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21. 发明授权

US07173445B2 Sensor for inspection instrument and inspection instrument 失效
标题翻译：检测仪器和检验仪器传感器
公开(公告)号：US07173445B2
公开(公告)日：2007-02-06
申请号：US10487828
申请日：2002-08-27
申请人： Tatsuhisa Fujii , Kazuhiro Monden , Mikiya Kasai , Shogo Ishioka , Shuji Yamaoka
发明人： Tatsuhisa Fujii , Kazuhiro Monden , Mikiya Kasai , Shogo Ishioka , Shuji Yamaoka
IPC分类号： G01R31/00 , G01R31/28
CPC分类号： G01R31/312
摘要： Disclosed is an inspection sensor and inspection apparatus capable of accurately inspecting the shape of a conductive pattern. A sensor element 12a includes an MOSFET, and an aluminum electrode (AL) serving as a passive element 80. The passive element or aluminum electrode 80 is connected to the gate of a MOSFET 81 and the source of a MOSFET 82. A voltage VDD is supplied from a power supply circuit 18 to the drain of the MOSFET 81, and the source of the MOSFET 81 is connected to the drain of a MOSFET 83. A reset signal is entered from a vertical selection section 14 into the gate of the MOSFET 82, and the voltage VDD is supplied from the power supply circuit 18 to the drain of the MOSFET 82. A selection signal is entered from the vertical selection section 14 into the gate of the MOSFET 83, and an output from the source of the MOSFET 83 is entered into a lateral selection section 13.
摘要翻译：公开了能够精确地检查导电图案的形状的检查传感器和检查装置。传感器元件12a包括MOSFET和用作无源元件80的铝电极（AL）。无源元件或铝电极80连接到MOSFET81的栅极和MOSFET82的源极。电压VDD从电源电路18提供给MOSFET 81的漏极，MOSFET81的源极连接到MOSFET 83的漏极。复位信号从垂直选择部分14进入到MOSFET82的栅极，并且电压VDD从电源电路18提供给MOSFET82的漏极。选择信号从垂直选择部分14进入到MOSFET 83的栅极，并且来自MOSFET 83的源极的输出进入横向选择部分13。

22. 发明授权

US07138805B2 Device and method for inspection 失效
标题翻译：检查装置和方法
公开(公告)号：US07138805B2
公开(公告)日：2006-11-21
申请号：US10069523
申请日：2001-06-13
申请人： Shogo Ishioka , Shuji Yamaoka
发明人： Shogo Ishioka , Shuji Yamaoka
IPC分类号： G01R27/26 , G01R31/08
CPC分类号： G01R31/312 , G01R31/2805 , G01R31/2812 , G01R31/304 , H01L22/12 , H01L2924/0002 , H01L2924/00
摘要： The present invention provides an inspection apparatus and an inspection method, capable of, when supplying an inspection signal to a circuit wiring, eliminating any need for a pin to be brought into contact with the circuit wiring and detecting any defects including an invisible microscopic defect. An inspection apparatus A for inspecting a circuit wiring of a circuit board 100 comprises a conductive member 1 adapted to be disposed on the side of one of surfaces of the circuit board 100 and to be supplied with an inspection signal, a signal source 2 for supplying the inspection signal to the conductive member 1, a sensor unit 3 including a plurality of cells 3a to be disposed the opposed to the conductive member 1 on the side of the other surface of the circuit board 100, and a computer 5 for acquiring each signal appearing at the cells 3a in response to the inspection signal supplied to the conductive member 1.
摘要翻译：本发明提供一种检测装置和检查方法，能够在向电路布线提供检查信号时，不需要与电路布线接触的引脚，并且检测出包括不可见的微观缺陷的任何缺陷。用于检查电路板100的电路布线的检查装置A包括：导电构件1，其适于布置在电路板100的一个表面的侧面并且被提供检查信号;信号源2，用于供应对导电部件1的检查信号，包括在电路板100的另一面的与导电部件1相对设置的多个电池单元3a的传感器单元3，以及用于获取电路板响应于提供给导电构件1的检查信号，在单元3a处出现信号。

