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21. 发明授权

US09190307B2 Apparatus for transferring a solar wafer or solar cell during its fabrication 有权
标题翻译：用于在其制造期间传送太阳能晶片或太阳能电池的装置
公开(公告)号：US09190307B2
公开(公告)日：2015-11-17
申请号：US13397820
申请日：2012-02-16
申请人： Lian Hok Tan , Wen Ge Tu
发明人： Lian Hok Tan , Wen Ge Tu
IPC分类号： H01L31/18 , H01L21/677 , H01L21/683
CPC分类号： H01L21/67766 , H01L21/6838 , H01L31/18
摘要： An apparatus for transferring a solar wafer or cell is disclosed, which comprises: i) a rotary motor; ii) a gripper for holding the solar wafer or cell; and a rotary arm connected between the rotary motor and the gripper, the rotary arm being drivable by the rotary motor in a first rotary direction through a transfer angle for transferring the solar wafer or cell between different positions. In particular, the apparatus further comprises an angle-compensating device configured to drive the gripper through a same transfer angle as the rotary arm in a second rotary direction opposite to the first rotary direction, to ensure that an angular orientation of the solar wafer or cell remains constant during rotation of the rotary arm.
摘要翻译：公开了一种用于转移太阳能晶片或电池的装置，包括：i）旋转电动机; ii）用于保持太阳能晶片或电池的夹持器; 以及旋转臂，其连接在所述旋转马达和所述夹持器之间，所述旋转臂由所述旋转马达在第一旋转方向上通过用于在不同位置之间传递所述太阳能晶片或者单元的转移角度驱动。特别地，该装置还包括角度补偿装置，其被构造成在与第一旋转方向相反的第二旋转方向上以与旋转臂相同的转移角度驱动夹持器，以确保太阳能晶片或细胞的角度取向在旋转臂旋转期间保持恒定。

22. 发明授权

US09016675B2 Apparatus and method for supporting a workpiece during processing 有权
标题翻译：在加工过程中支撑工件的装置和方法
公开(公告)号：US09016675B2
公开(公告)日：2015-04-28
申请号：US13542785
申请日：2012-07-06
申请人： Chi Wah Cheng , Lap Kei Chow , Chi Hang Leung
发明人： Chi Wah Cheng , Lap Kei Chow , Chi Hang Leung
IPC分类号： B25B11/00 , C23C16/00 , C23F1/00 , B24B7/00 , B24B9/00 , B28D5/00 , H01L21/67 , H01L21/687 , H01L21/683
CPC分类号： B28D5/0094 , H01L21/67126 , H01L21/6838 , H01L21/68792 , Y10T29/49998
摘要： An apparatus for supporting a workpiece during processing of the workpiece is disclosed. The apparatus comprises: a chassis having a vacuum chamber that is connectable to a vacuum source; a supporting device rotatable relative to the chassis, the supporting device having a hollow compartment and a supporting surface for holding the workpiece; and at least one sealing device arranged between the chassis and the supporting device, to provide an air-tight seal between the chassis and the supporting device while allowing for rotation of the supporting device with respect to the chassis, so as to form a vacuum passage extending from the supporting surface of the supporting device through the hollow compartment of the supporting device and the vacuum chamber of the chassis to the vacuum source, to thereby hold the workpiece to the supporting surface of the supporting device during processing of the workpiece.
摘要翻译：公开了一种用于在加工工件期间支撑工件的装置。该装置包括：具有可连接到真空源的真空室的底架; 支撑装置可相对于底盘旋转，支撑装置具有中空隔室和用于保持工件的支撑表面; 以及布置在底盘和支撑装置之间的至少一个密封装置，以在底架和支撑装置之间提供气密密封，同时允许支撑装置相对于底盘旋转，以便形成真空通道从支撑装置的支撑表面延伸穿过支撑装置的中空隔室和底盘的真空室到真空源，从而在工件加工期间将工件保持在支撑装置的支撑表面上。

23. 发明授权

US08985305B2 Vibration feeding apparatus and method 有权
标题翻译：振动给料装置及方法
公开(公告)号：US08985305B2
公开(公告)日：2015-03-24
申请号：US13593606
申请日：2012-08-24
申请人： Ho Chi Wong , Ping Kong Choy , Chung Yin Lau , Xiao Feng Li
发明人： Ho Chi Wong , Ping Kong Choy , Chung Yin Lau , Xiao Feng Li
IPC分类号： B65G47/256 , B65G27/04 , B65G47/14
CPC分类号： B65G47/256 , B65G27/04 , B65G47/1421
摘要： A vibration feeding apparatus comprises an alignment track that is operative to receive electronic components and to arrange the electronic components in a desired orientation by vibrating and accelerating the electronic components located on the alignment track. An inspection station rejects electronic components that are not in the desired orientation onto a reject track for reintroduction to the alignment track. A spreading unit adjacent to the alignment track then transfers rejected electronic components from the reject track to the alignment track for arranging the electronic components in the desired orientation.
摘要翻译：振动给料装置包括对准轨道，其可操作以接收电子部件并且通过振动和加速位于对准轨道上的电子部件来将电子部件布置成期望的取向。检查站拒绝不在期望方向上的电子部件到拒收轨道上以重新引入对准轨道。与对准轨道相邻的扩展单元然后将被拒绝的电子部件从拒绝轨道传送到对准轨道，用于将电子部件布置在期望的方位。

