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21. 发明授权

US07655997B2 Wafer level electro-optical semiconductor manufacture fabrication mechanism and a method for the same 有权
标题翻译：晶圆级电光半导体制造机构及其制造方法
公开(公告)号：US07655997B2
公开(公告)日：2010-02-02
申请号：US11041952
申请日：2005-01-26
申请人： Bily Wang , Jonnie Chuang , Chuan-Fa Lin , Chi-Wen Hung
发明人： Bily Wang , Jonnie Chuang , Chuan-Fa Lin , Chi-Wen Hung
IPC分类号： H01L27/14
CPC分类号： H01L23/60 , H01L23/544 , H01L24/48 , H01L25/167 , H01L27/0248 , H01L2223/54493 , H01L2224/16145 , H01L2224/16225 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/00011 , H01L2924/00014 , H01L2924/01079 , H01L2924/01322 , H01L2924/12041 , H01L2924/12044 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2224/0401 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A wafer-level electro-optical semiconductor fabrication mechanism and method for the same which improves upon traditional electro-optical semiconductor grain packaging methods. The present invention electrically connects semiconductor grains to the grains on a top surface of a wafer, this is done by either screen-printing or steel board-printing solder or silver paste onto the wafer. After that, the wafer is processed using the following steps: processing the devices, bonding with wire, packaging the wafer and finally cutting the wafer. Using this method raises the production yield while production times and costs are reduced. The wafer-level electro-optical semiconductor fabrication mechanism comprises: a wafer, an electro-optical semiconductor grain and conductive materials.
摘要翻译：一种用于改进传统电光半导体晶粒封装方法的晶片级电光半导体制造机构及其方法。本发明将半导体晶粒与晶片的顶表面上的晶粒电连接，这可以通过丝网印刷或钢板印刷焊料或银浆在晶片上进行。之后，使用以下步骤处理晶片：处理器件，用导线接合，封装晶片并最终切割晶片。使用这种方法提高了生产率，同时降低了生产时间和成本。晶圆级电光半导体制造机构包括：晶片，电光半导体晶粒和导电材料。

22. 发明申请

US20090316315A1 LED CHIP PACKAGE STRUCTURE WITH AN EMBEDDED ESD FUNCTION AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：具有嵌入式ESD功能的LED芯片封装结构及其制造方法
公开(公告)号：US20090316315A1
公开(公告)日：2009-12-24
申请号：US12243016
申请日：2008-10-01
申请人： BILY WANG , PING-CHOU YANG , JIA-WEN CHEN
发明人： BILY WANG , PING-CHOU YANG , JIA-WEN CHEN
IPC分类号： H02H9/00 , H01L33/00 , H01L21/00
CPC分类号： H01L25/167 , H01L2224/48091 , H01L2224/48247 , Y10T29/41 , H01L2924/00014
摘要： An LED chip package structure includes a conductive unit, a first package unit, an ESD unit, a second package unit, a light-emitting unit and a second package unit. The conductive unit has two conductive pins adjacent to each other which form a concave space between each other. The first package unit encloses one part of each conductive pin in order to form a receiving space communicating with the concave space and to expose an end side of each conductive pin. The ESD unit is received in the concave space and electrically connected between the two conductive pins. The second package unit is received in the concave space in order to cover the ESD unit. The light-emitting unit is received in the receiving space and electrically connected between the two conductive pins. The third package unit is received in the receiving space in order to cover the light-emitting unit.
摘要翻译： LED芯片封装结构包括导电单元，第一封装单元，ESD单元，第二封装单元，发光单元和第二封装单元。导电单元具有彼此相邻的两个导电销，它们彼此之间形成凹形空间。第一封装单元包围每个导电引脚的一部分，以便形成与凹入空间连通并且暴露每个导电引脚的端侧的接收空间。 ESD单元被容纳在凹形空间中并电连接在两个导电销之间。第二包装单元被容纳在凹形空间中以覆盖ESD单元。发光单元被容纳在接收空间中并且电连接在两个导电引脚之间。第三包装单元被容纳在接收空间中以覆盖发光单元。

