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    • 14. 发明授权
    • Electromagnetic wave measurement device, measurement method, and recording medium
    • 电磁波测量装置,测量方法和记录介质
    • US09157857B2
    • 2015-10-13
    • US14108882
    • 2013-12-17
    • ADVANTEST CORPORATION
    • Shigeru OnoKazunori ShiotaMasaichi HashimotoAkiyoshi Irisawa
    • G01J5/02G01N21/59G01B11/06
    • G01N21/59G01B11/0633
    • According to the present invention, an electromagnetic wave measurement device includes: an electromagnetic wave detector, a frequency component acquisition unit, and a thickness indication quantity deriving unit. An object to be measured is disposed on a substrate and includes at least two layers, and the electromagnetic wave detector detects a substrate-surface-reflected electromagnetic wave which has been made incident to the object, has been reflected by the substrate, and has passed through the object. The frequency component acquisition unit acquires an amplitude of a frequency component of the substrate-surface-reflected electromagnetic wave. The thickness indication quantity deriving unit derives a thickness indication quantity based on the amplitude of the frequency component of the substrate-surface-reflected electromagnetic wave and a relationship between the thickness indication quantity and the amplitude of the frequency component of the substrate-surface-reflected electromagnetic wave.
    • 根据本发明,电磁波测量装置包括:电磁波检测器,频率分量获取单元和厚度指示量导出单元。 将被测量物体配置在基板上,至少包含两层,电磁波检测器检测出已被入射到物体的基板表面反射的电磁波已被基板反射,并且已经通过 通过对象。 频率分量获取单元获取基板表面反射电磁波的频率分量的振幅。 厚度指示量导出单元基于基板表面反射电磁波的频率分量的振幅和基板表面反射电磁波的厚度指示量与频率分量的振幅之间的关系导出厚度指示量 电磁波。
    • 15. 发明申请
    • Caliper sensor and method using mid-infrared interferometry
    • 卡尺传感器和使用中红外干涉测量的方法
    • US20150159995A1
    • 2015-06-11
    • US14103733
    • 2013-12-11
    • Sebastien TixierMichael Kon Yew HughesStephane Savard
    • Sebastien TixierMichael Kon Yew HughesStephane Savard
    • G01B11/06
    • G01B11/0691G01B9/02001G01B11/0633G01B11/0675G01B2210/42G01B2210/44G01B2290/65
    • Non-contacting caliper measurements of free standing sheets such as porous polymer and paper detect mid-IR interferometric fringes created by the reflection of light from the top and bottom surfaces of the sheet. The technique includes directing a laser beam at a selected angle of incidence onto a single spot on the exposed outer surface wherein the laser beam comprises radiation having a wavelength in the 3-50 micron range and scanning the laser beam through a selected angle range as the laser beam is directed onto the exposed outer surface and measuring the intensity of an interference pattern that forms from the superposition of radiation that is reflected From the exposed outer surface and from the inner surface. Thickness can be extracted from the fringe separation in the interference pattern. Rotating and focusing elements ensure that the spot position on the sheet remains the same while varying the incident angle.
    • 通过从片材的顶部和底部表面反射的光产生的自由基片材(如多孔聚合物和纸张)的非接触卡尺测量检测中红外干涉条纹。 该技术包括将激光束定向到暴露的外表面上的单个点上的入射角,其中激光束包括波长在3-50微米范围内的辐射,并且将激光束扫过选定的角度范围作为 激光束被引导到暴露的外表面上,并且测量从暴露的外表面和内表面反射的辐射的叠加形成的干涉图案的强度。 可以从干涉图案中的边缘分离中提取厚度。 旋转和聚焦元件可确保纸张上的光点位置保持不变,同时改变入射角度。
    • 16. 发明授权
    • Depth of hole measurement by subtracting area of two spectra separated by time
    • 通过减去由时间分开的两个光谱的面积来测量孔的深度
    • US09007599B2
    • 2015-04-14
    • US13859405
    • 2013-04-09
    • Shimadzu Corporation
    • Hiroomi GotoYuzo NagumoRui Kato
    • G01B11/02G01B11/06
    • G01B11/06G01B11/0633
    • A measurement light having a predetermined wavelength bandwidth from a light source is radiated onto the structure to be measured in a specimen 50, light reflected from a first plane and second plane of the structure to be measured is made to interfere in an optical fiber, and a spectrum of the interference light is generated. This interference light spectrum is acquired by a spectrometric unit at two time points separated in time, and in data processing unit, absolute difference area computation unit determines the absolute difference area of the difference spectrum. This absolute difference area changes periodically each time the dimension of the structure to be measured changes by λ/4, making it possible to determine the dimension of the structure to be measured based on that change.
