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    • 16. 发明申请
    • Reticle Constructions
    • 标线结构
    • US20100248093A1
    • 2010-09-30
    • US12797474
    • 2010-06-09
    • Baorui Yang
    • Baorui Yang
    • G03F1/00
    • G03F1/32G03F1/29G03F1/34
    • The invention includes reticle constructions and methods of forming reticle constructions. In a particular aspect, a method of forming a reticle includes provision of a reticle substrate having a defined main-field region and a defined boundary region. The substrate has a relatively transparent base and a relatively opaque material over the base. A thickness of the relatively opaque material of the main-field region is reduced relative to a thickness of the relatively opaque material of the boundary region. A reticle construction of the present invention can comprise a relatively transparent base, and a relatively opaque material over the base. The construction can have a defined main-field region and a defined boundary region, and the relatively opaque material of the main-field region can have a reduced thickness relative to the relatively opaque material of the boundary region.
    • 本发明包括掩模版结构和形成掩模版结构的方法。 在特定方面,形成掩模版的方法包括提供具有限定的主场区域和限定的边界区域的掩模版衬底。 基底在基底上具有相对透明的基部和相对不透明的材料。 主场区域的相对不透明材料的厚度相对于边界区域的相对不透明材料的厚度减小。 本发明的掩模版结构可以包括相对透明的基底和在基底上的相对不透明的材料。 该结构可以具有限定的主场区域和限定的边界区域,并且主场区域的相对不透明的材料可以相对于边界区域的相对不透明的材料具有减小的厚度。
    • 18. 发明申请
    • PATTERN FORMING METHOD AND PATTERN FORM
    • 图案形成方法和图案形式
    • US20100086877A1
    • 2010-04-08
    • US12635214
    • 2009-12-10
    • Munehisa SomaGaku Suzuki
    • Munehisa SomaGaku Suzuki
    • G03F7/20
    • B29C33/42B82Y10/00B82Y40/00G03F1/26G03F1/34G03F7/0002H01L21/0273Y02P70/605
    • One embodiment of the present invention is a pattern forming method for forming a fine three-dimensional structural pattern, including: forming a resist material film on a substrate having a projecting pattern on a step in such a manner as to cover at least a marginal portion of the projecting pattern such that the resist material film is heaped on the projecting pattern in conformity with the step; reducing the heaped resist material film formed by first etching until the marginal portion of the projecting pattern is exposed from an edge of the heaped resist material film; and forming an upper projecting pattern according to the projecting pattern in a self-aligning manner by second etching on the marginal portion of the exposed projecting pattern by using the reduced resist material film as a mask.
    • 本发明的一个实施方案是一种用于形成精细三维结构图案的图案形成方法,包括:在具有突出图案的基板上形成抗蚀剂材料膜,以至少覆盖边缘部分 的突出图案,使得抗蚀剂材料膜与该台阶一致地堆叠在突出图案上; 减少由第一蚀刻形成的堆积的抗蚀剂材料膜,直到突出图案的边缘部分从堆积的抗蚀剂材料膜的边缘露出; 并且通过使用还原的抗蚀剂材料膜作为掩模,通过对暴露的突出图案的边缘部分进行第二次蚀刻,以自对准的方式,根据投影图案形成上部突出图案。
    • 20. 发明申请
    • PHOTOMASK BLANK, PHOTOMASK, AND METHODS OF MANUFACTURING THE SAME
    • PHOTOMASK BLANK,PHOTOMASK及其制造方法
    • US20090246645A1
    • 2009-10-01
    • US12414198
    • 2009-03-30
    • Osamu NOZAWA
    • Osamu NOZAWA
    • G03F1/00
    • G03F1/34G03F1/80
    • A photomask blank is for manufacturing a phase shift mask having a light-transmitting substrate provided with a phase shift portion adapted to give a predetermined phase difference to transmitted exposure light. The phase shift portion is a dug-down part that is dug down from a surface of the light-transmitting substrate to a digging depth adapted to produce the predetermined phase difference with respect to exposure light transmitted through the light-transmitting substrate at a portion where the phase shift portion is not provided. The photomask blank includes, on the digging-side surface of the light-transmitting substrate, an etching mask film that is made of a material being dry-etchable with a chlorine-based gas, but not dry-etchable with a fluorine-based gas, and serves as an etching mask at least until, when forming the dug-down part by dry etching, the dry etching reaches the digging depth. The photomask blank further includes, on a surface of the etching mask film, a light-shielding film that is made of a material mainly containing tantalum and has a thickness so as to be removable during the dry etching for forming the dug-down part of the light-transmitting substrate.
    • 光掩模坯件用于制造具有透光基板的相移掩模,该透光基板设置有适于给予透射曝光光的预定相位差的相移部分。 相移部分是从透光基板的表面向下挖掘的挖掘部分,其适于相对于透过透光基板的曝光来产生预定的相位差, 不设置相移部。 光掩模坯料在透光基板的挖掘侧表面上包括由用氯基气体可干蚀刻的材料制成的蚀刻掩模膜,但不能用氟基气体进行干法蚀刻 并且至少在通过干法蚀刻形成所述下陷部分时,至少形成蚀刻掩模,所述干蚀刻达到所述挖掘深度。 光掩模坯料还包括在蚀刻掩模膜的表面上的遮光膜,其由主要包含钽的材料制成,并且具有在干法蚀刻期间能够移除的厚度,以形成下垂部分的 透光基板。