24. 发明授权

US08933720B2 Apparatus for conducting automated maintenance of a test contactor module 有权
标题翻译：用于进行自动维护测试接触器模块的装置
公开(公告)号：US08933720B2
公开(公告)日：2015-01-13
申请号：US13370713
申请日：2012-02-10
申请人： Yui Kin Tang , Chak Tong Sze , Pei Wei Tsai , Cho Hin Cheuk , Kut Lam
发明人： Yui Kin Tang , Chak Tong Sze , Pei Wei Tsai , Cho Hin Cheuk , Kut Lam
IPC分类号： G01R31/20 , G01R31/00
CPC分类号： G01R3/00 , G01R31/2601 , G01R31/2635
摘要： An apparatus for maintaining a conductivity of electrical contacts of a test contactor for testing electronic devices comprises a rotary turret disk having a plurality of test stands operative to hold respective electronic devices, the electronic devices being rotatable by the rotary turret disk to a position of the test contactor to be contacted by the electrical contacts during testing. At least one contactor maintenance stand comprising a maintenance component is located between adjacent test stands on the rotary turret disk, wherein the electrical contacts of the test contactor are adapted to engage the maintenance component so as to automatically clean the electrical contacts and/or verify the conductivity thereof.
摘要翻译：用于维持用于测试电子设备的测试接触器的电触点的导电性的装置包括具有多个测试台的旋转转盘盘，其可操作以保持相应的电子设备，电子设备可由旋转转盘盘旋转到试验接触器在测试期间由电气触点接触。包括维护部件的至少一个接触器维护支架位于旋转转盘盘上的相邻测试台之间，其中测试接触器的电触点适于接合维护部件，以便自动清洁电触点和/或验证电导率。

25. 发明授权

US08875979B2 Apparatus and method for determining an alignment of a bondhead of a die bonder relative to a workchuck 有权
标题翻译：用于确定管芯接合器相对于工件的接合头的对准的装置和方法
公开(公告)号：US08875979B2
公开(公告)日：2014-11-04
申请号：US13463970
申请日：2012-05-04
申请人： Chung Sheung Yung , Chi Ming Chong , Gary Peter Widdowson
发明人： Chung Sheung Yung , Chi Ming Chong , Gary Peter Widdowson
IPC分类号： B23K20/00 , B23K20/02 , B23K31/12 , B23K31/02
CPC分类号： H01L24/75 , B23K2101/40 , H01L2224/757 , H01L2224/75901
摘要： Disclosed is an apparatus for determining an alignment of a bondhead of a die bonder relative to a workchuck. Specifically, the apparatus comprises: i) a sensor configured to measure a distance between the bondhead and the sensor; and ii) a positioning device coupled to the sensor, the positioning device being configured to position the sensor relative to a plurality of locations on the bondhead facing the sensor. In particular, the sensor is operative to measure a set of distances between each of the plurality of locations on the bondhead and the sensor, the set of distances being for determining the alignment of the bondhead. A method of determining an alignment of a bondhead of a die bonder relative to a workchuck is also disclosed.
摘要翻译：公开了一种用于确定管芯接合器相对于工件的接合头的对准的装置。具体地，该装置包括：i）被配置为测量接合头和传感器之间的距离的传感器; 以及ii）联接到所述传感器的定位装置，所述定位装置被配置为相对于面向所述传感器的所述接合头上的多个位置定位所述传感器。特别地，传感器用于测量接合头上的多个位置和传感器之间的距离集合，该距离集合用于确定接合头的对准。还公开了一种确定管芯接合器相对于工作台的接合头的对准的方法。