23. 发明申请

US20060226851A1 Conductor inspection apparatus and conductor inspection method 失效
标题翻译：导体检查装置和导体检查方法
公开(公告)号：US20060226851A1
公开(公告)日：2006-10-12
申请号：US10547355
申请日：2004-02-27
申请人： Shuji Yamaoka , Akira Nurioka , Mishio Hayashi , Shogo Ishioka
发明人： Shuji Yamaoka , Akira Nurioka , Mishio Hayashi , Shogo Ishioka
IPC分类号： G01R31/08
CPC分类号： G01B7/28
摘要： Disclosed is a conductor inspection apparatus capable of capable of detecting a state of an inspection-target electric conductor with a high degree of accuracy in a non-contact manner. The inspection apparatus comprises a signal supply section 510 for supplying an inspection signal to an inspection-target conductor 520, and two sensor plates 570, 580 disposed approximately parallel to each other in the vicinity of the conductor 520. The inspection apparatus is designed to inspect a configuration of the conductor 520 disposed opposed to the sensor plate 570, in accordance with a measured signal level from the sensor plate 570. The inspection apparatus further includes a subtracter 550 for subjecting respective detected signal values from the sensor plates 570, 580 to subtraction, and a divider 560 for dividing the detected signal value from a selected one of the sensor plates by the subtraction result to normalize the detected signal value from the selected sensor plate so as to detect a relative ratio between the detected signal values from the sensor plates to obtain a value X corresponding a distance between the selected sensor plate and the conductor 520, as a detection result.
摘要翻译：公开了能够以非接触的方式高精度地检测检查对象的导电体的状态的导体检查装置。检查装置包括用于向检查对象导体520提供检查信号的信号供给部510和在导体520附近彼此大致平行地配置的两个传感器板570,580。检查装置被设计为检查根据来自传感器板570的测量信号电平，设置与传感器板570相对设置的导体520的结构。检查装置还包括减法器550，用于对来自传感器板570,580的各个检测信号值进行减法以及分频器560，用于通过减法结果将来自所选传感器板的检测信号值分割，以从所选择的传感器板归一化检测信号值，以便检测来自传感器板的检测信号值之间的相对比例以获得对应于所选择的传感器板和导体520之间的距离的值X. 效果结果。

24. 发明申请

US20060055413A1 Circuit pattern inspection instrument and pattern inspection method 失效
标题翻译：电路图形检测仪和图案检验方法
公开(公告)号：US20060055413A1
公开(公告)日：2006-03-16
申请号：US10536996
申请日：2003-11-28
申请人： Shuji Yamaoka , Hiroshi Hamori , Shogo Ishioka
发明人： Shuji Yamaoka , Hiroshi Hamori , Shogo Ishioka
IPC分类号： G01R31/28
CPC分类号： G01R31/2808
摘要： Disclosed is a circuit pattern inspection apparatus for inspecting a conductive pattern of a circuit board which includes first and second comb-shaped conductive patterns 15a, 15b each having a plurality of terminal portions arranged substantially parallel to each other and a base portion connecting respective anchor ends of the terminal portions together, wherein the terminal portions of the first comb-shaped conductive pattern are alternately arranged with respect to the terminal portions of said second comb-shaped conductive pattern, and the first second comb-shaped conductive patterns 15a, 15b are adapted, respectively, to be supplied with an AC inspection signal, and grounded. The circuit pattern inspection apparatus comprises first and second detection means 20, 30 each having a detection electrode for detecting a signal from the first and second comb-shaped conductive patterns, and a scalar robot 80 operable to move each of the first and second detection means 20, 30 across common ones of the terminal portions, while allowing them be capacitively coupled with the terminal portions. The first and second detection means 20, 30 generates detection signals allowing the presence of a defect in each of the terminal portions to be determined based thereon. The inspection apparatus of the present invention can inspect a defect in a circuit pattern reliably and readily.
摘要翻译：公开了一种电路图案检查装置，用于检查电路板的导电图案，该电路图案包括具有彼此大致平行布置的多个端子部分的第一和第二梳状导电图案15a，15b以及连接各自的基部所述端子部分的锚定端部在一起，其中所述第一梳状导电图案的端子部分相对于所述第二梳状导电图案的端子部分交替布置，并且所述第一第二梳状导电图案15a， 15b分别适应于被提供有交流检测信号并接地。电路图案检查装置包括第一和第二检测装置20,30，每个检测装置具有用于检测来自第一和第二梳状导电图案的信号的检测电极，以及标量机器人80，其可操作以使第一和第二检测装置 20,30跨过公共端子部分，同时允许它们与端子部分电容耦合。第一和第二检测装置20,30产生允许基于每个端子部分存在缺陷的检测信号。本发明的检查装置可以可靠且容易地检查电路图案中的缺陷。