23. 发明申请

US20090283881A1 SEMICONDUCTOR CHIP PACKAGE STRUCTURE FOR ACHIEVING FACE-DOWN ELECTRICAL CONNECTION WITHOUT USING A WIRE-BONDING PROCESS AND METHOD FOR MAKING THE SAME 审中-公开
标题翻译：用于实现无缝连接的半导体芯片封装结构，不使用线形焊接工艺及其制造方法
公开(公告)号：US20090283881A1
公开(公告)日：2009-11-19
申请号：US12243246
申请日：2008-10-01
申请人： BILY WANG , SUNG-YI HSIAO , YUN-HAO CHANG , JACK CHEN
发明人： BILY WANG , SUNG-YI HSIAO , YUN-HAO CHANG , JACK CHEN
IPC分类号： H01L21/50 , H01L23/495
CPC分类号： H01L24/19 , H01L23/49572 , H01L24/96 , H01L24/97 , H01L33/62 , H01L2224/0401 , H01L2224/04105 , H01L2224/16 , H01L2224/20 , H01L2224/211 , H01L2224/48091 , H01L2224/48247 , H01L2924/01078 , H01L2924/01082 , H01L2924/12041 , H01L2924/14 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor chip package structure for achieving face-down electrical connection without using a wire-bonding process includes a package unit, a semiconductor chip, a substrate unit, a first insulative unit, a first conductive unit, a second conductive unit, and a second insulative unit. The semiconductor chip has a plurality of conductive pads. The first insulative unit has a first insulative layer formed between the conductive pads. The first conductive unit has a plurality of first conductive layers, and one side of each first conductive layer is electrically connected with the corresponding conductive pad. The second conductive unit has a plurality of second conductive layers respectively formed on the first conductive layers. The second insulative unit is formed between the first conductive layers and between the second conductive layers.
摘要翻译：用于在不使用引线接合工艺的情况下实现面朝下电连接的半导体芯片封装结构包括封装单元，半导体芯片，基板单元，第一绝缘单元，第一导电单元，第二导电单元和第二导电单元绝缘单位半导体芯片具有多个导电焊盘。第一绝缘单元具有形成在导电焊盘之间的第一绝缘层。第一导电单元具有多个第一导电层，并且每个第一导电层的一侧与相应的导电焊盘电连接。第二导电单元具有分别形成在第一导电层上的多个第二导电层。第二绝缘单元形成在第一导电层之间和第二导电层之间。

24. 发明申请

US20090261368A1 LED CHIP PACKAGE STRUCTURE USING A SUBSTRATE AS A LAMPSHADE AND METHOD FOR MAKING THE SAME 有权
标题翻译：使用基板作为焊盘的LED芯片封装结构及其制造方法
公开(公告)号：US20090261368A1
公开(公告)日：2009-10-22
申请号：US12243026
申请日：2008-10-01
申请人： BILY WANG , SHIH-YU WU , WEN-KUEI WU
发明人： BILY WANG , SHIH-YU WU , WEN-KUEI WU
IPC分类号： H01L33/00 , H01L21/50
CPC分类号： H05K1/189 , F21K9/68 , H01L25/0753 , H01L33/46 , H01L33/60 , H01L2924/0002 , H05K1/0274 , H05K1/056 , H05K2201/047 , H05K2201/09036 , H05K2201/2054 , H05K2203/302 , H01L2924/00
摘要： An LED chip package structure using a substrate as a lampshade includes a substrate unit and a light-emitting unit. The substrate unit has a substrate body with a lampshade shape. The light-emitting unit has a plurality of light-emitting elements electrically disposed on an inner surface of the substrate body. Therefore, one part of light beams projected by the light emitting elements is reflected out of the lampshade by the inner surface of the substrate body.
摘要翻译：使用基板作为灯罩的LED芯片封装结构包括基板单元和发光单元。基板单元具有带灯罩形状的基板主体。发光单元具有多个发光元件，电子设置在基板主体的内表面上。因此，由发光元件投影的光束的一部分被基板主体的内表面反射出灯罩。

