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21. 发明授权

US07511335B2 Non-volatile memory 有权
标题翻译：非易失性存储器
公开(公告)号：US07511335B2
公开(公告)日：2009-03-31
申请号：US11429070
申请日：2006-05-05
申请人： Erh-Kun Lai , Hang-Ting Lue , Yen-Hao Shih , Chia-Hua Ho
发明人： Erh-Kun Lai , Hang-Ting Lue , Yen-Hao Shih , Chia-Hua Ho
IPC分类号： H01L29/792
CPC分类号： H01L27/11568 , H01L27/115 , H01L29/42348 , H01L29/66833 , H01L29/7923
摘要： A non-volatile memory is provided. The memory comprises a substrate, a dielectric layer, a conductive layer, an isolation layer, a buried bit line, a tunneling dielectric layer, a charge trapping layer, a barrier dielectric layer and a word line. Wherein, the dielectric layer is disposed on the substrate. The conductive layer is disposed on the dielectric layer. The isolation layer is disposed on the substrate and adjacent to the dielectric layer and the conductive layer. The buried bit line is disposed in the substrate and underneath the isolation layer. The tunneling dielectric layer is disposed on both the substrate and the sidewalls of the conductive layer and the isolation layer. The charge trapping layer is disposed on the tunneling dielectric layer and the barrier dielectric layer is disposed on the charge trapping layer. The word line is disposed on the substrate, crisscrossing with the buried bit line.
摘要翻译：提供非易失性存储器。存储器包括衬底，电介质层，导电层，隔离层，掩埋位线，隧道电介质层，电荷俘获层，势垒介电层和字线。其中介电层设置在基板上。导电层设置在电介质层上。隔离层设置在基板上并且邻近电介质层和导电层。掩埋位线设置在衬底中并在隔离层下方。隧道电介质层设置在导电层和隔离层的基板和侧壁上。电荷捕获层设置在隧道介电层上，势垒介电层设置在电荷俘获层上。字线设置在基板上，与埋入位线交叉。

22. 发明授权

US08704205B2 Semiconductor structure with improved capacitance of bit line 有权
标题翻译：具有改善位线电容的半导体结构
公开(公告)号：US08704205B2
公开(公告)日：2014-04-22
申请号：US13594353
申请日：2012-08-24
申请人： Shih-Hung Chen , Hang-Ting Lue , Kuang-Yeu Hsieh , Erh-Kun Lai , Yen-Hao Shih
发明人： Shih-Hung Chen , Hang-Ting Lue , Kuang-Yeu Hsieh , Erh-Kun Lai , Yen-Hao Shih
IPC分类号： H01L47/00
CPC分类号： H01L27/11582 , H01L27/11548 , H01L27/11556 , H01L27/11575
摘要： A semiconductor structure with improved capacitance of bit lines includes a substrate, a stacked memory structure, a plurality of bit lines, a first stair contact structure, a first group of transistor structures and a first conductive line. The first stair contact structure is formed on the substrate and includes conductive planes and insulating planes stacked alternately. The conductive planes are separated from each other by the insulating planes for connecting the bit lines to the stacked memory structure by stairs. The first group of transistor structures is formed in a first bulk area where the bit lines pass through and then connect to the conductive planes. The first group of transistor structures has a first gate around the first bulk area. The first conductive line is connected to the first gate to control the voltage applied to the first gate.
摘要翻译：具有改善的位线电容的半导体结构包括衬底，堆叠存储器结构，多个位线，第一阶梯接触结构，第一组晶体管结构和第一导电线。第一阶梯接触结构形成在基板上，并且包括交替堆叠的导电平面和绝缘面。导电平面通过用于通过楼梯将位线连接到堆叠的存储器结构的绝缘平面彼此分离。第一组晶体管结构形成在第一体积区域中，其中位线通过，然后连接到导电平面。第一组晶体管结构在第一体积区域周围具有第一栅极。第一导线连接到第一栅极以控制施加到第一栅极的电压。

