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    • 23. 发明申请
    • INTEGRATED CIRCUIT FUSE ARRAY
    • 集成电路保险丝阵列
    • US20080212388A1
    • 2008-09-04
    • US11681424
    • 2007-03-02
    • Alexander B. Hoefler
    • Alexander B. Hoefler
    • G11C17/18
    • G11C17/16G11C17/18
    • The fuse array described herein is very compact and uses little semiconductor area because of its crosspoint architecture. The disclosed crosspoint architecture reduces the number of conductors that must be run horizontally or vertically through each bit cell. As a result, the area required for each bit cell is significantly reduced. In one embodiment, a selected set of voltages on various wordlines and bitlines are used to program the fuses to produce programmed fuses having a tighter distribution of impedances. Similarly, a selected set of voltages on various wordlines and bitlines are used to read the fuses.
    • 这里描述的熔丝阵列是非常紧凑的,由于其交叉点架构而使用很少的半导体区域。 所公开的交叉点架构减少了必须通过每个位单元水平或垂直运行的导体的数量。 结果,每个位单元所需的面积显着减小。 在一个实施例中,使用各种字线和位线上的所选择的一组电压来对保险丝编程以产生具有更紧密的阻抗分布的编程保险丝。 类似地,使用各种字线和位线上的一组选定的电压来读取保险丝。
    • 25. 发明授权
    • Compact non-volatile memory array with reduced disturb
    • 紧凑型非易失性存储阵列,减少干扰
    • US07161822B2
    • 2007-01-09
    • US11068625
    • 2005-02-28
    • Alexander B. Hoefler
    • Alexander B. Hoefler
    • G11C5/06
    • H01L27/115G11C16/0433
    • A non-volatile memory (NVM) array is made of NVM cells that have a floating gate transistor and a select transistor in which the floating gate transistor requires only a single layer of polysilicon. Adjacent cells are arranged so that the floating gates are staggered rather than being in the same line. This results in being able to put the cells closer together because of the reduction of the significance of what is commonly called poly-to-poly spacing. In this case, the termination of one floating gate is not lined-up with the floating gate of the adjacent NVM cell in the same row. Adjacent memory cells in the same column are made to have different configurations from each other which results in the floating gates in adjacent columns not being aligned, thus avoiding the poly-to-poly spacing limitation.
    • 非易失性存储器(NVM)阵列由具有浮置栅极晶体管和选择晶体管的NVM单元制成,其中浮栅晶体管仅需要单层多晶硅。 相邻的电池被布置成使得浮动栅极交错而不是在同一条线上。 这导致能够将细胞更靠近在一起,因为通常称为多聚 - 间隔的意义的降低。 在这种情况下,一个浮动栅极的端接不与相邻NVM单元的浮动栅极排列在同一行中。 相同列中的相邻存储器单元被制成具有彼此不同的配置,这导致相邻列中的浮动栅极不对准,从而避免了多对多间隔限制。
    • 26. 发明授权
    • Program and erase in a thin film storage non-volatile memory
    • 在薄膜存储非易失性存储器中编程和擦除
    • US06791883B2
    • 2004-09-14
    • US10178658
    • 2002-06-24
    • Craig T. SwiftJane A. YaterAlexander B. HoeflerKo-Min ChangErwin J. PrinzBruce L. Morton
    • Craig T. SwiftJane A. YaterAlexander B. HoeflerKo-Min ChangErwin J. PrinzBruce L. Morton
    • G11C1600
    • G11C16/0466
    • A non-volatile memory having a thin film dielectric storage element is programmed by hot carrier injection (HCI) and erased by tunneling. The typical structure for the memory cells for this type of memory is silicon, oxide, nitride, oxide, and silicon (SONOS). The hot carrier injection provides relatively fast programming for SONOS, while the tunneling provides for erase that avoids the difficulties with the hot hole erase (HHE) type erase that generally accompanies hot carrier injection for programming. HHE is significantly more damaging to dielectrics leading to reliability issues. HHE also has a relatively narrow area of erasure that may not perfectly match the pattern for the HCI programming leaving an incomplete erasure. The tunnel erase effectively covers the entire area so there is no concern about incomplete erase. Although tunnel erase is slower than HHE, erase time is generally less critical in a system operation than is programming time.