25. 发明申请

US20090230538A1 SEMICONDUCTOR CHIP PACKAGE STRUCTURE FOR ACHIEVING FACE-UP ELECTRICAL CONNECTION WITHOUT USING A WIRE-BONDING PROCESS AND METHOD FOR MAKING THE SAME 审中-公开
标题翻译：用于实现无缝连接电路的半导体芯片封装结构，不使用线形焊接工艺及其制造方法
公开(公告)号：US20090230538A1
公开(公告)日：2009-09-17
申请号：US12243274
申请日：2008-10-01
申请人： BILY WANG , SUNG-YI HSIAO , YUN-HAO CHANG , JACK CHEN
发明人： BILY WANG , SUNG-YI HSIAO , YUN-HAO CHANG , JACK CHEN
IPC分类号： H01L23/12 , H01L21/50
CPC分类号： H01L33/62 , H01L21/6835 , H01L23/3121 , H01L24/19 , H01L24/96 , H01L24/97 , H01L33/486 , H01L2221/68359 , H01L2224/0401 , H01L2224/04105 , H01L2224/16 , H01L2224/20 , H01L2224/48091 , H01L2224/48247 , H01L2924/01027 , H01L2924/01056 , H01L2924/01057 , H01L2924/01078 , H01L2924/12041 , H01L2924/14 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor chip package structure for achieving face-up electrical connection without using a wire-bonding process includes a package unit, a semiconductor chip, a substrate unit, a first insulative unit, a first conductive unit, a second conductive unit, and a second insulative unit. The package unit has a central receiving groove and an outer receiving groove formed around the central receiving groove. The semiconductor chip has a plurality of conductive pads. The first insulative unit has a first insulative layer formed between the conductive pads. The first conductive unit has a plurality of first conductive layers. The second conductive unit has a plurality of second conductive layers formed on the first conductive layers. The second insulative unit is formed between the first conductive layers and between the second conductive layers.
摘要翻译：用于在不使用引线接合工艺的情况下实现面朝上电连接的半导体芯片封装结构包括封装单元，半导体芯片，基板单元，第一绝缘单元，第一导电单元，第二导电单元和第二导电单元绝缘单位封装单元具有中心接收槽和围绕中央接收槽形成的外部接收槽。半导体芯片具有多个导电焊盘。第一绝缘单元具有形成在导电焊盘之间的第一绝缘层。第一导电单元具有多个第一导电层。第二导电单元具有形成在第一导电层上的多个第二导电层。第二绝缘单元形成在第一导电层之间和第二导电层之间。

26. 发明申请

US20090213378A1 Method for calculating out an optimum arrangement pitch between each two LED chip package units 有权
标题翻译：用于计算每两个LED芯片封装单元之间的最佳布置间距的方法
公开(公告)号：US20090213378A1
公开(公告)日：2009-08-27
申请号：US12285178
申请日：2008-09-30
申请人： Bily Wang , Shih-Yu Wu , Wen-Kuei Wu
发明人： Bily Wang , Shih-Yu Wu , Wen-Kuei Wu
IPC分类号： G01B11/00
CPC分类号： G01B11/14
摘要： A method for calculating out an optimum arrangement pitch between each two LED chip package units, including: providing a backlight module with a predetermined brightness value and a predetermined material information that a customer needs; determining what brightness level and amount of LED chip package units need to be used by a designer according to the brightness value and the material information of the backlight module; and dividedly arranging the LED chip package units determined by the designer on a light-entering area of the backlight module in order to define what the optimum arrangement pitch between each two LED chip package units is.
摘要翻译：一种用于计算每个两个LED芯片封装单元之间的最佳布置间距的方法，包括：提供具有预定亮度值的背光模块和客户需要的预定材料信息; 根据背光模块的亮度值和材料信息确定设计者需要使用什么亮度级别和数量的LED芯片封装单元; 并且将由设计者确定的LED芯片封装单元分开地布置在背光模块的光进入区域上，以便限定每个两个LED芯片封装单元之间的最佳布置间距。

