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21. 外观设计

USD418569S T-ball matt 失效
公开(公告)号：USD418569S
公开(公告)日：2000-01-04
申请号：US87903
申请日：1998-05-11
申请人： Tim Murphy
设计人： Tim Murphy

22. 发明授权

US5946327A Method and apparatus for converting between a multi-bit TDM bus and a single-bit TDM bus using digital logic 失效
标题翻译：用于使用数字逻辑在多位TDM总线和单位TDM总线之间转换的方法和装置
公开(公告)号：US5946327A
公开(公告)日：1999-08-31
申请号：US927372
申请日：1997-09-09
申请人： Tim Murphy
发明人： Tim Murphy
IPC分类号： H03M9/00 , H04J3/06
CPC分类号： H03M9/00
摘要： A system and method for converting data between a multi-bit time division multiplexed (TDM) bus and a faster single-bit TDM bus, wherein each TDM bus communicates data by means of frames, each frame comprising a fixed number of slots and each slot comprising a fixed number of bits, the system comprising digital circuitry for establishing a clock rate R.sub.SB for the faster single-bit TDM bus that has the following relationship to a clock rate R.sub.MB for the multi-bit TDM bus: R.sub.SB =R.sub.MB *((slots per frame)*(bits per slot)+1).div.(slots per frame).
摘要翻译：一种用于在多位时分复用（TDM）总线和更快单位TDM总线之间转换数据的系统和方法，其中每个TDM总线通过帧传送数据，每个帧包括固定数量的时隙和每个时隙包括固定数量的位，该系统包括数字电路，用于建立与用于多位TDM总线的时钟速率RMB相关的更快单位TDM总线的时钟速率RSB：RSB = RMB *（（每帧插槽）*（每插槽位数）+1）DIVIDED（每帧插槽）。

23. 发明授权

US08338702B2 Sensor lead sealing and strain relief 有权
标题翻译：传感器引线密封和应变消除
公开(公告)号：US08338702B2
公开(公告)日：2012-12-25
申请号：US12724281
申请日：2010-03-15
申请人： Brian Engelbach , Robert J. Sparks , Tim Murphy , Jeffrey T. Norris , Michael Heston
发明人： Brian Engelbach , Robert J. Sparks , Tim Murphy , Jeffrey T. Norris , Michael Heston
IPC分类号： H05K5/00
CPC分类号： G01D11/245 , G01K1/08 , G01K1/14 , G01K2205/04 , H01B7/0045 , H01R13/533 , H01R2201/20 , H05K5/00 , Y10S248/906 , Y10T29/49002 , Y10T29/49174
摘要： A sensor system may include a wiring harness including at least one wire, a grommet, a nugget, a sensor, and a harness sleeve. The grommet may include at least one passageway configured to receive the wire. The nugget may include at least one terminal molded into the nugget and coupled to the wire. A mineral insulated cable may be coupled to the sensor and to the terminal. The harness sleeve may define at least one cavity configured to receive the nugget and at least a portion of the grommet. The harness sleeve may be coupled to the mineral insulated cable and may include a first crimp coupling the harness sleeve to the grommet. The exterior surface of the nugget may also include at least one radially disposed groove. The harness sleeve may also include a second crimp coupling the harness sleeve to the nugget, for example, about the radial groove. The first crimp may be configured to compress the grommet to provide a seal between the harness sleeve and the grommet and a seal between the grommet and the at least one wire of the harness wire. The second crimp and the molding of the terminal within the nugget may be configured to provide strain relief for the wiring harness.
摘要翻译：传感器系统可以包括线束，其包括至少一个线，索环，熔核，传感器和线束套。索环可以包括构造成接收线的至少一个通道。熔核可以包括至少一个模制在熔核中并连接到焊丝上的端子。矿物绝缘电缆可以耦合到传感器和终端。线束套筒可以限定至少一个被配置为接收熔核和至少一部分护环的空腔。线束套筒可以联接到矿物绝缘电缆，并且可以包括将线束套管连接到索环的第一压接。熔核的外表面还可以包括至少一个径向设置的凹槽。线束套筒还可以包括将线束套筒连接到熔核块的例如围绕径向凹槽的第二压接。第一卷曲可以构造成压缩索环，以在线束套筒和索环之间提供密封，并且在索环和线束线的至少一根线之间形成密封。熔核内的端子的第二压接和模制可以被配置为为线束提供应变消除。

24. 发明申请

US20110083897A1 ELECTRIC POWER TERMINAL FEED-THROUGH 审中-公开
标题翻译：电力终端进线
公开(公告)号：US20110083897A1
公开(公告)日：2011-04-14
申请号：US12992968
申请日：2009-05-19
申请人： Dieter Paterek , Mark Yiu Kong Tang , Glen Kwok , Gerald Ng , Tim Murphy , Ck Leung
发明人： Dieter Paterek , Mark Yiu Kong Tang , Glen Kwok , Gerald Ng , Tim Murphy , Ck Leung
IPC分类号： H02G3/18
CPC分类号： H02G3/22 , H01R13/521 , H01R13/5216
摘要： A power terminal feed-through includes a housing, at least one current conducting pin and a sealing glass hermetically sealing the at least one current conducting pin to the housing. The at least one current conducting pin defines a peripheral indentation in the surface of the current conducting pin. The sealing glass fills in the peripheral indentation when fused to both the current conducting pin and housing.
摘要翻译：电源端子馈通包括壳体，至少一个导电销和密封玻璃将至少一个导电销气密地密封到壳体。所述至少一个导电引脚限定了导电引脚表面中的外围凹陷。密封玻璃在融合到电流传导销和外壳时填充外围凹口。