23. 发明授权

US07279385B2 Flash memory device and manufacturing method thereof 有权
标题翻译：闪存装置及其制造方法
公开(公告)号：US07279385B2
公开(公告)日：2007-10-09
申请号：US11018536
申请日：2004-12-20
申请人： Erh-Kun Lai , Hang-Ting Lue , Yen-Hao Shih , Chia-Hua Ho
发明人： Erh-Kun Lai , Hang-Ting Lue , Yen-Hao Shih , Chia-Hua Ho
IPC分类号： H01L21/336
CPC分类号： H01L27/115 , H01L21/28114 , H01L27/11521 , H01L29/42376
摘要： A method of manufacturing a flash memory device is provided. Multiple stack structures each comprising a tunneling oxide layer and a first conductive layer are formed over a substrate. Thereafter, multiple embedded doping regions is formed in the substrate between the stack structures. A dielectric layer is formed over the substrate to cover the stack structures and then the dielectric layer is etched back and a portion of dielectric layer is remained on the stack structures. Using a portion of the remaining dielectric layer as a mask, a portion of the first conductive layer is removed. An inter-layer dielectric layer and a second conductive layer are sequentially formed over the first conductive layer. Because a self-aligned process is used to define the floating gate and the floating gate has a narrow-top/wide-bottom configuration, the fabrication process is simplified and the coupling ratio of the stack gate is increased.
摘要翻译：提供一种制造闪速存储器件的方法。在衬底上形成各自包括隧穿氧化物层和第一导电层的堆叠结构。此后，在堆叠结构之间的衬底中形成多个嵌入的掺杂区域。在衬底上形成电介质层以覆盖堆叠结构，然后电介质层被回蚀刻，并且介电层的一部分保留在堆叠结构上。使用剩余电介质层的一部分作为掩模，去除第一导电层的一部分。在第一导电层上依次形成层间电介质层和第二导电层。由于使用自对准工艺来定义浮动栅极，并且浮栅具有窄顶/宽底部配置，因此简化了制造工艺，并且增加了堆叠栅极的耦合比。

24. 发明申请

US20060131635A1 Flash memory device and manufacturing method thereof 有权
标题翻译：闪存装置及其制造方法
公开(公告)号：US20060131635A1
公开(公告)日：2006-06-22
申请号：US11018536
申请日：2004-12-20
申请人： Erh-Kun Lai , Hang-Ting Lue , Yen-Hao Shih , Chia-Hua Ho
发明人： Erh-Kun Lai , Hang-Ting Lue , Yen-Hao Shih , Chia-Hua Ho
IPC分类号： H01L29/788 , H01L21/336
CPC分类号： H01L27/115 , H01L21/28114 , H01L27/11521 , H01L29/42376
摘要： A method of manufacturing a flash memory device is provided. Multiple stack structures each comprising a tunneling oxide layer and a first conductive layer are formed over a substrate. Thereafter, multiple embedded doping regions is formed in the substrate between the stack structures. A dielectric layer is formed over the substrate to cover the stack structures and then the dielectric layer is etched back and a portion of dielectric layer is remained on the stack structures. Using a portion of the remaining dielectric layer as a mask, a portion of the first conductive layer is removed. An inter-layer dielectric layer and a second conductive layer are sequentially formed over the first conductive layer. Because a self-aligned process is used to define the floating gate and the floating gate has a narrow-top/wide-bottom configuration, the fabrication process is simplified and the coupling ratio of the stack gate is increased.
摘要翻译：提供一种制造闪速存储器件的方法。在衬底上形成各自包括隧穿氧化物层和第一导电层的堆叠结构。此后，在堆叠结构之间的衬底中形成多个嵌入的掺杂区域。介电层形成在衬底上以覆盖堆叠结构，然后电介质层被回蚀刻，并且介电层的一部分保留在堆叠结构上。使用剩余电介质层的一部分作为掩模，去除第一导电层的一部分。在第一导电层上依次形成层间电介质层和第二导电层。由于使用自对准工艺来定义浮动栅极，并且浮栅具有窄顶/宽底部配置，因此简化了制造工艺，并且增加了堆叠栅极的耦合比。

