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    • 12. 发明授权
    • Electron microscope, methods to determine the contact point and the contact of the probe
    • 电子显微镜,确定探针的接触点和接触的方法
    • US07435954B2
    • 2008-10-14
    • US11459359
    • 2006-07-23
    • Cheng-Hsun NienChuen-Horng TsaiKun-Ying ShinWen-Bin Jian
    • Cheng-Hsun NienChuen-Horng TsaiKun-Ying ShinWen-Bin Jian
    • H01J37/26H01J37/20
    • G01R31/307H01J2237/2594
    • An electron microscope suitable for observing at least one sample is provided. The sample has at least one testing area, and a material of the sample on the testing area is semiconductive or conductive. The electron microscope includes a stage, an electron gun, and at least one probe. The stage is suitable for carrying the sample and the sample is not electrically grounded. The electron gun is suitable for generating an electron beam and accumulating charges on the sample. When the probe contacts with the testing area, the image contrast of the testing area will change. The current through the probe will also change upon contact. Methods have been provided based on these principles to determine “when” and “where” the probe starts to contact the sample surface inside an electron microscope.
    • 提供适用于观察至少一个样品的电子显微镜。 样品具有至少一个测试区域,测试区域上的样品材料是半导体或导电的。 电子显微镜包括载物台,电子枪和至少一个探针。 该阶段适用于携带样品,样品不接地。 电子枪适用于产生电子束并在样品上积累电荷。 当探头与测试区域接触时,测试区域的图像对比度将发生变化。 通过探头的电流也将随接触而改变。 已经基于这些原理提供了用于确定探针在电子显微镜内开始与样品表面接触的“何时”和“在哪里”的方法。
    • 13. 发明授权
    • Method of inspecting pattern and inspecting instrument
    • 检查模式和检验仪器的方法
    • US07375538B2
    • 2008-05-20
    • US11166231
    • 2005-06-27
    • Mari Nozoe
    • Mari Nozoe
    • G01R31/305
    • H01J37/222G01R31/307H01J37/256H01J37/263H01J37/265H01J37/266H01J2237/043H01J2237/24564H01J2237/2594H01J2237/2813H01J2237/2817H01J2237/304
    • Electron beam is irradiated to a wafer in the midst of steps at predetermined intervals by a plurality of times under a condition in which a junction becomes rearward bias and a difference in characteristic of a time period of alleviating charge in the rearward bias is monitored. As a result, charge is alleviated at a location where junction leakage is caused in a time period shorter than that of a normal portion and therefore, a potential difference is produced between the normal portion and a failed portion and is observed in a potential contrast image as a difference in brightness. By consecutively repeating operation of acquiring the image, executing an image processing in real time and storing a position and brightness of the failed portion, the automatic inspection of a designated region can be executed. Information of image, brightness and distribution of the failed portion is preserved and outputted automatically after inspection.
    • 电子束在连接点成为向后偏置的状态下以预定间隔在步骤中照射到晶片,并且监视在向后偏置中减轻电荷的时间段的特性差。 结果,在比正常部分短的时间段内产生结漏电的位置处的电荷被减轻,因此在正常部分和失效部分之间产生电位差,并且在潜在对比图像中观察到电荷 作为亮度的差异。 通过连续重复获取图像的操作,实时执行图像处理并存储失败部分的位置和亮度,可以执行指定区域的自动检查。 故障部分的图像,亮度和分布信息在检查后自动保存并输出。
    • 16. 发明申请
    • Voltage contrast method and apparatus for semiconductor inspection using low voltage particle beam
    • 使用低电压粒子束的电压对比方法和半导体检测装置
    • US20020149381A1
    • 2002-10-17
    • US10033845
    • 2001-12-27
    • Chiwoei Wayne LoKenichi Kanai
    • G01R031/305
    • G01R31/307H01J2237/2594H01J2237/2817Y10S977/849
    • Defects in a patterned substrate are detected by inspection with a charged particle beam inspection tool which generates an image of a portion of the patterned substrate and compares the image with a reference in order to identify any defects in the patterned substrate. Parameters of the tool are optimized to improve image uniformity and contrast, particularly voltage contrast. Prior to imaging an area of the substrate, the tool charges an area surrounding the image area to eliminate or reduce the effects caused by asymmetrical charging in the surrounding area. The tool alternates between charging the surrounding area and imaging the image area to produce a plurality of images of the image area, which are then averaged. The result is a highly uniform image with improved contrast for accurate defect detection.
    • 通过用带电粒子束检查工具进行检查来检测图案化衬底中的缺陷,其产生图案化衬底的一部分的图像,并将图像与参考值进行比较,以便识别图案化衬底中的任何缺陷。 该工具的参数被优化,以提高图像的均匀性和对比度,特别是电压对比度。 在对基板的区域进行成像之前,工具对图像区域周围的区域进行充电以消除或减少由周围区域中的不对称充电引起的影响。 该工具在对周围区域充电并对图像区域进行成像之间交替产生图像区域的多个图像,然后将其平均。 结果是高度均匀的图像,具有改进的对比度,用于精确的缺陷检测。
    • 17. 发明授权
    • Voltage contrast method for semiconductor inspection using low voltage particle beam
    • 使用低电压粒子束进行半导体检测的电压对比方法
    • US06344750B1
    • 2002-02-05
    • US09227395
    • 1999-01-08
    • Chiwoei Wayne LoKenichi Kanai
    • Chiwoei Wayne LoKenichi Kanai
    • G01R31305
    • G01R31/307H01J2237/2594H01J2237/2817Y10S977/849
    • Defects in a patterned substrate are detected by inspection with a charged particle beam inspection tool which generates an image of a portion of the patterned substrate and compares the image with a reference in order to identify any defects in the patterned substrate. Parameters of the tool are optimized to improve image uniformity and contrast, particularly voltage contrast. Prior to imaging an area of the substrate, the tool charges an area surrounding the image area to eliminate or reduce the effects caused by asymmetrical charging in the surrounding area. The tool alternates between charging the surrounding area and imaging the image area to produce a plurality of images of the image area, which are then averaged. The result is a highly uniform image with improved contrast for accurate defect detection.
    • 通过用带电粒子束检查工具进行检查来检测图案化衬底中的缺陷,其产生图案化衬底的一部分的图像,并将图像与参考值进行比较,以便识别图案化衬底中的任何缺陷。 该工具的参数被优化,以提高图像的均匀性和对比度,特别是电压对比度。 在对基板的区域进行成像之前,工具对图像区域周围的区域进行充电以消除或减少由周围区域中的不对称充电引起的影响。 该工具在对周围区域充电并对图像区域进行成像之间交替产生图像区域的多个图像,然后将其平均。 结果是高度均匀的图像,具有改进的对比度,用于精确的缺陷检测。