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    • 12. 发明授权
    • Electron beam proximity exposure apparatus and method
    • 电子束接近曝光装置及方法
    • US06727507B2
    • 2004-04-27
    • US09765388
    • 2001-01-22
    • Nobuo ShimazuTakao Utsumi
    • Nobuo ShimazuTakao Utsumi
    • H01J3700
    • B82Y10/00B82Y40/00G21K1/08H01J37/3174H01J2237/31788
    • The electron beam proximity exposure apparatus comprises: an electron beam source which emits an electron beam; an electron beam shaping device which shapes the electron beam; a mask which has an aperture and is disposed on a path of the shaped electron beam; a deflecting and scanning device which deflects the electron beam to scan the mask with the shaped electron beam; and a stage which holds and moves an object, wherein the mask is disposed in proximity to a surface of the object, and a pattern corresponding to the aperture of the mask is exposed on the surface of the object with the electron beam having passed through the aperture, wherein the electron beam shaping device shapes the electron beam into a slender beam of which cross section has a small width in a direction of the scanning and a large width in a direction perpendicular to the direction of the scanning. Thus, in the electron beam proximity exposure apparatus, the responsiveness of the on-off control over the application of the electron beam can be improved with keeping the scanning width large without lowering the throughput of the exposure apparatus.
    • 电子束接近曝光装置包括:发射电子束的电子束源; 形成电子束的电子束整形装置; 具有孔径并设置在成形电子束的路径上的掩模; 偏转和扫描装置,其使电子束偏转以用成形电子束扫描掩模; 以及保持和移动物体的台阶,其中所述掩模设置在所述物体的表面附近,并且与所述掩模的孔径相对应的图案在所述物体的表面上暴露,所述电子束已经通过所述物体 孔,其中电子束成形装置将电子束成形为在扫描方向上横截面具有小宽度并且在垂直于扫描方向的方向上具有大宽度的细长光束。 因此,在电子束接近曝光装置中,通过保持扫描宽度大而不降低曝光装置的生产能力,可以提高对施加电子束的开 - 关控制的响应性。
    • 13. 发明申请
    • MASK INSPECTING APPARATUS
    • 屏蔽检查装置
    • US20040004195A1
    • 2004-01-08
    • US10188335
    • 2002-07-03
    • LEEPL Corporation
    • Takao Utsumi
    • H01J037/304
    • H01J37/3175B82Y10/00B82Y40/00H01J37/3174H01J2237/24592H01J2237/31776H01J2237/31788H01J2237/31794
    • The mask inspecting apparatus is incorporated into an electron beam proximity exposure apparatus in which a mask is arranged in proximity to a wafer, and a mask pattern formed on the mask is transferred onto a resist layer on the wafer by scanning the mask with an electron beam. The mask inspecting apparatus comprises a scanning electron microscope (SEM) arranged on a wafer stage, and a stage drive device which shifts the wafer stage so that an electron detector of the SEM can receive electrons originating from the electron beam transmitting through the mask pattern of the mask in an inspection of the mask. The SEM thereby captures an image of the mask pattern on the lower face of the mask. Thus, the mask inspection can be performed using an electron beam intended for use in proximity exposure in the electron beam proximity exposure apparatus.
    • 掩模检查装置被结合到电子束接近曝光装置中,其中掩模布置在晶片附近,并且通过用电子束扫描掩模将形成在掩模上的掩模图案转移到晶片上的抗蚀剂层上 。 掩模检查装置包括布置在晶片台上的扫描电子显微镜(SEM)和移动晶片台的载物台驱动装置,使得SEM的电子检测器可以接收源自通过掩模图案发射的电子束的电子 面具在检查面具。 SEM从而在掩模的下表面上捕获掩模图案的图像。 因此,可以使用旨在用于电子束接近曝光装置中的接近曝光的电子束来进行掩模检查。
    • 15. 发明授权
    • Methods for making reticle blanks, and for making reticles therefrom, for charged-particle-beam microlithography
    • 用于制作掩模版坯料并用于制作掩模版的方法用于带电粒子束微光刻法
    • US06355385B1
    • 2002-03-12
    • US09574279
    • 2000-05-19
    • Shin-ichi Takahashi
    • Shin-ichi Takahashi
    • G03F900
    • G03F1/20H01J2237/0453H01J2237/31788
    • Methods are disclosed for manufacturing reticle blanks, and reticles therefrom, for use in charged-particle-beam microlithography. The subject reticles exhibit substantially less tensile stress and thus substantially less pattern distortion, than conventional reticles. In a representative method, a silicon substrate is provided that includes an active silicon layer and a silicon support portion. At least on the silicon support portion, a wet-etching mask is formed that defines a prescribed pattern of openings corresponding to a desired pattern of windows. The silicon support portion, exposed in the openings, is wet etched depthwise toward the active silicon layer. After completing etching, a protective film of an oxygen-impermeable material is formed over the wet-etched product. The product is annealed, followed by removal of the protective film.
    • 公开了用于制造用于带电粒子束微光刻的掩模版坯料及其标线片的方法。 与传统的掩模版相比,被摄体标线片显示出显着较小的拉伸应力,因此显着减小图案变形。 在代表性的方法中,提供了包括有源硅层和硅支撑部分的硅衬底。 至少在硅支撑部分上,形成湿蚀刻掩模,其限定对应于期望的窗户图案的规定的开口图案。 暴露在开口中的硅支撑部分被深度地朝向有源硅层蚀刻。 在完成蚀刻之后,在湿蚀刻产品上形成不透氧材料的保护膜。 将产品退火,然后除去保护膜。
    • 16. 发明授权
    • Charged particle beam transfer mask
    • 带电粒子束传递掩模
    • US06218058B1
    • 2001-04-17
    • US09363686
    • 1999-07-29
    • Takehisa YahiroKazuaki SuzukiShin-ichi Kojima
    • Takehisa YahiroKazuaki SuzukiShin-ichi Kojima
    • G03F900
    • B82Y10/00B82Y40/00G03F1/20H01J37/3174H01J2237/31788
    • A charged particle beam transfer mask (6) has a plurality of subfields (8) each of which having a different pattern density. The charged particle beam transfer mask (6) divide-irradiates a charged particle beam (5) for each of the subfields (8) and reduce-transfers a pattern onto a sensitive substrate. The charged particle beam transfer mask (6) corrects the differences in the de-focus amounts (3) caused by Coulomb effect due to the different pattern densities when the pattern is transferred for each of the subfields (8) so as to eliminate the differences in the de-focus amounts (3) caused by Coulomb effect by pre-varying the position (height) of each of the subfields (8) in the optical axis direction.
    • 带电粒子束传递掩模(6)具有多个具有不同图案密度的子场(8)。 带电粒子束传递掩模(6)对每个子场(8)分开照射带电粒子束(5),并将图案减少到敏感基片上。 带电粒子束传递掩模(6)校正当为每个子场(8)传送图案时由于不同图案密度而由库仑效应引起的去焦量(3)的差异,以消除差异 在通过预先改变每个子场(8)在光轴方向上的位置(高度)而由库仑效应引起的去焦量(3)中。