26. 发明授权

US08821659B2 Apparatus and method for real-time alignment and lamination of substrates 有权
标题翻译：用于基板实时对准和层压的装置和方法
公开(公告)号：US08821659B2
公开(公告)日：2014-09-02
申请号：US13470736
申请日：2012-05-14
申请人： Man Chung Ng , Man Lai Chau
发明人： Man Chung Ng , Man Lai Chau
IPC分类号： B32B41/00 , G02F1/1333
CPC分类号： G02F1/1333 , B32B37/12 , B32B38/1841 , B32B2457/12 , B32B2457/20 , G02F1/13336 , G02F2001/133354
摘要： Real-time alignment of substrates is conducted by way of placing a first substrate together with a second substrate located over the first substrate in a fixed relative position onto a first substrate holder. The first substrate holder is operative to support the first substrate. A second substrate holder is operative to contact and control the position of the second substrate relative to the first substrate. A pattern recognition system is operative to view reference marks on the first and second substrates for determining their relative alignment, and a positioning mechanism coupled to the first substrate holder and/or the second substrate holder will align the first substrate relative to the second substrate based on their relative alignment as determined by the pattern recognition system. Thereafter, the substrates are fully laminated to secure them to each other.
摘要翻译：通过将第一衬底与位于第一衬底上的第二衬底固定在相对位置上的第一衬底保持器上进行，来实现衬底的实时对准。第一衬底保持器用于支撑第一衬底。第二衬底保持器用于接触和控制第二衬底相对于第一衬底的位置。模式识别系统可操作以查看第一和第二基板上的参考标记，以确定其相对对准，并且耦合到第一基板保持器和/或第二基板保持器的定位机构将基于第一基板相对于第二基板在由模式识别系统确定的相对对准上。此后，基板被完全层压以将它们固定在一起。

27. 发明授权

US08538576B2 Method of configuring a dicing device, and a dicing apparatus for dicing a workpiece 有权
标题翻译：配置切割装置的方法以及用于切割工件的切割装置
公开(公告)号：US08538576B2
公开(公告)日：2013-09-17
申请号：US13080009
申请日：2011-04-05
申请人： Chi Wah Cheng , Lap Kei Chow , Man Kin Leung , Hoi Shuen Tang
发明人： Chi Wah Cheng , Lap Kei Chow , Man Kin Leung , Hoi Shuen Tang
IPC分类号： G06F17/50
CPC分类号： B28D5/029
摘要： A method of configuring a dicing device 101, which dices along a cutting line of a workpiece 111 according to a dicing step, is disclosed. Numerical input of a dicing order of the dicing device 101 to dice a workpiece 111 is time-consuming and prone to errors. The disclosed method comprises the step of depicting a graphical user interface 202, which includes a layout 203 of the workpiece 111 that further includes a plurality of cut lines relating to respective cutting lines along the workpiece 111. The disclosed method further comprises the step of graphically contacting a cut line from the layout 203 through a user-interface device 201, to allow selection of the cut line before the selected cut line is assigned to the dicing step of the dicing device 101. By providing the plurality of cut lines in the layout 203 that are graphically contactable through the user-interface device 201, the method advantageously allows an easier process of configuring the dicing step of the dicing device 101. Also disclosed are a dicing apparatus for dicing a workpiece 111, as well as a computer-readable medium having a computer program for instructing a computer to perform the disclosed method.
摘要翻译：公开了一种根据切割步骤配置沿着工件111的切割线切割的切割装置101的方法。切割装置101切割工件111的切割顺序的数字输入是耗时的并且容易出错。所公开的方法包括描绘图形用户界面202的步骤，其包括工件111的布局203，其还包括与沿着工件111的相应切割线相关的多条切割线。所公开的方法还包括图形化的步骤通过用户界面装置201从布局203接触切割线，以允许在将所选择的切割线分配给切割装置101的切割步骤之前选择切割线。通过在布局中提供多条切割线 203通过用户界面装置201图形地可接触，该方法有利地允许配置切割装置101的切割步骤的更简单的过程。还公开了一种用于将工件111切割的切割装置以及计算机可读介质具有用于指示计算机执行所公开的方法的计算机程序。

