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    • 21. 发明申请
    • Semiconductor device and method for manufacturing the same
    • 半导体装置及其制造方法
    • US20070034874A1
    • 2007-02-15
    • US11584524
    • 2006-10-23
    • Tatsuya AraoTakeshi NodaTakuya MatsuoHidehito KitakadoMasanori Kyoho
    • Tatsuya AraoTakeshi NodaTakuya MatsuoHidehito KitakadoMasanori Kyoho
    • H01L29/04H01L21/84
    • H01L27/124H01L27/1214H01L27/1259H01L29/6675H01L29/78621H01L29/78648
    • A semiconductor device that can be manufactured with a reduced cost by decreasing the number of masks is disclosed, and a method for manufacturing the semiconductor device is disclosed. The method for manufacturing the semiconductor device comprises the steps of: forming a semiconductor layer 3 having a source and a drain regions 10, 11, and LDD regions 16, 17; a gate insulating film 5; and a gate electrode 6; forming a first and a second interlayer insulating films 24, 25 over the gate electrode 6 and the gate insulating film 5; forming contact holes 25a, 25c to these interlayer insulating films so as to be located over each of the source region and the drain region; and an opening portion 25b to these interlayer insulating films so as to be located over the gate electrode and the LDD region; forming a second gate electrode 26b by a conductive film in the opening portion so as to cover the gate electrode and the LDD region; and a pixel electrode 26a over the second interlayer insulating film; removing the gate insulating film in the contact hole; and forming wirings 27, 28 connected to each the source region and the drain region.
    • 公开了可以通过减少掩模数而降低成本的半导体器件,并且公开了一种用于制造半导体器件的方法。 制造半导体器件的方法包括以下步骤:形成具有源极和漏极区域10,11以及LDD区域16,17的半导体层3; 栅极绝缘膜5; 和栅电极6; 在栅极电极6和栅极绝缘膜5上形成第一和第二层间绝缘膜24,25; 向这些层间绝缘膜形成接触孔25a,25c,以便位于源极区域和漏极区域之上; 和这些层间绝缘膜的开口部分25b,以便位于栅电极和LDD区之上; 通过开口部中的导电膜形成第二栅电极26b,以覆盖栅电极和LDD区; 以及在第二层间绝缘膜上的像素电极26a; 去除接触孔中的栅极绝缘膜; 以及形成连接到每个源极区域和漏极区域的布线27,28。
    • 23. 发明申请
    • Thin film transistor, semiconductor device, and method for manufacturing the same
    • 薄膜晶体管,半导体器件及其制造方法
    • US20050199878A1
    • 2005-09-15
    • US11071255
    • 2005-03-04
    • Tatsuya AraoHiroyuki Miyake
    • Tatsuya AraoHiroyuki Miyake
    • G09F9/30H01L21/336H01L21/84H01L29/786H01L31/0392
    • H01L27/124H01L27/1214H01L27/127H01L27/1288H01L27/1296
    • A semiconductor element is operated without being affected even when the substrate is largely affected by heat shrink such as a large substrate. Furthermore, a thin film semiconductor circuit and a thin film semiconductor device each having the semiconductor element. Also, a semiconductor element is operated without being affected even if there is slight mask deviation. In view of them, a plurality of gate electrodes formed so as to overlap a lower concentration impurity region of a semiconductor layer than drain regions on a drain region side. Also, source regions and the drain regions corresponding to the respective gate electrodes are formed so that current flows in opposite directions each other through channel regions corresponding to the gate electrodes. Further, the number of the channel regions in which a current flows in a first direction is equal to the number of the channel regions in which a current flows in a direction opposite to the first direction.
    • 即使当基板受到诸如大基板的热收缩的很大影响时,也不会影响半导体元件。 此外,每个都具有半导体元件的薄膜半导体电路和薄膜半导体器件。 此外,即使存在轻微的掩模偏差,也不会影响半导体元件的影响。 鉴于它们,多个栅电极被形成为与漏极区侧的漏极区重叠的半导体层的较低浓度杂质区。 此外,形成与各个栅电极对应的源极区域和漏极区域,使得电流通过与栅电极对应的沟道区域彼此相反的方向流动。 此外,电流沿第一方向流动的通道区域的数量等于电流沿与第一方向相反的方向流动的沟道区域的数量。
    • 27. 发明授权
    • Semiconductor device with tapered gate and insulating film
    • 具有锥形栅极和绝缘膜的半导体器件
    • US06646287B1
    • 2003-11-11
    • US09714891
    • 2000-11-17
    • Koji OnoHideomi SuzawaTatsuya Arao
    • Koji OnoHideomi SuzawaTatsuya Arao
    • H01L29786
    • H01L27/1222G02F1/13624H01L27/12H01L27/1214H01L27/124H01L27/127H01L29/42384H01L29/4908H01L29/66757H01L29/78621H01L29/78627H01L33/08H01L33/62H01L2029/7863H01L2924/0002H01L2924/00
    • In a semiconductor device, typically an active matrix display device, the structure of TFTs arranged in the respective circuits are made suitable in accordance with the function of the circuit, and along with improving the operating characteristics and the reliability of the semiconductor device, the manufacturing cost is reduced and the yield is increased by reducing the number of process steps. A semiconductor device has a semiconductor layer, an insulating film formed contacting the semiconductor layer, and a gate electrode having a tapered portion on the insulating film, in the semiconductor device, the semiconductor layer has a channel forming region, a first impurity region for forming a source region or a drain region and containing a single conductivity type impurity element, and a second impurity region for forming an LDD region contacting the channel forming region, a portion of the second impurity region is formed overlapping a gate electrode, and the concentration of the single conductivity type impurity element contained in the second impurity region becomes larger with distance from the channel forming region.
    • 在半导体器件(通常为有源矩阵显示器件)中,根据电路的功能,布置在各个电路中的TFT的结构是合适的,并且随着半导体器件的工作特性和可靠性的提高,制造 降低成本,并通过减少工艺步骤的数量来提高产量。 半导体器件具有半导体层,与半导体层接触形成的绝缘膜和在绝缘膜上具有锥形部分的栅电极,在半导体器件中,半导体层具有沟道形成区,形成第一杂质区 源极区域或漏极区域,并且包含单一导电型杂质元素,以及用于形成与沟道形成区域接触的LDD区域的第二杂质区域,第二杂质区域的一部分与栅电极重叠,并且浓度 包含在第二杂质区域中的单一导电型杂质元素随着与沟道形成区域的距离而变大。