    • 将具有来自光源的预定波长带宽的测量光照射到被检体50中的被测量结构上,使被测定结构的第一平面和第二平面反射的光干涉光纤, 产生干涉光的光谱。 该干涉光谱由时间分离的两个时间点的光谱测定单元获取,在数据处理单元中,绝对差分区域计算单元确定差分谱的绝对差分面积。 每当测量结构的尺寸变化λ/ 4时,该绝对差值区域周期性地变化,从而可以基于该变化来确定要测量的结构的尺寸。
    • 19. 发明申请
    • SYSTEM FOR DIRECTLY MEASURING THE DEPTH OF A HIGH ASPECT RATIO ETCHED FEATURE ON A WAFER
    • 用于直接测量水平高比例蚀刻特征深度的系统
    • US20140110582A1
    • 2014-04-24
    • US14145497
    • 2013-12-31
    • RUDOLPH TECHNOLOGIES, INC.
    • David S. MarxDavid L. Grant
    • G01B11/22
    • G01B11/22G01B11/0633G01B11/0675G01B2210/56
    • A system (10) for directly measuring the depth of a high aspect ratio etched feature on a wafer (80) that includes an etched surface (82) and a non-etched surface (84). The system (10) utilizes an infrared reflectometer (12) that in a preferred embodiment includes a swept laser (14), a fiber circulator (16), a photodetector (22) and a combination collimator (18) and an objective lens (20). From the objective lens (20) a focused incident light (23) is produced that is applied to the non-etched surface (84) of the wafer (80). From the wafer (80) is produced a reflected light (25) that is processed through the reflectometer (12) and applied to an ADC (24) where a corresponding digital data signal (29) is produced. The digital data signal (29) is applied to a computer (30) that, in combination with software (32), measures the depth of the etched feature that is then viewed on a display (34).
    • 一种用于直接测量包括蚀刻表面(82)和非蚀刻表面(84)的晶片(80)上的高纵横比蚀刻特征的深度的系统(10)。 系统(10)利用红外反射计(12),在优选实施例中,扫描激光器(14),光纤循环器(16),光电检测器(22)和组合准直仪(18)和物镜(20) )。 从物镜(20),产生被施加到晶片(80)的未蚀刻表面(84)的聚焦入射光(23)。 从晶片(80)产生的反射光(25)通过反射计(12)处理并被施加到产生相应的数字数据信号(29)的ADC(24)。 数字数据信号(29)被应用于与软件(32)组合的计算机(30),其测量在显示器(34)上被观看的蚀刻特征的深度。
    • 20. 发明申请
    • MEASURING INSTRUMENT AND METHOD FOR DETERMINATION OF THE PROPERTIES OF AN ITEM AND ITS SURFACE
    • 测量仪器和方法,用于确定项目及其表面的性质
    • US20120206710A1
    • 2012-08-16
    • US13500073
    • 2010-10-07
    • Karri NiemeläHeimo Keränen
    • Karri NiemeläHeimo Keränen
    • G01N21/55G01B11/06G01B11/24G01C3/08G01N21/57G01J4/00G01N21/41
    • G01B11/0633G01B11/065G01B2210/50G01N21/41G01N21/57
    • A measurement device for the determination of the characteristics of the object's surface by means of the optical radiation, wherein a measurement device comprises an optical radiation source and a detector to receive the radiation reflected from the surface being measured. In addition, a measurement device comprises an emitted optical radiation processing unit, which is adjusted to split optical radiation emitted by an optical source into separate wavelengths and to direct said separate wavelengths to the object being measured in a direction, that differs from the normal of the surface being measured so, that at least the shortest and the longest wavelengths of said wavelengths are focused on different halves and different heights of the measured object's surface, in the direction of the normal of the surface being measured. In addition, a measurement device comprises a reflected optical radiation processing unit, which is adjusted to receive an optical radiation reflected from the measured object at least in the direction of a specular reflection, which differs from the normal of the surface being measured, and to direct received optical radiation to said detector. Still further, the measurement device is adjusted to analyze an electric signal produced by the detector and proportional to the intensity of the radiation focused thereto, and to further determine a surface gloss (gloss degree) and/or thickness characteristic property of the measured object, based on the intensity of its wavelength, the focus point of which was located on the measured surface, and which wavelength was the strongest reflected from that point to the detector in the specular geometry.
    • 一种用于通过光学辐射确定物体表面的特性的测量装置,其中测量装置包括光学辐射源和用于接收从所测量的表面反射的辐射的检测器。 此外,测量装置包括发射的光辐射处理单元,其被调整以将由光源发射的光辐射分裂成分离的波长并将所述分离的波长指向被测量的物体,该方向与 被测量的表面是所述波长的至少最短波长和最长波长在所测量的表面的法线方向上聚焦在被测物体表面的不同高度和不同高度上。 此外,测量装置包括反射光辐射处理单元,其被调整为至少在与所测量的表面的法线不同的镜面反射方向上接收从测量对象反射的光辐射,并且至少 直接接收光辐射到所述检测器。 此外,调整测量装置以分析由检测器产生的电信号并与其聚焦的辐射的强度成比例,并且进一步确定测量对象的表面光泽度(光泽度)和/或厚度特性, 基于其波长的强度,其焦点位于测量的表面上,并且哪个波长在镜面几何形状中从该点到检测器反射最强。