25. 发明授权

US07468299B2 Non-volatile memory cells and methods of manufacturing the same 有权
标题翻译：非易失性存储单元及其制造方法
公开(公告)号：US07468299B2
公开(公告)日：2008-12-23
申请号：US11197659
申请日：2005-08-04
申请人： ChiaHua Ho , Erh-Kun Lai , Hang-Ting Lue
发明人： ChiaHua Ho , Erh-Kun Lai , Hang-Ting Lue
IPC分类号： H01L21/336
CPC分类号： H01L27/11568 , H01L27/115
摘要： Methods for forming non-volatile memory cells include: (a) providing a semiconductor substrate having at least two source/drain regions, and a dielectric material disposed on the substrate above at least one of the at least two source/drain regions wherein the dielectric material has an exposed surface, and wherein the at least two source/drain regions are separated by a recess trench having an exposed surface, wherein the trench extends downward into the substrate to a depth position below the at least two source/drain regions; (b) forming a charge-trapping layer on the exposed surfaces of the dielectric material and the recess trench; and (c) forming a gate above the charge-trapping layer.
摘要翻译：用于形成非易失性存储单元的方法包括：（a）提供具有至少两个源极/漏极区域的半导体衬底和设置在至少两个源极/漏极区域中的至少一个的衬底上的电介质材料，其中电介质材料具有暴露的表面，并且其中所述至少两个源极/漏极区域被具有暴露表面的凹槽分隔开，其中所述沟槽向下延伸到所述衬底中至所述至少两个源极/漏极区域下方的深度位置; （b）在电介质材料和凹槽沟的暴露表面上形成电荷捕获层; 和（c）在电荷俘获层上形成栅极。

26. 发明申请

US20070031999A1 Non-volatile memory cells and methods of manufacturing the same 有权
标题翻译：非易失性存储单元及其制造方法
公开(公告)号：US20070031999A1
公开(公告)日：2007-02-08
申请号：US11197659
申请日：2005-08-04
申请人： ChiaHua Ho , Erh-Kun Lai , Hang-Ting Lue
发明人： ChiaHua Ho , Erh-Kun Lai , Hang-Ting Lue
IPC分类号： H01L21/335 , H01L21/8232
CPC分类号： H01L27/11568 , H01L27/115
摘要： Methods for forming non-volatile memory cells include: (a) providing a semiconductor substrate having at least two source/drain regions, and a dielectric material disposed on the substrate above at least one of the at least two source/drain regions wherein the dielectric material has an exposed surface, and wherein the at least two source/drain regions are separated by a recess trench having an exposed surface, wherein the trench extends downward into the substrate to a depth position below the at least two source/drain regions; (b) forming a charge-trapping layer on the exposed surfaces of the dielectric material and the recess trench; and (c) forming a gate above the charge-trapping layer.
摘要翻译：用于形成非易失性存储单元的方法包括：（a）提供具有至少两个源极/漏极区域的半导体衬底和设置在至少两个源极/漏极区域中的至少一个的衬底上的电介质材料，其中电介质材料具有暴露的表面，并且其中所述至少两个源极/漏极区域被具有暴露表面的凹槽分隔开，其中所述沟槽向下延伸到所述衬底中至所述至少两个源极/漏极区域下方的深度位置; （b）在电介质材料和凹槽沟的暴露表面上形成电荷捕获层; 和（c）在电荷俘获层上形成栅极。

27. 发明授权

US08482052B2 Silicon on insulator and thin film transistor bandgap engineered split gate memory 有权
标题翻译：硅绝缘体和薄膜晶体管带隙设计的分离栅极存储器
公开(公告)号：US08482052B2
公开(公告)日：2013-07-09
申请号：US12056489
申请日：2008-03-27
申请人： Hang-Ting Lue , Erh-Kun Lai
发明人： Hang-Ting Lue , Erh-Kun Lai
IPC分类号： H01L29/792 , H01L29/788
CPC分类号： H01L29/66833 , G11C16/0466 , G11C16/0483 , G11C16/0491 , H01L21/28282 , H01L27/115 , H01L27/11524 , H01L27/11529 , H01L27/11531 , H01L27/11551 , H01L27/11568 , H01L27/11578 , H01L29/792
摘要： Thin film transistor memory cells are stackable, and employ bandgap engineered tunneling layers in a junction free, NAND configuration, that can be arranged in 3D arrays. The memory cells have a channel region in a semiconductor strip formed on an insulating layer, a tunnel dielectric structure disposed above the channel region, the tunnel dielectric structure having a multilayer structure including at least one layer having a hole-tunneling barrier height lower than that at the interface with the channel region, a charge storage layer disposed above the tunnel dielectric structure, an insulating layer disposed above the charge storage layer, and a gate electrode disposed above the insulating layer.
摘要翻译：薄膜晶体管存储单元是可堆叠的，并且采用无结构的NAND配置的带隙工程隧道层，其可以排列成3D阵列。所述存储单元具有在绝缘层上形成的半导体条中的沟道区，设置在所述沟道区上方的隧道电介质结构，所述隧道电介质结构具有多层结构，所述多层结构包括至少一层具有低于空穴穿透势垒高度的层。在与沟道区域的界面处，设置在隧道介电结构上方的电荷存储层，设置在电荷存储层上方的绝缘层和设置在绝缘层上方的栅电极。