27. 发明申请

US20090190124A1 Uniform light generating system for testing an image-sensing device and method of using the same 有权
标题翻译：用于测试图像感测装置的均匀光产生系统及其使用方法
公开(公告)号：US20090190124A1
公开(公告)日：2009-07-30
申请号：US12285191
申请日：2008-09-30
申请人： Bily Wang , Kuei-Pao Chen , Chih-Ming Wang
发明人： Bily Wang , Kuei-Pao Chen , Chih-Ming Wang
IPC分类号： G01J1/10 , G02B27/40
CPC分类号： G01J1/10 , G01J1/0271 , G01J1/04 , G01J1/0411 , G01J1/0422 , G01J1/08 , G01J2001/083 , G01M11/0264 , G02B19/0028 , G02B19/0066 , G02B27/0977 , G02B27/0994
摘要： A uniform light generating system for testing an image-sensing device includes a light-generating unit, a light-transmitting unit, a light-diffusing unit, and a lens unit. The light-generating unit has a substrate and a plurality of light-emitting elements electrically disposed on the substrate. The light-transmitting unit has one side communicated with the light-generating unit for receiving and uniformizing light beams projected from the light-emitting elements. The light-diffusing unit has one side disposed on the other side of the light-transmitting unit for receiving and diffusing the light beams that have passed through the light-transmitting unit. The lens unit is disposed on the other side of the light-diffusing unit for transmitting the light beams that have passed through the light-diffusing unit to the image-sensing device.
摘要翻译：用于测试图像感测装置的均匀光产生系统包括发光单元，光发射单元，光漫射单元和透镜单元。光产生单元具有基板和电气设置在基板上的多个发光元件。光发射单元具有与发光单元连通的用于接收并均匀化从发光元件投射的光束的一侧。光漫射单元的一侧设置在透光单元的另一侧，用于接收并扩散已经通过光发射单元的光束。透镜单元设置在光漫射单元的另一侧，用于将已经通过光漫射单元的光束传输到图像感测装置。

28. 发明申请

US20080246397A1 MANUFACTURING METHOD OF WHITE LIGHT LED AND STRUCTURE THEREOF 审中-公开
标题翻译：白光LED及其结构的制造方法
公开(公告)号：US20080246397A1
公开(公告)日：2008-10-09
申请号：US11696220
申请日：2007-04-04
申请人： Bily Wang , Jonnie Chuang , Chia-Hung Chen
发明人： Bily Wang , Jonnie Chuang , Chia-Hung Chen
IPC分类号： H01J99/00 , H01J9/26
CPC分类号： H01L33/505 , H01L33/486 , H01L33/507 , H01L33/52 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A manufacturing method of white light LED and a structure thereof include first, a substrate being prepared to be formed as a consecutively connected holder, on a first electrode of which non-conductive fluorescent glue is coated to form a fluorescent layer, on which a blue light chip is fixed; second, two conducting wires being welded onto the chip and electrically connected to both the first electrode and the second electrode of the holder respectively, finally, glue body encapsulating the holder, the fluorescent layer, the chip, and the two conducting wires to form a photic zone, over which a frame body encloses; furthermore, a window being formed on the frame body and provided for making the photic zone exposed. When blue light chip is excited to generate blue light, which will further excite the fluorescent layer to emit yellow light, then both blue light and yellow light will be dispersed through the photic zone to generate a uniform light source, which may output light longitudinally and collectively, making the output power promoted notably and the lightness enhanced significantly.
摘要翻译：白光LED的制造方法及其结构首先在准备形成为连续保持器的基板上，在其上涂布非导电荧光胶的第一电极上形成荧光层，蓝色光芯片固定; 第二，将两根导线焊接在芯片上，分别与保持器的第一电极和第二电极两者电连接，最后将胶体封装在保持器，荧光层，芯片和两根导线上，形成一个框架主体围绕着它; 此外，窗框形成在框架体上并被设置用于使光区暴露。当蓝光芯片被激发以产生蓝光，这将进一步激发荧光层发出黄光，则蓝光和黄光将通过光区分散以产生均匀的光源，其可以纵向输出光，共同推动输出功率显着提升，亮度明显增强。

