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    • 12. 发明授权
    • Method of making sub-micron dimensioned NPN lateral transistor
    • 制造亚微米尺寸的NPN横向晶体管的方法
    • US4415371A
    • 1983-11-15
    • US220400
    • 1980-12-29
    • Sidney I. Soclof
    • Sidney I. Soclof
    • H01L21/8224H01L21/263H01L21/265H01L21/306H01L21/331H01L21/762H01L27/082H01L29/73H01L29/735H01L21/22H01L21/31
    • H01L21/30608H01L21/2633H01L21/26586H01L21/76237H01L29/735
    • An array of hundreds of devices may be simultaneously processed on a chip to sub-micron dimensions by establishing tiny active regions for each transistor surrounded by field oxide filled motes or slotted regions, wherein the slots are utilized to dope the substrate within the action region. The N type substrate is double energy boron planted through one surface to establish a P region to a given depth. This surface is oxidized and photoresist masked conventionally to open regions for the slots which are ion milled or ODE etched to a given depth. N+ regions are established by the slots by ion implanting at an angle such that the entire depth of the slot is not doped but rather the doping is confined to a region within the double energy P implanted depth. Drive-in diffusion enlarges the N+ areas for the emitter and collecter and oxidation fills the mote insulating regions around the active area.The oxide is stripped and the P region enhanced to P+ at the surface, with silox being deposited and opened for metal contacts to the P+ region for the base and the emitter and collector regions. The doping profile of the base region provides a potential barrier to minimize the flow of electrons toward the surface because the emitter electrons are channeled through the less heavily doped part of the base region to the collector.
    • 通过为由场氧化物填充的微粒或开槽区域围绕的每个晶体管建立微小的有源区,可以在芯片上将数百个器件的阵列同时处理为亚微米尺寸,其中所述槽用于在衬底的作用区域内掺杂。 N型衬底是通过一个表面种植的双能硼,以建立到给定深度的P区。 该表面被氧化并且光致抗蚀剂常规地掩蔽以打开用于离子研磨的槽的ODE或蚀刻到给定深度的ODE。 通过离子注入以使角度的整个深度未掺杂的角度通过离子注入来建立N +区域,而是将掺杂限制在双能量P植入深度内的区域。 驱动扩散扩大了发射器和收集器的N +面积,氧化填充了活动区域周围的微尘绝缘区域。 氧化物被剥离,并且P区在表面增强至P +,其中silox被沉积并打开用于金属接触到用于基极和发射极和集电极区域的P +区域。 基极区域的掺杂分布提供了一个势垒,以最小化电子朝向表面的流动,因为发射极电子通过基极区的较低掺杂部分被引导至集电极。
    • 14. 发明授权
    • Current hogging logic circuit with npn vertical reversal transistor and
diode/pnp vertical transistor output
    • 具有npn垂直反向晶体管和二极管/​​ pnp垂直晶体管输出的当前ho逻逻辑电路
    • US4328509A
    • 1982-05-04
    • US94119
    • 1979-11-14
    • Heinz Lehning
    • Heinz Lehning
    • H01L21/8224H01L21/331H01L27/082H01L29/73H01L29/735H03K19/088H03K19/091H03K23/00H01L29/72
    • H03K19/091H01L29/735H03K23/002
    • In an n-type base island are provided a p-type emitter stripe and a p-type output collector stripe, with one or more intermediate control collector stripes for switching the current of the output collector. The pattern of control collector stripes can provide AND functions, OR functions or combinations thereof in a single logic element in a single base island. Each output is provided with an npn current reversal transistor in a separate island and if more than one input is to be operated by the output of a logic element, decoupling and fan-out capability are provided by vertical pnp transistors driven by the inverter transistors, which do not require an island completely separate from the inverter transistor, although an isolating barrier stripe can be helpful. A bistable flipflop and a frequency divider cell are shown to illustrate the use of these logic structures. The decoupling referred to can be provided without fan-out amplification by means of diodes.
    • 在n型基岛中设置有p型发射极条和p型输出集电极条,具有用于切换输出集电极的电流的一个或多个中间控制集电极条。 控制收集器条纹的图案可以在单个基本岛中的单个逻辑元件中提供AND功能,OR函数或其组合。 每个输出端在单独的岛中设置有npn电流反向晶体管,如果多个输入由逻辑元件的输出端操作,则由反相晶体管驱动的垂直pnp晶体管提供去耦和扇出能力, 其不需要与逆变器晶体管完全分离的岛,尽管隔离屏障条可以是有帮助的。 双稳态触发器和分频器单元被示出来说明这些逻辑结构的使用。 可以通过二极管不提供扇出放大来提供所谓的去耦。