25. 发明申请

US20100258329A1 Sensor Lead Sealing and Strain Relief 有权
标题翻译：传感器引线密封和应变消除
公开(公告)号：US20100258329A1
公开(公告)日：2010-10-14
申请号：US12724281
申请日：2010-03-15
申请人： Brian Engelbach , Robert J. Sparks , Tim Murphy , Jeffrey T. Norris , Michael Heston
发明人： Brian Engelbach , Robert J. Sparks , Tim Murphy , Jeffrey T. Norris , Michael Heston
IPC分类号： H05K5/00 , H02G3/00 , H05K13/00
CPC分类号： G01D11/245 , G01K1/08 , G01K1/14 , G01K2205/04 , H01B7/0045 , H01R13/533 , H01R2201/20 , H05K5/00 , Y10S248/906 , Y10T29/49002 , Y10T29/49174
摘要： A sensor system may comprise a wiring harness comprising at least one wire, a grommet, a nugget, a sensor, and a harness sleeve. The grommet may comprise at least one passageway configured to receive the wire. The nugget may comprise at least one terminal molded into the nugget and coupled to the wire. A mineral insulated cable may be coupled to the sensor and to the terminal. The harness sleeve may define at least one cavity configured to receive the nugget and at least a portion of the grommet. The harness sleeve may be coupled to the mineral insulated cable and may include a first crimp coupling the harness sleeve to the grommet. The exterior surface of the nugget may also include at least one radially disposed groove. The harness sleeve may also include a second crimp coupling the harness sleeve to the nugget, for example, about the radial groove. The first crimp may be configured to compress the grommet to provide a seal between the harness sleeve and the grommet and a seal between the grommet and the at least one wire of the harness wire. The second crimp and the molding of the terminal within the nugget may be configured to provide strain relief for the wiring harness.
摘要翻译：传感器系统可以包括线束，其包括至少一个线，索环，熔核，传感器和线束套。索环可以包括构造成接收线的至少一个通道。熔核可以包括至少一个模制在熔核中并连接到焊丝上的端子。矿物绝缘电缆可以耦合到传感器和终端。线束套筒可以限定至少一个被配置为接收熔核和至少一部分护环的空腔。线束套筒可以联接到矿物绝缘电缆，并且可以包括将线束套管连接到索环的第一压接。熔核的外表面还可以包括至少一个径向设置的凹槽。线束套筒还可以包括将线束套筒连接到熔核块的例如围绕径向凹槽的第二压接。第一卷曲可以构造成压缩索环，以在线束套筒和索环之间提供密封，并且在索环和线束线的至少一根线之间形成密封。熔核内的端子的第二压接和模制可以被配置为为线束提供应变消除。

26. 发明申请

US20050206012A1 Stress and force management techniques for a semiconductor die 审中-公开
标题翻译：半导体芯片的应力和力量管理技术
公开(公告)号：US20050206012A1
公开(公告)日：2005-09-22
申请号：US10801205
申请日：2004-03-16
申请人： Warren Farnworth , William Hiatt , Tim Murphy , John Caldwell , Michael Slaughter , David Hembree , Jamie Wanke
发明人： Warren Farnworth , William Hiatt , Tim Murphy , John Caldwell , Michael Slaughter , David Hembree , Jamie Wanke
IPC分类号： H01L21/56 , H01L23/48 , H01L23/485
CPC分类号： H01L24/06 , H01L21/563 , H01L24/16 , H01L24/48 , H01L24/73 , H01L2224/0401 , H01L2224/05554 , H01L2224/05599 , H01L2224/05624 , H01L2224/13099 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/484 , H01L2224/73203 , H01L2224/73257 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01028 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10162 , H01L2224/45099
摘要： Stress and force management techniques for a semiconductor die to help compensate for stress within the semiconductor die and to help compensate for forces applied to the semiconductor die to minimize damage thereto.
摘要翻译：用于半导体管芯的应力和力管理技术来帮助补偿半导体管芯内的应力，并帮助补偿施加到半导体管芯上的力以最小化对其的损害。