29. 发明申请

US20080099778A1 LED package structure for increasing light-emitting effiency and method of packaging the same 有权
标题翻译： LED封装结构，提高发光效率和封装方法
公开(公告)号：US20080099778A1
公开(公告)日：2008-05-01
申请号：US11588399
申请日：2006-10-27
申请人： Bily Wang , Jonnie Chuang , Chi-Wen Hung
发明人： Bily Wang , Jonnie Chuang , Chi-Wen Hung
IPC分类号： H01L33/00 , G09F9/33
CPC分类号： H01L33/56 , H01L25/167 , H01L33/505 , H01L33/54 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16245 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An LED package structure for increasing light-emitting efficiency includes: a substrate unit, and a plurality of fluorescence colloid units, LED units, conductive units and opaque units. The substrate unit has a main body and a plurality of through holes passing through the main body. Each fluorescence colloid unit is received in the corresponding through hole and having an installed surface. Each LED unit has a light-emitting surface disposed on the corresponding fluorescence colloid unit and facing the installed surface of the corresponding fluorescence colloid units. Each conductive unit is electrically connected between each two electrode areas that have the same pole and are respectively arranged on each LED unit and the main body. Each opaque unit is disposed on two corresponding lateral faces of the main body for covering the installed surface of the corresponding fluorescence colloid unit, the corresponding LED unit, and the corresponding conductive units.
摘要翻译：用于提高发光效率的LED封装结构包括：基板单元和多个荧光胶体单元，LED单元，导电单元和不透明单元。基板单元具有主体和穿过主体的多个通孔。每个荧光胶体单元被接收在相应的通孔中并具有安装表面。每个LED单元具有设置在相应的荧光胶体单元上并面对相应的荧光胶体单元的安装表面的发光表面。每个导电单元电连接在具有相同极点并且分别布置在每个LED单元和主体上的每个两个电极区域之间。每个不透明单元设置在主体的两个对应的侧面上，用于覆盖相应的荧光胶体单元的安装表面，相应的LED单元和相应的导电单元。

30. 发明申请

US20080000120A1 Color-mixture display unit and image display apparatus using the same 有权
标题翻译：混色显示单元和使用其的图像显示装置
公开(公告)号：US20080000120A1
公开(公告)日：2008-01-03
申请号：US11476165
申请日：2006-06-28
申请人： Bily Wang , Hui-Chung Lin
发明人： Bily Wang , Hui-Chung Lin
IPC分类号： G09F13/00
CPC分类号： G09F13/22
摘要： The present invention is related to a color-mixture display unit and an image display apparatus using the same, wherein the image display apparatus includes at least one color-mixture pixel which is pre-disposed at plates of a light box so that a pattern is formed. Each of the color-mixture pixels is equipped with a red filter, a green filter and a blue filter, or equipped with a black filter or equipped with a transparent filter. At least one color-mixture LED is disposed within the light box and provides a backlight for the color-mixture pixel. In this regard, the color-mixture LEDs are controlled by an image controller and provide various color light beams with the color-mixture pixels. In addition, arrangement of each color filter within the color-mixture pixel is utilized so that color-mixture effect of dynamic image is shown.
摘要翻译：本发明涉及一种彩色混合显示单元和使用该彩色混合显示单元的图像显示装置，其中该图像显示装置包括至少一个颜色混合像素，其预先设置在灯箱的板上，使得图案是形成。每个混色像素配备有红色滤光器，绿色滤光片和蓝色滤光片，或配备有黑色滤光片或配有透明滤光片。至少一个颜色混合LED设置在灯箱内，并提供用于混色像素的背光。在这方面，混色LED由图像控制器控制并且提供具有颜色混合像素的各种彩色光束。此外，利用颜色混合像素内的每个滤色器的布置，以显示动态图像的混色效果。

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