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    • 24. 发明授权
    • Qualification test method and circuit for a non-volatile memory
    • 用于非易失性存储器的资格测试方法和电路
    • US06563752B2
    • 2003-05-13
    • US09945289
    • 2001-08-30
    • Wen-Jer TsaiNian-Kai ZousTa-Hui Wang
    • Wen-Jer TsaiNian-Kai ZousTa-Hui Wang
    • G11C700
    • G11C29/50004G11C16/04G11C29/50
    • A qualification test method for a non-volatile memory includes determining a relation curve between the programming voltage and the lifetime of the memory cell. A programming voltage with respect to the memory array within the expected lifetime is estimated. According to the relation curve, the accelerating test voltage and the test time period corresponding to the programming voltage operated in the expected lifetime are computed out. The test is performed for the test time period under the accelerating test voltage. All the memory cells at the programmed state are tested to see if the original programmed state still remains. If the programmed state remains, the memory array is judged to have the life period. If the programmed state does not remain, the memory array is judged to have no the life period.
    • 用于非易失性存储器的资格测试方法包括确定编程电压与存储器单元的寿命之间的关系曲线。 估计在预期寿命期内相对于存储器阵列的编程电压。 根据该关系曲线计算加速试验电压和对应于在预期寿命中运行的编程电压的试验时间。 在加速测试电压下进行测试时间。 测试编程状态下的所有存储单元,以查看原始编程状态是否仍然保留。 如果编程状态保持不变,则判断存储器阵列具有使用寿命。 如果编程状态不存在,则判断存储器阵列没有寿命周期。
    • 25. 发明授权
    • Method of controlling multi-state NROM
    • 控制多状态NROM的方法
    • US06320786B1
    • 2001-11-20
    • US09777229
    • 2001-02-05
    • Yao Wen ChangWen Jer TsaiTao Cheng Lu
    • Yao Wen ChangWen Jer TsaiTao Cheng Lu
    • G11C1604
    • G11C11/5671G11C16/0466
    • A method of controlling the multi-state NROM. A program is executed to inject electric charges that are trapped inside a nitride layer of the NROM. The amount of electric charges trapped inside the nitride layer is controlled so that the memory cell can have different threshold voltages. To read from the memory cell, a first variable voltage is applied to the gate electrode. According to the range of a second variable voltage applied to the drain terminal, three different potential levels, from the smallest to the largest, including a first potential level, a second potential level and a third potential level are set. The second input voltage is adjusted to the first potential level. When a high current is sensed, a first storage state is assumed. If little current is detected, the second input voltage is adjusted to the second potential level. When a high current is sensed, a second storage state is assumed. On the other hand, if little current is detected, the second input voltage is adjusted to the third potential level. Similarly, if a high current is sensed, a third storage state is assumed. Conversely, when little current is detected, a fourth storage state is assumed.
    • 一种控制多状态NROM的方法。 执行程序以注入被俘获在NROM的氮化物层内部的电荷。 控制在氮化物层内捕获的电荷量,使得存储单元可以具有不同的阈值电压。 为了从存储单元读取,向栅电极施加第一可变电压。 根据施加到漏极端子的第二可变电压的范围,设置包括第一电位电平,第二电位电平和第三电位电平的从最小到最大的三个不同的电位电平。 将第二输入电压调整到第一电位电平。 当检测到高电流时,假设第一存储状态。 如果检测到小的电流,则将第二输入电压调整到第二电位电平。 当感测到高电流时,假设第二存储状态。 另一方面,如果检测到小的电流,则将第二输入电压调整到第三电位电平。 类似地,如果感测到高电流,则假设第三存储状态。 相反,当检测到少量电流时,假设第四存储状态。
    • 28. 发明授权
    • Memory and manufacturing method thereof
    • 其记忆及其制造方法
    • US08760909B2
    • 2014-06-24
    • US13277816
    • 2011-10-20
    • Jyun-Siang HuangWen-Jer Tsai
    • Jyun-Siang HuangWen-Jer Tsai
    • G11C11/00
    • H01L29/66833H01L27/11578H01L29/792
    • A memory and a manufacturing method thereof are provided. A plurality of stacked structures extending along a first direction is formed on a substrate. Each of the stacked structures includes a plurality of first insulating layers and a plurality of second insulating layers. The first insulating layers are stacked on the substrate and the second insulating layers are respectively disposed between the adjacent first insulating layers. A plurality of trenches extending along the first direction is formed in each of the stacked structures. The trenches are respectively located at two opposite sides of each of the second insulating layers. A first conductive layer is filled in the trenches. A plurality of charge storage structures extending along a second direction is formed on the stacked structures and a second conductive layer is formed on each of the charge storage structures.