    • 具有薄膜电介质存储元件的非易失性存储器通过热载流子注入(HCI)编程并通过隧道擦除。 这种存储器的存储单元的典型结构是硅,氧化物,氮化物,氧化物和硅(SONOS)。 热载波注入为SONOS提供相对快速的编程,而隧道提供擦除,避免了通常伴随热载流子注入进行编程的热孔擦除(HHE)类型擦除的困难。 HHE对电介质的破坏性更大,导致可靠性问题。 HHE还具有相对较窄的擦除区域,可能不完全匹配HCI编程的模式,从而导致不完整的擦除。 隧道擦除有效地覆盖整个区域,所以不用担心不完全擦除。 虽然隧道擦除比HHE慢,但擦除时间在系统操作中通常不如编程时间那么重要。
    • 28. 发明授权
    • Non-volatile memory device having an anti-punch through (APT) region
    • 具有抗冲穿(APT)区域的非易失性存储器件
    • US06713812B1
    • 2004-03-30
    • US10267199
    • 2002-10-09
    • Alexander B. HoeflerGowrishankar L. ChindalorePaul A. IngersollCraig T. Swift
    • Alexander B. HoeflerGowrishankar L. ChindalorePaul A. IngersollCraig T. Swift
    • H01L29788
    • H01L29/66825H01L27/11521H01L29/105H01L29/66833H01L29/792
    • A memory device (70) that uses a non-volatile storage element (38), such as nitride, has reduced read disturb, which is the problem of tending to increase the threshold voltage of a memory device (70) during a read. To reduce this effect, the memory device (70) uses a counterdoped channel (86) to lower the natural threshold voltage of the device (70). This counterdoping can even be of sufficient dosage to reverse the conductivity type of the channel (86) and causing a negative natural threshold voltage. This allows for a lower gate voltage during read to reduce the adverse effect of performing a read. An anti-punch through (ATP) region (74) below the channel (86) allows for the lightly doped or reversed conductivity type channel (86) to avoid short channel leakage. A halo implant (46) on the drain side (54, 53) assists in hot carrier injection (HCI) so that the HCI is effective even though the channel (86) is lightly doped or of reversed conductivity type.
    • 使用诸如氮化物的非易失性存储元件(38)的存储器件(70)具有减少的读取干扰,这是读取期间倾向于增加存储器件(70)的阈值电压的问题。 为了减少这种影响,存储装置(70)使用反向通道(86)来降低装置(70)的自然阈值电压。 这种反渗透甚至可以具有足够的剂量来反转通道(86)的导电类型并导致负的自然阈值电压。 这在读取期间允许较低的栅极电压以减少执行读取的不利影响。 在沟道(86)下方的抗穿透(ATP)区域(74)允许轻掺杂或反向导电型通道(86)避免短沟道泄漏。 漏极侧(54,53)上的卤素注入(46)有助于热载流子注入(HCI),使得尽管通道(86)被轻掺杂或反向导电类型,HCI也是有效的。
    • 29. 发明申请
    • Address Fault Detection Circuit
    • 地址故障检测电路
    • US20160027529A1
    • 2016-01-28
    • US14339049
    • 2014-07-23
    • Alexander B. HoeflerScott I. RemingtonShayan Zhang
    • Alexander B. HoeflerScott I. RemingtonShayan Zhang
    • G11C29/02G11C11/418
    • G11C29/785G11C8/08G11C11/408G11C11/4087G11C11/41G11C11/418G11C29/024G11C29/808G11C2029/1202
    • A semiconductor memory device and method of operation are provided for a multi-bank memory array (100) with an address fault detector circuit (24, 28) connected to split word lines (WLn-WLm) across multiple banks, where the address fault detector circuit includes at least a first MOSFET transistor (51-54) connected to each word line for detecting an error-free operation mode and a plurality of different transient address faults including a “no word line select,” “false word line select,” and “multiple word line select” failure mode at one of the first and second memory banks. In selected embodiments, the address fault detector provides resistive coupling (33-40) between split word lines across multiple banks to create interaction or contention between split word lines to create a unique voltage level on a fault detection bit line during an address fault depending on the fault type.
    • 提供一种半导体存储器件和操作方法,用于具有连接到多个存储体上的分割字线(WLn-WLm)的地址故障检测器电路(24,28)的多存储体存储器阵列(100),其中地址故障检测器 电路至少包括连接到每个字线的第一MOSFET晶体管(51-54),用于检测无错误操作模式和多个不同的瞬态地址故障,包括“无字线选择”,“假字线选择” 和第一和第二存储体之一的“多字线选择”故障模式。 在选择的实施例中,地址故障检测器在多个分组之间的分离字线之间提供电阻耦合(33-40),以产生分离字线之间的相互作用或竞争,以在地址故障期间根据故障检测位线创建唯一的电压电平,这取决于 故障类型。