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    • 27. 发明授权
    • Method of coating microelectronic substrates
    • 涂布微电子基板的方法
    • US07592035B2
    • 2009-09-22
    • US11261299
    • 2005-10-28
    • James P. DeYoungJames B. McClainStephen M. GrossDoug TaylorMark I. WagnerDavid Brainard
    • James P. DeYoungJames B. McClainStephen M. GrossDoug TaylorMark I. WagnerDavid Brainard
    • B05D5/12
    • H01L21/283B05D1/18B05D2401/90H01L21/28556H01L21/288H01L21/67028H01L28/65
    • A method of coating a substrate comprises the steps of: (a) providing a substrate in an enclosed vessel, the substrate having a surface portion; (b) at least partially filling the enclosed vessel with a first supercritical fluid so that said first supercritical fluid contacts the surface portion, with the first supercritical fluid carrying or containing a coating component; then (c) adding a separate compressed gas atmosphere to the reaction vessel so that a boundary is formed between the first supercritical fluid and the separate compressed gas atmosphere, said separate compressed gas atmosphere having a density less than said first supercritical fluid; and then (d) displacing said first supercritical fluid from said vessel by continuing adding said separate compressed gas atmosphere to said vessel so that said boundary moves across said surface portion and a thin film of coating component is deposited on said microelectronic substrate.
    • 涂覆基材的方法包括以下步骤:(a)在封闭容器中提供基材,所述基材具有表面部分; (b)用第一超临界流体至少部分地填充封闭的容器,使得所述第一超临界流体接触表面部分,第一超临界流体携带或包含涂层组分; 然后(c)向所述反应容器中加入单独的压缩气体气氛,使得在所述第一超临界流体和所述单独的压缩气体气氛之间形成边界,所述单独的压缩气体气氛的密度小于所述第一超临界流体; 然后(d)通过将所述单独的压缩气体气氛继续加入到所述容器中,使所述边界移动穿过所述表面部分并且将涂层组分的薄膜沉积在所述微电子衬底上,从而使所述第一超临界流体从所述容器移位。