27. 发明授权

US06831301B2 Method and system for electrically coupling a chip to chip package 有权
标题翻译：用于电耦合芯片到芯片封装的方法和系统
公开(公告)号：US06831301B2
公开(公告)日：2004-12-14
申请号：US09978983
申请日：2001-10-15
申请人： Tim Murphy , Lee Gotcher
发明人： Tim Murphy , Lee Gotcher
IPC分类号： H01L2715
CPC分类号： H01L23/48 , H01L2924/0002 , H01L2924/00
摘要： A chip and a chip package can transmit information to each other by using a set of converters capable of communicating with each other through the emission and reception of electromagnetic signals. Both the chip and the chip package have at least one such converter physically disposed on them. Each converter is able to (1) convert received electromagnetic signals into electronic signals, which it then may relay to leads on the device on which it is disposed; and (2) receive electronic signals from leads on the device on which it is disposed and convert them into corresponding electromagnetic signals, which it may transmit to a corresponding converter on the other device. Not having a direct physical connection between the chip and the chip package decreases the inductive and capacitive effects commonly experienced with physical bonds.
摘要翻译：芯片和芯片封装可以通过使用能够通过发射和接收电磁信号彼此通信的一组转换器彼此传输信息。芯片和芯片封装都至少有一个这样的转换器物理地放置在它们上。每个转换器能够（1）将接收到的电磁信号转换成电子信号，然后它可以继续传输到其所在设备上的引线; 和（2）从其所在设备上的引线接收电子信号，并将其转换成相应的电磁信号，该电磁信号可以传输到另一个设备上的相应转换器。芯片和芯片封装之间没有直接的物理连接减少了物理键通常遇到的电感和电容效应。

28. 发明授权

US06690721B1 Method for asymmetric digital subscriber line modem recovery from insufficient transmit power 失效
标题翻译：不对称数字用户线路调制解调器从发射功率不足的方式恢复的方法
公开(公告)号：US06690721B1
公开(公告)日：2004-02-10
申请号：US09598618
申请日：2000-06-21
申请人： Tim Murphy , Martin Staszak , Richard Williams
发明人： Tim Murphy , Martin Staszak , Richard Williams
IPC分类号： H04B138
CPC分类号： H04L1/0003 , H04W52/48 , H04W52/50
摘要： A method for recovering from an excessive power cutback in a splitterless asymmetric digital subscriber line modem. The modem may apply a power cutback to enable simultaneous use of the modem and a telephone. The modem determines if the modem's power after the cutback is sufficient to support data communication with the central office. If the power is insufficient, the modem gradually reduces the power cutback, checks the sufficiency of the power again, and repeats this cycle. The modem repeats the cycle until the modem attains an acceptable transmit power where the power requirements for data transfer and noise reduction are balanced.
摘要翻译：一种用于从无分离器非对称数字用户线路调制解调器中的过度功率削减中恢复的方法。调制解调器可以应用功率限制来同时使用调制解调器和电话。调制解调器确定调制解调器在削减后的电源是否足以支持与中心局的数据通信。如果电源不足，调制解调器逐渐减少功耗，再次检查电源的充足性，重复此循环。调制解调器重复循环，直到调制解调器达到可接受的传输功率，其中数据传输和噪声降低的功率要求得到平衡。

29. 发明授权

US4397701A Method of making masks 失效
标题翻译：制作口罩的方法
公开(公告)号：US4397701A
公开(公告)日：1983-08-09
申请号：US236529
申请日：1981-02-20
申请人： Sander K. Johnson , Tim Murphy , Dean Hensley , Ronald Sallon
发明人： Sander K. Johnson , Tim Murphy , Dean Hensley , Ronald Sallon
IPC分类号： A41G7/00 , B32B31/22 , B32B33/00
CPC分类号： A41G7/00 , Y10S264/30 , Y10T156/1111
摘要： A method of making a mask which comprises molding a sculptable material, affixing the said molded material to a facial form to the desired contours of the mask, which contours are different than the contours of the form, applying wetted strips of plaster-impregnated gauze to the molded material, drying the wetted gauze to form a completed mask and removing the form from the mask. The finished mask may be coated with a coat of white glue and decorated.
摘要翻译：一种制作掩模的方法，其包括模制可雕刻材料，将所述模制材料贴合到面部形状到所述面罩的所需轮廓，所述轮廓与所述形状的轮廓不同，将浸渍过的浸膏过的纱布条施加到模制材料，干燥湿润纱布以形成完成的面罩并从面罩中取出形式。完成的面膜可以涂上一层白色胶水并进行装饰。

30. 发明授权

US09305861B2 Method and system for electrically coupling a chip to chip package 有权
公开(公告)号：US09305861B2
公开(公告)日：2016-04-05
申请号：US13243820
申请日：2011-09-23
申请人： Tim Murphy , Lee Gotcher
发明人： Tim Murphy , Lee Gotcher
IPC分类号： H01L21/00 , H01L23/48
CPC分类号： H01L23/48 , H01L2924/0002 , H01L2924/00
摘要： A chip and a chip package can transmit information to each other by using a set of converters capable of communicating with each other through the emission and reception of electromagnetic signals. Both the chip and the chip package have at least one such converter physically disposed on them. Each converter is able to (1) convert received electromagnetic signals into electronic signals, which it then may relay to leads on the device on which it is disposed; and (2) receive electronic signals from leads on the device on which it is disposed and convert them into corresponding electromagnetic signals, which it may transmit to a corresponding converter on the other device. Not having a direct physical connection between the chip and the chip package decreases the inductive and capacitive effects commonly experienced with physical bonds.

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