。冷凝段彼此共面并且位于同一个圆中。第一热管的冷凝部沿顺时针方向延伸，第二热管的冷凝部沿逆时针方向延伸。

27. 发明授权

US08047266B2 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US08047266B2
公开(公告)日：2011-11-01
申请号：US12138439
申请日：2008-06-13
申请人： Shi-Wen Zhou , Jun Cao , Wei-Ping Gong
发明人： Shi-Wen Zhou , Jun Cao , Wei-Ping Gong
IPC分类号： F28F7/00 , H05K7/20
CPC分类号： H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a first heat sink, a second heat sink located on the first heat sink, a third heat sink located on the second heat sink, and a heat conducting member formed by bending a flat, plate-like member and connecting the first, second and third heat sinks. The heat conducting member includes a heat absorbing section contacting with the first heat sink, and first and second heat dissipating sections extending inwards from upper ends of first and second connecting sections extending upwardly from two ends of the heat absorbing section, respectively. The first heat dissipating section is sandwiched between the first and second heat sinks, and the second heat dissipating section is sandwiched between the second and third heat sinks. A width of the first and second heat dissipating sections is identical to that of the second heat sink.
摘要翻译：一种散热装置，包括第一散热器，位于第一散热器上的第二散热器，位于第二散热器上的第三散热器，以及通过弯曲平板状部件而形成的导热部件，第一，第二和第三散热片。导热构件包括与第一散热器接触的吸热部分，以及分别从吸热部分的两端向上延伸的第一和第二连接部分的上端向内延伸的第一和第二散热部分。第一散热部分夹在第一和第二散热片之间，第二散热部分夹在第二和第三散热片之间。第一和第二散热部分的宽度与第二散热器的宽度相同。

28. 发明授权

US07990719B2 Electronic system with heat dissipation device 有权
标题翻译：具有散热装置的电子系统
公开(公告)号：US07990719B2
公开(公告)日：2011-08-02
申请号：US12610388
申请日：2009-11-02
申请人： Guo Chen , Shi-Wen Zhou , Chun-Chi Chen
发明人： Guo Chen , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： H05K7/20 , G06F1/20
CPC分类号： H05K7/20154
摘要： A heat dissipation device is provided for dissipating heat generated by electronic components mounted on a printed circuit board in an electronic system. The electronic components have different heights. The heat dissipation device includes a connecting plate, at least two elastic members mounted on the connecting plate, and a heat sink having a substrate mounted on the connecting plate and located above one of the electronic components. A number of joining members extend through the printed circuit board and engage with the substrate to attach the substrate on the one electronic component on the printed circuit board. A distance between the substrate and the connecting plate is adjustable by adjusting the joining members to make the substrate intimately contact the one electronic component.
摘要翻译：散热装置用于散发电子系统中安装在印刷电路板上的电子元件产生的热量。电子元件具有不同的高度。所述散热装置包括连接板，安装在所述连接板上的至少两个弹性部件和散热器，所述散热器具有安装在所述连接板上且位于所述电子部件之一上方的基板。多个接合构件延伸穿过印刷电路板并与衬底接合以将衬底附着在印刷电路板上的一个电子部件上。基板和连接板之间的距离可通过调节连接部件来调节，以使基板与一个电子部件紧密接触。

29. 发明授权

US07866375B2 Heat dissipation device with heat pipes 有权
标题翻译：带热管的散热装置
公开(公告)号：US07866375B2
公开(公告)日：2011-01-11
申请号：US11566003
申请日：2006-12-01
申请人： Shi-Wen Zhou , Chun-Chi Chen , Bao-Chun Chen
发明人： Shi-Wen Zhou , Chun-Chi Chen , Bao-Chun Chen
IPC分类号： F28D15/00 , F28F7/00 , H01L23/24 , H05K7/20
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/0275 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a base (10), a plurality of fins (20), first and second heat pipes (30), (40), a fan holder (50) and a fan (60) secured to the fan holder. The first heat pipe includes a heat-receiving section (32) and two heat-discharging sections (34). The second heat pipe includes an evaporating portion (42) and two condensing portions (44). The condensing portions of the second heat pipe extend into the fins and are disposed adjacent to opposite ends of each of the fins. One heat-discharging section extends in the fins and is disposed between the condensing portions, thus allowing heat absorbed from the base to be evenly distributed throughout the fins by the heat-discharging sections and the condensing portions.
摘要翻译：一种散热装置，包括底座（10），多个翅片（20），第一和第二热管（30），（40），风扇架（50）和固定到风扇架的风扇（60）。第一热管包括受热部（32）和两个散热部（34）。第二热管包括蒸发部分（42）和两个冷凝部分（44）。第二热管的冷凝部分延伸到翅片中并且与每个翅片的相对端相邻设置。一个放热部分在翅片中延伸并且设置在冷凝部分之间，从而允许从基座吸收的热量通过散热部分和冷凝部分均匀分布在整个翅片上。

30. 发明授权

US07779895B2 Protective device for protecting thermal interface material and fasteners of heat dissipation device 有权
标题翻译：用于保护散热装置的热界面材料和紧固件的保护装置
公开(公告)号：US07779895B2
公开(公告)日：2010-08-24
申请号：US12102016
申请日：2008-04-14
申请人： Shi-Wen Zhou , Jun Cao , Qing-Song Xu
发明人： Shi-Wen Zhou , Jun Cao , Qing-Song Xu
IPC分类号： F28F7/00
CPC分类号： F28D15/0275 , F28F2265/02 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device assembly includes a heat dissipation device for dissipating heat from an electronic element and a protective device assembly. The heat dissipation device includes a base with fasteners extending therethrough, a plurality of fins arranged on a top of the base, and a heat conducting plate attached on a bottom of the base. A thermal interface material is spread on a bottom surface of the heat conducting plate. The protective device assembly includes a first cover attached to a bottom of the heat conducting plate and a second cover separated from the first cover and attached to a lateral side of the base. The first cover protects the thermal interface material from being contaminated and the second cover protects the fasteners from dropping from the base, when the heat dissipation device is transported.
摘要翻译：散热装置组件包括用于从电子元件散发热量的散热装置和保护装置组件。所述散热装置包括具有贯穿其中的紧固件的基座，布置在所述基座的顶部上的多个翅片以及附接在所述基座的底部上的导热板。热界面材料散布在导热板的底表面上。保护装置组件包括附接到导热板的底部的第一盖和与第一盖分离并连接到基部的侧面的第二盖。当散热装置运输时，第一盖保护热界面材料免受污染，并且第二盖保护紧固件免于从基座掉落。

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