28. 发明授权

US08324681B2 Stacked non-volatile memory device and methods for fabricating the same 有权
标题翻译：堆叠的非易失性存储器件及其制造方法
公开(公告)号：US08324681B2
公开(公告)日：2012-12-04
申请号：US13162386
申请日：2011-06-16
申请人： Erh-Kun Lai , Hang-Ting Lue , Kuang Yeu Hsieh
发明人： Erh-Kun Lai , Hang-Ting Lue , Kuang Yeu Hsieh
IPC分类号： H01L29/792
CPC分类号： H01L21/28282 , H01L21/8221 , H01L21/84 , H01L27/0688 , H01L27/115 , H01L27/11568 , H01L27/11578 , H01L27/1203 , H01L29/792
摘要： A stacked non-volatile memory device comprises a plurality of bit line and word line layers stacked on top of each other. The bit line layers comprise a plurality of bit lines that can be formed using advanced processing techniques making fabrication of the device efficient and cost effective. The device can be configured for NAND operation.
摘要翻译：堆叠的非易失性存储器件包括堆叠在彼此顶部的多个位线和字线层。位线层包括多个位线，其可以使用先进的处理技术形成，从而使器件的制造成本高效且成本有效。该器件可以配置为NAND操作。

29. 发明申请

US20120220111A1 INJECTION METHOD WITH SCHOTTKY SOURCE/DRAIN 审中-公开
标题翻译：注射方法与肖特源/排水
公开(公告)号：US20120220111A1
公开(公告)日：2012-08-30
申请号：US13463264
申请日：2012-05-03
申请人： Yi-Hsuan Hsiao , Erh-Kun Lai , Hang-Ting Lue
发明人： Yi-Hsuan Hsiao , Erh-Kun Lai , Hang-Ting Lue
IPC分类号： H01L21/04
CPC分类号： H01L29/665 , G11C16/0408 , H01L29/40117 , H01L29/4234 , H01L29/66833 , H01L29/792
摘要： An injection method for non-volatile memory cells with a Schottky source and drain is described. Carrier injection efficiency is controlled by an interface characteristic of silicide and silicon. A Schottky barrier is modified by controlling an overlap of a gate and a source/drain and by controlling implantation, activation and/or gate processes.
摘要翻译：描述了具有肖特基源和漏极的非易失性存储单元的注入方法。载流子注入效率由硅化物和硅的界面特性控制。通过控制栅极和源极/漏极的重叠以及通过控制注入，激活和/或栅极过程来修改肖特基势垒。

30. 发明申请

US20080002477A1 METHOD FOR MANUFACTURING MEMORY CELL 有权
标题翻译：制造记忆细胞的方法
公开(公告)号：US20080002477A1
公开(公告)日：2008-01-03
申请号：US11836142
申请日：2007-08-09
申请人： Tzu-Hsuan Hsu , Erh-Kun Lai , Hang-Ting Lue , Chia-Hua Ho
发明人： Tzu-Hsuan Hsu , Erh-Kun Lai , Hang-Ting Lue , Chia-Hua Ho
IPC分类号： G11C11/34 , H01L21/36
CPC分类号： H01L29/7923 , H01L27/115 , H01L27/11568 , H01L29/42352
摘要： The invention is directed to a memory cell on a substrate having a plurality of shallow trench isolations form therein, wherein top surfaces of the shallow trench isolations are lower than a top surface of the substrate and the shallow trench isolations together define a vertical fin structure of the substrate. The memory comprises a straddle gate, a carrier trapping layer and at least two source/drain regions. The straddle gate is located on the substrate and straddles over the vertical fin structure. The carrier trapping layer is located between the straddle gate and the substrate. The source/drain regions are located in a portion of the vertical fin structure of the substrate exposed by the straddle gate.
摘要翻译：本发明涉及在其上形成有多个浅沟槽隔离物的衬底上的存储单元，其中浅沟槽隔离物的顶表面低于衬底的顶表面，并且浅沟槽隔离件一起限定垂直鳍状结构底物。存储器包括跨骑门，载体俘获层和至少两个源极/漏极区域。跨门位于基板上，跨越垂直翅片结构。载体捕获层位于跨门和基板之间。源极/漏极区域位于由跨门暴露的衬底的垂直鳍结构的一部分中。

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