25. 发明申请

US20060043153A1 Circuit pattern inspection device and circuit pattern inspection method 审中-公开
标题翻译：电路图形检测装置及电路图案检验方法
公开(公告)号：US20060043153A1
公开(公告)日：2006-03-02
申请号：US10536997
申请日：2003-11-28
申请人： Shuji Yamaoka , Hiroshi Hamori , Shogo Ishioka
发明人： Shuji Yamaoka , Hiroshi Hamori , Shogo Ishioka
IPC分类号： B23Q15/00
CPC分类号： G01R31/2805
摘要： Disclosed is a circuit pattern inspection apparatus for inspecting a plurality of target patterns 15 arrange in lines at least at first and second opposite ends thereof. The inspection apparatus comprises a supply electrode 35 for supplying an inspection signal and a sensor electrode 25 for detecting a detection signal. Each of the supply and sensor electrodes 35, 25 are adapted to be moved across each of the target patterns with a given gap relative to each of the target patterns 15 in such a manner as to allow the inspection signal supplied from the supply electrode 35 to each of the target patterns 15 through a capacitive coupling, to be detected by the sensor electrode capacitively coupled with each of the target patterns 15, so that the presence of disconnection in the target pattern is determined when the detection signal has a value less than a given lower limit, and the presence of short circuit in the target pattern is determined when the detection signal has a value greater than a given upper limit. According to the inspection apparatus of the present invention, the presence of defect in a circuit board can be inspected reliably and readily.
摘要翻译：公开了一种电路图案检查装置，用于至少在其第一和第二相对端检查排成行的多个目标图案15。检查装置包括用于提供检查信号的供给电极35和用于检测检测信号的传感器电极25。供电传感器电极35和传感器电极25中的每一个适于以相对于每个目标图案15的给定间隙移动到每个目标图案上，以允许从供电电极35提供的检查信号每个目标图案15通过电容耦合，由与每个目标图案15电容耦合的传感器电极检测，使得当检测信号的值小于一个时，确定目标图案中的断开的存在给定下限，并且当检测信号具有大于给定上限的值时，确定目标图案中的短路的存在。根据本发明的检查装置，可以可靠且容易地检查电路板中的缺陷的存在。

26. 发明授权

US06972573B2 Device and method for inspecting circuit board 失效
标题翻译：电路板检查装置及方法
公开(公告)号：US06972573B2
公开(公告)日：2005-12-06
申请号：US10069522
申请日：2001-06-13
申请人： Shogo Ishioka , Shuji Yamaoka
发明人： Shogo Ishioka , Shuji Yamaoka
IPC分类号： G01R1/073 , G01R31/02 , G01R31/08 , G01R31/28 , H05K3/00
CPC分类号： G01R31/08 , G01R1/07328 , G01R31/2801
摘要： The present invention provides an inspection apparatus and an inspection method capable of inspecting at a high speed by using a sensor having flexibility and excellent productivity. When a circuit board 100 as a subject of inspection is selected, CAD data of the circuit wiring 101 on this circuit board 100 is analyzed to detect the position of the end of each wiring. Then, two or more sensor elements adjacent to the end (from which the voltage variation can be detected) are specified. The switching circuit 16 is controlled to connect the selected sensor elements to an output terminal 12 and to connect the remaining sensor elements to the GND terminal 15. In this state, when an voltage is applied to one of the selected circuit wirings and then an inspection signal (voltage variation) is output from the output terminal 12, it will be determined that no disconnection exists in the circuit wiring.
摘要翻译：本发明提供一种能够通过使用具有柔软性和优异的生产率的传感器高速检查的检查装置和检查方法。当选择作为检查对象的电路板100时，分析该电路板100上的电路布线101的CAD数据，以检测每个布线的端部的位置。然后，指定与端部相邻的两个或更多个传感器元件（从中可以检测到电压变化）。控制开关电路16将所选择的传感器元件连接到输出端子12，并将剩余的传感器元件连接到GND端子15.在该状态下，当将电压施加到所选择的电路布线之一，然后检查从输出端子12输出信号（电压变动），确定在电路布线中不存在断线。

27. 发明授权

US06958619B2 Inspecting apparatus and inspecting method for circuit board 失效
标题翻译：电路板检查仪器和检查方法
公开(公告)号：US06958619B2
公开(公告)日：2005-10-25
申请号：US10169749
申请日：2001-11-15
申请人： Shuji Yamaoka , Shogo Ishioka
发明人： Shuji Yamaoka , Shogo Ishioka
IPC分类号： G01R31/02 , G09G3/00 , H05K13/08
CPC分类号： G09G3/006
摘要： The present invention provides an apparatus and method for inspecting a circuit board at a high speed. A PDP driver module 100 as an object to be inspected has an onboard PDP driving LSI 110. A plurality of circuit wirings 111 are connected to terminals of the LSI. An inspection apparatus 1 generates an LSI drive signal and sends it to input terminals 113 of the LSI 110. A sensor 2 is positioned opposedly to the circuit wirings 111 in a non-contact manner. The sensor 2 detects voltage values in circuit wirings 111 caused by driving the LSI 110, and the detected signals are analyzed by the inspection apparatus 1.
摘要翻译：本发明提供一种用于高速检查电路板的装置和方法。作为被检查对象的PDP驱动器模块100具有车载PDP驱动LSI110。多个电路布线111连接到LSI的端子。检查装置1产生LSI驱动信号并将其发送到LSI110的输入端子113。传感器2以非接触的方式与电路布线111相对定位。传感器2检测由驱动LSI110引起的电路布线111中的电压值，检测信号由检查装置1分析。

