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1. 发明授权

US08047266B2 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US08047266B2
公开(公告)日：2011-11-01
申请号：US12138439
申请日：2008-06-13
申请人： Shi-Wen Zhou , Jun Cao , Wei-Ping Gong
发明人： Shi-Wen Zhou , Jun Cao , Wei-Ping Gong
IPC分类号： F28F7/00 , H05K7/20
CPC分类号： H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a first heat sink, a second heat sink located on the first heat sink, a third heat sink located on the second heat sink, and a heat conducting member formed by bending a flat, plate-like member and connecting the first, second and third heat sinks. The heat conducting member includes a heat absorbing section contacting with the first heat sink, and first and second heat dissipating sections extending inwards from upper ends of first and second connecting sections extending upwardly from two ends of the heat absorbing section, respectively. The first heat dissipating section is sandwiched between the first and second heat sinks, and the second heat dissipating section is sandwiched between the second and third heat sinks. A width of the first and second heat dissipating sections is identical to that of the second heat sink.
摘要翻译：一种散热装置，包括第一散热器，位于第一散热器上的第二散热器，位于第二散热器上的第三散热器，以及通过弯曲平板状部件而形成的导热部件，第一，第二和第三散热片。导热构件包括与第一散热器接触的吸热部分，以及分别从吸热部分的两端向上延伸的第一和第二连接部分的上端向内延伸的第一和第二散热部分。第一散热部分夹在第一和第二散热片之间，第二散热部分夹在第二和第三散热片之间。第一和第二散热部分的宽度与第二散热器的宽度相同。

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