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21. 发明申请

US20080006617A1 THERMAL WAFER PROCESSOR 失效
标题翻译：热处理器
公开(公告)号：US20080006617A1
公开(公告)日：2008-01-10
申请号：US11428742
申请日：2006-07-05
申请人： Randy A. Harris , Gregory J. Wilson , Paul R. McHugh
发明人： Randy A. Harris , Gregory J. Wilson , Paul R. McHugh
IPC分类号： F27B5/14
CPC分类号： F27B17/0025 , H01L21/67109 , H01L21/6719
摘要： A thermal processor may include a cooling jacket positionable around a process chamber within a process vessel or jar. A heater can move into a position substantially between the process chamber vessel and the cooling jacket. A holder having multiple workpiece holding positions is provided for holding a batch or workpieces or wafers. The process chamber vessel is moveable to a position where it substantially encloses the holder, so that wafers in the holder may be processed in a controlled environment. A cooling shroud may be provided to absorb heat from the heater before or after thermal processing. The thermal processor is compact and thermally shielded, and may be used in an automated processing system having other types of processors.
摘要翻译：热处理器可以包括可在处理容器或罐内的处理室周围定位的冷却套。加热器可以进入基本上处理室容器和冷却套之间的位置。提供具有多个工件保持位置的保持器，用于保持批次或工件或晶片。处理室容器可移动到其基本上包围保持器的位置，使得保持器中的晶片可以在受控环境中进行处理。可以提供冷却罩以在热处理之前或之后从加热器吸收热量。热处理器是紧凑的和热屏蔽的，并且可以用于具有其他类型的处理器的自动处理系统中。

22. 发明申请

US20080003781A1 ELECTRO-CHEMICAL PROCESSOR 有权
标题翻译：电化学处理器
公开(公告)号：US20080003781A1
公开(公告)日：2008-01-03
申请号：US11608151
申请日：2006-12-07
申请人： Daniel J. Woodruff , Paul R. McHugh , Gregory J. Wilson , Kyle M. Hanson , Nigel Stewart , Erik Lund , Steven L. Peace
发明人： Daniel J. Woodruff , Paul R. McHugh , Gregory J. Wilson , Kyle M. Hanson , Nigel Stewart , Erik Lund , Steven L. Peace
IPC分类号： H01L21/326
CPC分类号： C25D17/001 , C25D17/004
摘要： A processor for making porous silicon or processing other substrates has first and second chamber assemblies. The first and second chamber assemblies include first and second seals for sealing against a wafer, and first and second electrodes, respectively. The first and/or second seal is moveable towards and away from a wafer in the processor, to move between a wafer load/unload position, and a wafer process position. The first electrode may move along with the first seal, and the second electrode may move along with the second seal. A light source shines light onto the first side of the wafer. The processor may be pivotable from a substantially horizontal orientation, for loading and unloading a wafer, to a substantially vertical orientation, for processing a wafer.
摘要翻译：用于制造多孔硅或处理其它衬底的处理器具有第一和第二室组件。第一和第二室组件包括分别用于密封晶片的第一和第二密封件以及第一和第二电极。第一和/或第二密封件可朝向和远离处理器中的晶片移动，以在晶片装载/卸载位置与晶片工艺位置之间移动。第一电极可以与第一密封件一起移动，并且第二电极可以与第二密封件一起移动。光源将光照射到晶片的第一面上。处理器可以从用于加载和卸载晶片的基本上水平的方向枢转到基本垂直的取向，用于处理晶片。

23. 发明授权

US07247223B2 Method and apparatus for controlling vessel characteristics, including shape and thieving current for processing microfeature workpieces 有权
标题翻译：用于控制容器特性的方法和装置，包括加工微型工件的形状和盗窃电流
公开(公告)号：US07247223B2
公开(公告)日：2007-07-24
申请号：US10426029
申请日：2003-04-28
申请人： Paul R. McHugh , Gregory J. Wilson , Kyle M. Hanson
发明人： Paul R. McHugh , Gregory J. Wilson , Kyle M. Hanson
IPC分类号： C25D17/02 , C25D7/12
CPC分类号： C25D21/12 , C25D5/18 , C25D7/123 , C25D17/001 , C25D17/007 , C25D17/02 , C25D17/10 , C25D17/12 , H01L21/6723
摘要： A method and apparatus for processing a microfeature workpiece. In one embodiment, the apparatus includes a support member configured to carry a microfeature workpiece at a workpiece plane, and a vessel positioned at least proximate to the support member. The vessel has a vessel surface facing toward the support member and positioned to carry a processing liquid. The vessel surface is shaped to provide an at least approximately uniform current density at the workpiece plane. At least one electrode, such as a thieving electrode, is disposed within the vessel. In a further aspect of this embodiment, the thieving electrode can be easily removable along with conductive material it attracts from the processing liquid. The shape of the vessel surface, the current supplied to the thieving electrode and/or the diameter of an aperture upstream of the workpiece are changed dynamically in other embodiments.
摘要翻译：一种用于处理微特征工件的方法和装置。在一个实施例中，该装置包括构造成在工件平面处承载微特征工件的支撑构件和至少靠近支撑构件定位的容器。容器具有面向支撑构件的容器表面并且定位成承载处理液体。容器表面成形为在工件平面处提供至少近似均匀的电流密度。至少一个电极，例如电极，设置在容器内。在该实施例的另一方面，该窃电电极可以容易地从其从处理液体吸引的导电材料移除。在其他实施例中，容器表面的形状，提供给电极的电流和/或工件上游的孔的直径被动态地改变。