28. 发明授权

US06703849B2 Inspection apparatus, inspection method and inspection unit therefor 失效
标题翻译：检验仪器，检验方法及检验单位
公开(公告)号：US06703849B2
公开(公告)日：2004-03-09
申请号：US09926301
申请日：2001-10-09
申请人： Shogo Ishioka , Shuji Yamaoka
发明人： Shogo Ishioka , Shuji Yamaoka
IPC分类号： G01R3102
CPC分类号： G01R31/312
摘要： The present invention provides an inspection apparatus, an inspection method and an inspection unit therefor capable of inspecting a conductive pattern in a complete non-contact manner. In the method for inspecting a conductive pattern of a circuit board in a complete non-contact manner, a plurality of electrically conductive cells 11 are arranged along the conductive pattern of the circuit board 100 with leaving a space therebetween. An inspection signal having temporal variations is supplied to at least one of the cells 11 in the conductive pattern without using any pin. An output signal appearing at another at least one of the cells through the conductive pattern in response to the applied inspection signal is detected. The conductive pattern is inspected based on the detected output signal.
摘要翻译：本发明提供一种能够以完全非接触的方式检查导电图案的检查装置，检查方法和检查单元。在以完全非接触的方式检查电路板的导电图案的方法中，沿着电路板100的导电图案布置多个导电单元11，其间留有间隙。具有时间变化的检查信号被提供给导体图案中的单元11中的至少一个，而不使用任何引脚。检测响应于所施加的检查信号通过导电图案在另一个小区中出现的输出信号。基于检测到的输出信号检查导电图案。

29. 发明授权

US06614250B1 Sensor probe for use in board inspection and manufacturing method thereof 失效
标题翻译：用于板检测及其制造方法的传感器探头
公开(公告)号：US06614250B1
公开(公告)日：2003-09-02
申请号：US09572254
申请日：2000-05-17
申请人： Yuji Odan , Shuji Yamaoka
发明人： Yuji Odan , Shuji Yamaoka
IPC分类号： G01R3126
CPC分类号： G01R1/07307 , G01R3/00 , G01R31/2887
摘要： The present invention provides an apparatus and a method for used in a board inspection capable of an inspection of defect in a circuit board with high resolution over a wide range. The method is used for manufacturing a sensor probe comprising layers which include an electrode layer, a lead wire layer and a bridge layer (41). These layers are laminated on a base (30) in the form of a flat plate composed of silicon. The electrode layer is comprised of a set of sensor electrodes (40). The lead wire layer is comprised of a set of lead wires (50) for transferring a signal externally. The bridge layer couples between the electrode layer and the lead wire layer. The lead wire layer is formed by means of depositing aluminum in accordance with a first mask pattern. The bridge layer is formed by means of growing each of bridge wires (41) in the direction perpendicular to the base. The bridge wires extend in the direction perpendicular to the base and are connected to respective lead wires of the lead layer. The respective electrodes of the electrode layer are formed by depositing aluminum in accordance with a second mask pattern. The plurality of sensor electrodes respectively extend in the horizontal direction and having a predetermined area. A shield layer (33) is provided between the electrode layer (40) and the lead wire layer (50).
摘要翻译：本发明提供一种用于板检测的装置和方法，能够在宽范围内以高分辨率检查电路板中的缺陷。该方法用于制造包括电极层，引线层和桥接层（41）的层的传感器探针。这些层层叠在由硅组成的平板形式的基底（30）上。电极层由一组传感器电极（40）组成。引线层由用于在外部传送信号的一组引线（50）组成。桥接层耦合在电极层和引线层之间。引线层通过根据第一掩模图案沉积铝而形成。通过在与基座垂直的方向上生长桥接线（41），形成桥接层。桥接线在与基座垂直的方向上延伸并连接到引线层的相应引线。通过根据第二掩模图案沉积铝来形成电极层的各个电极。多个传感器电极分别在水平方向上延伸并具有预定的面积。在电极层（40）和引线层（50）之间设有屏蔽层（33）。

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