28. 发明申请

US20130180957A1 METHOD OF RECOVERING A BONDING APPARATUS FROM A BONDING FAILURE 有权
标题翻译：从接合故障中恢复接合装置的方法
公开(公告)号：US20130180957A1
公开(公告)日：2013-07-18
申请号：US13350363
申请日：2012-01-13
申请人： Wai Wah LEE , Jun Feng LI , Wei Boon WONG , Soo Kin Kenny TAN
发明人： Wai Wah LEE , Jun Feng LI , Wei Boon WONG , Soo Kin Kenny TAN
IPC分类号： B23H1/00 , B23K1/018
CPC分类号： B23K20/007 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/48091 , H01L2224/78268 , H01L2224/78301 , H01L2224/85181 , H01L2224/85205 , H01L2224/859 , H01L2924/00014 , H01L2924/01327 , H01L2924/12036 , H01L2224/45099 , H01L2224/484 , H01L2924/00
摘要： A method of recovering a bonding apparatus from a bonding failure to resume a normal operating state for semiconductor chip fabrication is disclosed. The bonding apparatus comprises: i) a bonding tool for bonding a wire between a semiconductor chip and a substrate; and ii) a position sensor. Specifically, the method comprises the steps of: a) the position sensor determining a position of the bonding tool when the bonding tool contacts a surface to bond the wire to the substrate; b) the bonding apparatus detecting a bonding failure caused by detachment of the semiconductor from the substrate based on the position of the bonding tool; and c) the bonding apparatus detaching the semiconductor chip from the wire.
摘要翻译：公开了一种从接合故障恢复接合装置以恢复用于半导体芯片制造的正常操作状态的方法。接合装置包括：i）用于将导线接合在半导体芯片和基板之间的接合工具; 和ii）位置传感器。具体地说，该方法包括以下步骤：a）位置传感器确定接合工具在接合工具接触表面时的位置，以将线接合到衬底; b）接合装置基于接合工具的位置检测由半导体从基板脱离而引起的接合故障; 以及c）所述接合装置将所述半导体芯片与所述导线分开。

29. 发明申请

US20130178002A1 METHOD AND APPARATUS FOR FABRICATING A LIGHT-EMITTING DIODE PACKAGE 有权
标题翻译：用于制造发光二极管封装的方法和装置
公开(公告)号：US20130178002A1
公开(公告)日：2013-07-11
申请号：US13347388
申请日：2012-01-10
申请人： Kui Kam LAM , Ka Yee MAK , Yiu Yan WONG , Ming LI
发明人： Kui Kam LAM , Ka Yee MAK , Yiu Yan WONG , Ming LI
IPC分类号： H01L33/50 , B05C9/14
CPC分类号： H01L33/50 , H01L2224/48091 , H01L2924/15311 , H01L2933/0041 , H01L2924/00014
摘要： Method and apparatus for fabricating a light-emitting diode package Disclosed is a method of fabricating a light-emitting diode package, which comprises a light-emitting chip operative to emit light of a first wavelength range. The method comprises the steps of: dispensing a photoluminescent mixture on the light-emitting chip, the photoluminescent mixture being capable of absorbing a portion of light of the first wavelength range emitted from the light-emitting chip to re-emit light of a second wavelength range; partially curing the photoluminescent mixture by heating the photoluminescent mixture to a pre-curing temperature and then cooling the photoluminescent mixture to below the pre-curing temperature; and fully curing the photoluminescent mixture to harden the photoluminescent mixture. An apparatus for fabricating a light-emitting diode package is also disclosed.
摘要翻译：用于制造发光二极管封装的方法和装置公开了一种制造发光二极管封装的方法，其包括可发射第一波长范围的光的发光芯片。该方法包括以下步骤：在发光芯片上分配光致发光混合物，所述光致发光混合物能够吸收从发光芯片发射的第一波长范围的一部分光，以重新发射第二波长的光范围; 通过将光致发光混合物加热至预固化温度，然后将光致发光混合物冷却至预固化温度以下来部分固化光致发光混合物; 并充分固化光致发光混合物以硬化光致发光混合物。还公开了一种用于制造发光二极管封装的装置。

30. 发明申请

US20130149839A1 APPARATUS FOR BONDING SUBSTRATES TO EACH OTHER 有权
标题翻译：用于将基材与其他物质接合的装置
公开(公告)号：US20130149839A1
公开(公告)日：2013-06-13
申请号：US13323478
申请日：2011-12-12
申请人： Man Chung NG , Wai Lik CHAN , Kwok Kei WONG
发明人： Man Chung NG , Wai Lik CHAN , Kwok Kei WONG
IPC分类号： H01L21/30 , B32B38/18
CPC分类号： B32B39/00 , B32B2457/20 , H01L21/67092 , H01L21/67173 , H01L21/6776
摘要： An apparatus for bonding at least two substrates to each other comprises a plurality of substrate bonding machines arranged adjacent to one another and an input transporter extending adjacent to the plurality of substrate bonding machines which is operative to deliver the substrates to each of the substrate bonding machines. The input transporter is supplied with substrates by an onloading station. An output transporter extending adjacent to the plurality of substrate bonding machines is operative to receive bonded substrates from each of the substrate bonding machines and deliver the bonded substrates to an offloading station for removal from the apparatus.
摘要翻译：用于将至少两个基板彼此接合的装置包括彼此相邻布置的多个基板接合机和与多个基板接合机相邻延伸的输入转运器，该输送转运器可操作地将基板输送到每个基板接合机。输入输送器由加载站提供基板。与多个基板接合机相邻延伸的输出传送器可操作以从每个基板接合机接收接合的基板，并将接合的基板输送到卸载站以从设备移除。

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