24. 发明授权

US06569297B2 Workpiece processor having processing chamber with improved processing fluid flow 有权
公开(公告)号：US06569297B2
公开(公告)日：2003-05-27
申请号：US09804696
申请日：2001-03-12
申请人： Gregory J. Wilson , Paul R. McHugh , Kyle M. Hanson
发明人： Gregory J. Wilson , Paul R. McHugh , Kyle M. Hanson
IPC分类号： C25D1700
CPC分类号： C25D17/02 , C25D5/08 , C25D17/001 , Y10S204/07
摘要： A processing container (610) for providing a flow of a processing fluid during immersion processing of at least one surface of a microelectronic workpiece is set forth. The processing container comprises a principal fluid flow chamber (505) providing a flow of processing fluid to at least one surface of the workpiece and a plurality of nozzles (535) disposed to provide a flow of processing fluid to the principal fluid flow chamber. The plurality of nozzles are arranged and directed to provide vertical and radial fluid flow components that combine to generate a substantially uniform normal flow component radially across the surface of the workpiece. An exemplary apparatus using such a processing container is also set forth that is particularly adapted to carry out an electroplating process. In accordance with a further aspect of the present disclosure, an improved fluid removal path (640) is provided for removing fluid from a principal fluid flow chamber during immersion processing of a microelectronic workpiece.

25. 发明申请

US20120052204A1 WORKPIECE WETTING AND CLEANING 审中-公开
标题翻译：工作湿润和清洁
公开(公告)号：US20120052204A1
公开(公告)日：2012-03-01
申请号：US12873002
申请日：2010-08-31
申请人： Bryan Puch , Kyle M. Hanson , Marvin Bernt , Paul R. McHugh , Gregory J. Wilson
发明人： Bryan Puch , Kyle M. Hanson , Marvin Bernt , Paul R. McHugh , Gregory J. Wilson
IPC分类号： C23C16/56
CPC分类号： H01L21/6719 , H01L21/67057 , H01L21/67126
摘要： In a workpiece processor, a head is moveable onto a bowl to form a process chamber. A workpiece can be cleaned in the processor by immersing the workpiece into a liquid bath in the bowl and then boiling the liquid. Vacuum may be applied to the chamber to reduce the pressure within the chamber, thereby reducing the boiling temperature of the liquid and allowing processing at lower temperatures. In a separate method for prewetting a workpiece, a humid gas is provided into the process chamber and condenses on the workpiece. In another separate method for wetting a workpiece, liquid water is provided into the bowl, with the workpiece above the liquid water. Water vapor is created in the process chamber by applying vacuum to the process chamber. The vapor wets the workpiece. The workpiece is then further wetted by submerging the workpiece into the liquid water.
摘要翻译：在工件处理器中，头可移动到碗上以形成处理室。工件可以通过将工件浸入碗中的液体浴中，然后煮沸液体而在处理器中进行清洁。真空可以施加到室以减小室内的压力，从而降低液体的沸腾温度并允许在较低温度下进行加工。在用于预润湿工件的单独方法中，将湿气提供到处理室中并在工件上冷凝。在用于润湿工件的另一种分开的方法中，液体水被提供到碗中，工件在液态水上方。通过对处理室施加真空，在处理室中产生水蒸汽。蒸汽润湿工件。然后通过将工件浸入液体水中来进一步润湿工件。