    • 提供了一种存储器及其制造方法。 沿着第一方向延伸的多个堆叠结构形成在基板上。 每个堆叠结构包括多个第一绝缘层和多个第二绝缘层。 第一绝缘层层叠在基板上,第二绝缘层分别设置在相邻的第一绝缘层之间。 沿着第一方向延伸的多个沟槽形成在每个堆叠结构中。 沟槽分别位于每个第二绝缘层的两个相对侧。 第一导电层填充在沟槽中。 沿着第二方向延伸的多个电荷存储结构形成在层叠结构上,并且在每个电荷存储结构上形成第二导电层。
    • 29. 发明授权
    • Hot carrier programming in NAND flash
    • NAND闪存中的热载波编程
    • US08531886B2
    • 2013-09-10
    • US12797994
    • 2010-06-10
    • Jyun-Siang HuangWen-Jer Tsai
    • Jyun-Siang HuangWen-Jer Tsai
    • G11C11/34
    • G11C16/04G11C11/5628G11C16/0483G11C16/10G11C16/3418
    • A memory device includes a plurality of memory cells arranged in series in the semiconductor body, such as a NAND string, having a plurality of word lines. A selected memory cell is programmed by hot carrier injection using a boosted channel potential to establish the heating field. Boosted channel hot carrier injection can be based on blocking flow of carriers between a first side of a selected cell and a second side of the selected cell in the NAND string, boosting by capacitive coupling the first semiconductor body region to a boosted voltage level, biasing the second semiconductor body region to a reference voltage level, applying a program potential greater than a hot carrier injection barrier level to the selected cell and enabling flow of carriers from the second semiconductor body region to the selected cell to cause generation of hot carriers.
    • 存储器件包括串联布置在半导体本体中的多个存储单元,例如具有多个字线的NAND串。 通过使用升压通道电位的热载流子注入来对选定的存储单元进行编程以建立加热场。 升压通道热载流子注入可以基于阻塞NAND串中选定单元的第一侧和所选单元的第二侧之间的载流子的流动,通过将第一半导体体区域电容耦合到提升的电压电平来提升 将第二半导体主体区域设置为参考电压电平,将大于热载流子注入势垒级的编程电位施加到所选择的单元,并且使载流子能够从第二半导体体区域流向所选择的单元以引起热载流子的产生。
    • 30. 发明授权
    • Operation methods for memory cell and array thereof immune to punchthrough leakage
    • 记忆单元及其阵列的操作方法免于穿透泄漏
    • US08369148B2
    • 2013-02-05
    • US12264893
    • 2008-11-04
    • Tien-Fan OuWen-Jer TsaiJyun-Siang Huang
    • Tien-Fan OuWen-Jer TsaiJyun-Siang Huang
    • G11C11/34
    • G11C5/04G11C16/0416G11C16/10H01L27/11521H01L27/11568
    • An integrated circuit includes a memory cell structure including a first cell and a second cell. The first cell includes a first storage structure and a first gate over a substrate. The first gate is over the first storage structure. The second cell includes a second storage structure and a second gate over the substrate. The second gate is over the second storage structure. The first gate is separated from the second gate. A first doped region is adjacent to the first cell and is coupled to a first source. A second doped region is configured within the substrate and adjacent to the second cell. The second doped region is coupled to a second source. At least one third doped region is between the first cell and the second cell, wherein the third doped region is floating.
    • 集成电路包括包括第一单元和第二单元的存储单元结构。 第一单元包括第一存储结构和衬底上的第一栅极。 第一个门是第一个存储结构。 第二单元包括第二存储结构和衬底上的第二栅极。 第二个门是第二个存储结构。 第一个门与第二个门分开。 第一掺杂区域与第一单元相邻并且耦合到第一源极。 第二掺杂区域被配置在衬底内且与第二单元相邻。 第二掺杂区域耦合到第二源极。 至少一个第三掺杂区域在第一单元和第二单元之间,其中第三掺杂区域是浮置的。