26. 发明申请

US20110042224A1 APPARATUS AND METHODS FOR ELECTROCHEMICAL PROCESSING OF MICROFEATURE WAFERS 有权
标题翻译：微电子蒸汽电化学处理装置及方法
公开(公告)号：US20110042224A1
公开(公告)日：2011-02-24
申请号：US12917997
申请日：2010-11-02
申请人： Paul R. McHugh , Gregory J. Wilson , Daniel J. Woodruff
发明人： Paul R. McHugh , Gregory J. Wilson , Daniel J. Woodruff
IPC分类号： H01L21/02 , C25D5/02
CPC分类号： C25D7/12 , C25D7/123 , C25D17/001 , C25D17/10 , C25F3/30
摘要： Apparatus and methods for electrochemically processing microfeature wafers. The apparatus can have a vessel including a processing zone in which a microfeature wafer is positioned for electrochemical processing. The apparatus further includes at least one counter electrode in the vessel that can operate as an anode or a cathode depending upon the particular plating or electropolishing application. The apparatus further includes a supplementary electrode and a supplementary virtual electrode. The supplementary electrode is configured to operate independently from the counter electrode in the vessel, and it can be a thief electrode and/or a de-plating electrode depending upon the type of process. The supplementary electrode can further be used as another counter electrode during a portion of a plating cycle or polishing cycle. The supplementary virtual electrode is located in the processing zone, and it is configured to counteract an electric field offset relative to the wafer associated with an offset between the wafer and the counter electrode in the vessel when the wafer is in the processing zone.
摘要翻译：用于电化学处理微片的装置和方法。该装置可以具有容器，该容器包括处理区域，微处理区域定位用于电化学处理。该装置还包括容器中的至少一个对电极，其可以根据具体的电镀或电解抛光应用而作为阳极或阴极操作。该装置还包括辅助电极和辅助虚拟电极。辅助电极被配置为独立于容器中的对电极操作，并且其可以是根据工艺类型的小电极和/或去镀电极。在电镀循环或抛光循环的一部分期间，辅助电极可以进一步用作另一个对电极。辅助虚拟电极位于处理区域中，并且其被配置为当晶片处于处理区域时，相对于与晶片和对置电极之间的偏移相关联的晶片抵消相对于晶片的电场偏移。

27. 发明授权

US07842173B2 Apparatus and methods for electrochemical processing of microfeature wafers 有权
标题翻译：微晶片电化学处理的装置和方法
公开(公告)号：US07842173B2
公开(公告)日：2010-11-30
申请号：US11699768
申请日：2007-01-29
申请人： Paul R. McHugh , Gregory J. Wilson , Daniel J. Woodruff
发明人： Paul R. McHugh , Gregory J. Wilson , Daniel J. Woodruff
IPC分类号： C25B9/00
CPC分类号： C25D7/12 , C25D7/123 , C25D17/001 , C25D17/10 , C25F3/30
摘要： Apparatus and methods for electrochemically processing microfeature wafers. The apparatus can have a vessel including a processing zone in which a microfeature wafer is positioned for electrochemical processing. The apparatus further includes at least one counter electrode in the vessel that can operate as an anode or a cathode depending upon the particular plating or electropolishing application. The apparatus further includes a supplementary electrode and a supplementary virtual electrode. The supplementary electrode is configured to operate independently from the counter electrode in the vessel, and it can be a thief electrode and/or a de-plating electrode depending upon the type of process. The supplementary electrode can further be used as another counter electrode during a portion of a plating cycle or polishing cycle. The supplementary virtual electrode is located in the processing zone, and it is configured to counteract an electric field offset relative to the wafer associated with an offset between the wafer and the counter electrode in the vessel when the wafer is in the processing zone.
摘要翻译：用于电化学处理微片的装置和方法。该装置可以具有容器，该容器包括处理区域，微处理区域定位用于电化学处理。该装置还包括容器中的至少一个对电极，其可以根据具体的电镀或电解抛光应用而作为阳极或阴极操作。该装置还包括辅助电极和辅助虚拟电极。辅助电极被配置为独立于容器中的对电极操作，并且其可以是根据工艺类型的小电极和/或去镀电极。在电镀循环或抛光循环的一部分期间，辅助电极可以进一步用作另一个对电极。辅助虚拟电极位于处理区域中，并且其被配置为当晶片处于处理区域时，相对于与晶片和对置电极之间的偏移相关联的晶片抵消相对于晶片的电场偏移。

28. 发明授权

US07566386B2 System for electrochemically processing a workpiece 有权
公开(公告)号：US07566386B2
公开(公告)日：2009-07-28
申请号：US10975154
申请日：2004-10-28
申请人： Gregory J. Wilson , Paul R. McHugh , Kyle M. Hanson
发明人： Gregory J. Wilson , Paul R. McHugh , Kyle M. Hanson
IPC分类号： C25D17/02 , C25F7/00 , C25D7/12
CPC分类号： C25D17/02 , C25D5/08 , C25D17/001 , Y10S204/07
摘要： A reactor for electrochemically processing at least one surface of a microelectronic workpiece is set forth. The reactor comprises a reactor head including a workpiece support that has one or more electrical contacts positioned to make electrical contact with the microelectronic workpiece. The reactor also includes a processing container having a plurality of nozzles angularly disposed in a sidewall of a principal fluid flow chamber at a level within the principal fluid flow chamber below a surface of a bath of processing fluid normally contained therein during electrochemical processing. A plurality of anodes are disposed at different elevations in the principal fluid flow chamber so as to place them at difference distances from a microelectronic workpiece under process without an intermediate diffuser between the plurality of anodes and the microelectronic workpiece under process. One or more of the plurality of anodes may be in close proximity to the workpiece under process. Still further, one or more of the plurality of anodes may be a virtual anode. The present invention also related to multi-level anode configurations within a principal fluid flow chamber and methods of using the same.

29. 发明授权

US07393439B2 Integrated microfeature workpiece processing tools with registration systems for paddle reactors 有权
标题翻译：集成的微型工件加工工具，具有桨式反应堆的配准系统
公开(公告)号：US07393439B2
公开(公告)日：2008-07-01
申请号：US10733807
申请日：2003-12-11
申请人： Paul R. McHugh , Gregory J. Wilson , Daniel J. Woodruff , Nolan Zimmerman , James J. Erickson
发明人： Paul R. McHugh , Gregory J. Wilson , Daniel J. Woodruff , Nolan Zimmerman , James J. Erickson
IPC分类号： C25D17/16 , C25B9/18 , C25C7/00
CPC分类号： C25D17/001 , C25D17/02 , C25D21/10
摘要： Tools having mounting modules with registration systems are disclosed. The mounting module includes positioning elements for precisely locating a processing chamber and a transport system that moves workpieces to and from the processing chamber. The relative positions between positioning elements of the module are fixed so that the transport system does not need to be recalibrated when the processing chamber is removed and replaced with another processing chamber. The processing chamber includes a paddle device for agitating processing liquid at a process surface of the workpiece. The paddle device, the processing chamber, and electrodes within the processing chamber are configured to reduce the likelihood for electrical shadowing created by the paddles at the surface of the workpiece, and to account for three-dimensional effects on the electrical field as the paddles reciprocate relative to the workpiece.
摘要翻译：公开了具有配准系统的安装模块的工具。安装模块包括用于精确定位处理室的定位元件和将工件移至和离开处理室的输送系统。模块的定位元件之间的相对位置是固定的，使得当处理室被移除并被另一处理室更换时，输送系统不需要重新校准。处理室包括用于在工件的处理表面处搅拌处理液体的桨装置。处理室中的桨装置，处理室和电极被配置为减少由工件表面上的桨形成的电阴影的可能性，并且当桨叶往复运动时考虑对电场的三维效应相对于工件。

30. 发明授权

US07371998B2 Thermal wafer processor 失效
标题翻译：热晶片处理器
公开(公告)号：US07371998B2
公开(公告)日：2008-05-13
申请号：US11428742
申请日：2006-07-05
申请人： Randy A. Harris , Gregory J. Wilson , Paul R. McHugh
发明人： Randy A. Harris , Gregory J. Wilson , Paul R. McHugh
IPC分类号： F27B5/04 , F27B5/14 , F27B11/02 , F27D3/12 , F27D1/12
CPC分类号： F27B17/0025 , H01L21/67109 , H01L21/6719
摘要： A thermal processor may include a cooling jacket positionable around a process chamber within a process vessel or jar. A heater can move into a position substantially between the process chamber vessel and the cooling jacket. A holder having multiple workpiece holding positions is provided for holding a batch or workpieces or wafers. The process chamber vessel is moveable to a position where it substantially encloses the holder, so that wafers in the holder may be processed in a controlled environment. A cooling shroud may be provided to absorb heat from the heater before or after thermal processing. The thermal processor is compact and thermally shielded, and may be used in an automated processing system having other types of processors.
摘要翻译：热处理器可以包括可在处理容器或罐内的处理室周围定位的冷却套。加热器可以进入基本上处理室容器和冷却套之间的位置。提供具有多个工件保持位置的保持器，用于保持批次或工件或晶片。处理室容器可移动到其基本上包围保持器的位置，使得保持器中的晶片可以在受控环境中进行处理。可以提供冷却罩以在热处理之前或之后从加热器吸收热量。热处理器是紧凑的和热屏蔽的，并且可以用于具有其他类型的处理器的自动处理系统中。

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