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11. 发明授权

US5902171A Method and apparatus for slicing a work 失效
标题翻译：用于切片工作的方法和装置
公开(公告)号：US5902171A
公开(公告)日：1999-05-11
申请号：US918923
申请日：1997-08-26
申请人： Tatsumi Hamasaki , Yoshihiro Tadera , Yukinori Imada , Keishi Kawaguchi
发明人： Tatsumi Hamasaki , Yoshihiro Tadera , Yukinori Imada , Keishi Kawaguchi
IPC分类号： B24B27/06 , B23D59/00 , B28D5/02 , B28D1/02
CPC分类号： B23D59/002 , B28D5/028
摘要： An apparatus for slicing a work includes: a blade member rotating device which rotates a blade member having an internal circular cutting edge; a radial moving device which produces a relative movement between the blade member and a work in a radial direction of the blade member to cut an end portion of the work; an axial moving device which produces a relative movement between the blade member and the work in an axial direction of the blade member; a displacement detector which detects an axial displacement of an inner portion of the rotating blade member; a rotational controller which controls the rotational speed of the blade member based on a detected axial displacement to reduce the axial displacement; and an axial movement controller which controls the axial relative movement between the blade member and the work based on the detected axial displacement so that an actual cutting position of the internal cutting edge with respect to the work is at a predetermined cutting reference position.
摘要翻译：一种用于切割工件的设备包括：叶片构件旋转装置，其使具有内部圆形切割刃的叶片构件旋转; 径向移动装置，其在所述刀片构件和所述工件之间在所述刀片构件的径向方向上产生相对运动，以切割所述工件的端部; 轴向移动装置，其在叶片构件的轴向方向上产生叶片构件和作业之间的相对运动; 位移检测器，其检测所述旋转叶片构件的内部的轴向位移; 旋转控制器，其基于检测到的轴向位移来控制所述叶片构件的旋转速度，以减小所述轴向位移; 以及轴向移动控制器，其基于检测到的轴向位移来控制所述刀片构件和所述工件之间的轴向相对运动，使得所述内部切削刃相对于所述工件的实际切割位置处于预定的切割参考位置。

12. 发明授权

US4420909B2 Wafering system 失效
标题翻译：晶圆系统
公开(公告)号：US4420909B2
公开(公告)日：1997-06-10
申请号：US32009781
申请日：1981-11-10
申请人： SILICON TECHNOLOGY
发明人： STEERE ROBERT E JR
IPC分类号： B28D1/22 , B23Q7/04 , B28D5/00 , B28D5/02 , H01L21/304 , H01L21/683 , B24B7/20
CPC分类号： B28D5/0094 , B23Q7/047 , B28D5/028

13. 发明授权

US5351446A Method and apparatus for the rotary sawing of brittle and hard materials 失效
标题翻译：用于旋转锯切脆性和硬质材料的方法和装置
公开(公告)号：US5351446A
公开(公告)日：1994-10-04
申请号：US938691
申请日：1992-09-01
申请人： Karlheinz Langsdorf
发明人： Karlheinz Langsdorf
IPC分类号： H01L21/304 , B28D1/00 , B28D1/22 , B28D5/02 , B28D5/04 , B24B1/00
CPC分类号： B28D1/003 , B28D1/221 , B28D5/028 , B28D5/045
摘要： Ingot-type semiconductor single crystals having diameters of more than 200m can be sawed into thin wafers using an annular saw if the crystal is fed towards the cutting edge of the annular saw while rotating around its longitudinal axis. The method includes having a wafer sawed out in this way until a residual joint is created between a wafer and the end face of the ingot. Ingot and wafer are finally separated by means of a residue separation technique which leaves behind various central material projections on the ingot and the wafer. Particularly suitable for residue separation are torsion separation and separation by a wire saw. This procedure reliably prevents the frequently observable, uncontrollable breaking-off of the wafer in the final phase of the annular sawing if this is exclusively used as the method of separation. The method, whose final step involves the removal of the material projection on the wafer by rotation grinding, proves to be particularly suitable for crystals having diameters of more than 200 mm. In this case, the material saving is exceedingly high as a result of the absence of chips from the ingot or wafer as a consequence of uncontrolled breaking-off of the wafer.
摘要翻译：如果在围绕其纵向轴线旋转的同时将晶体馈送到环形锯的切割边缘，则可以使用环形锯将直径大于200mm的锭形半导体单晶切割成薄晶片。该方法包括以这种方式锯切晶片，直到在晶片和晶锭的端面之间产生残留接合点。锭和晶片最后通过残留物分离技术分离，留下锭子和晶片上的各种中心材料投影。特别适用于残渣分离的是通过线锯的扭转分离和分离。该方法可以可靠地防止在环形锯切的最后阶段中晶片经常可观察到的，不可控制的断裂，如果它仅用作分离方法。该方法的最终步骤涉及通过旋转研磨去除晶片上的材料投影，证明特别适用于直径大于200mm的晶体。在这种情况下，作为晶片的不受控断裂的结果，由于不存在来自晶锭或晶片的芯片，所以材料节省非常高。

14. 发明授权

US5285597A Method and arrangement for subdividing semiconductor bars into semiconductor wafers 失效
标题翻译：将半导体棒细分成半导体晶片的方法和装置
公开(公告)号：US5285597A
公开(公告)日：1994-02-15
申请号：US973060
申请日：1992-11-06
申请人： Hubert Hinzen
发明人： Hubert Hinzen
IPC分类号： B24B7/22 , B24B53/00 , B28D1/00 , B28D5/00 , B28D5/02 , C30B33/00 , H01L21/304 , B24B7/00 , B24B53/02 , B28B1/02 , B28B5/02
CPC分类号： C30B33/00 , B24B53/001 , B24B7/228 , B28D1/003 , B28D5/028
摘要： A device for subdividing semiconductor bars into wafers comprises a grinding tool having two concentrically arranged grinding discs. A rough grinding disc is arranged inside of an outer smooth polishing grinding disc. The grinding tool grinds a lower face of a semiconductor bar to a smooth planar form. A first electrolytic truer operates in conjunction with the outer smooth polishing grinding disc while a second electrolytic truer operates in conjunction with the inner rough grinding disc. The truers are arranged to define an axial offset between the grinding surfaces of the grinding discs so that a lower face of the bar is smoothed. The device also has a slicing tool for slicing the bar into wafers which will have a smooth planar form.
摘要翻译：用于将半导体棒细分成晶片的装置包括具有两个同心布置的研磨盘的研磨工具。在一个外部平滑抛光研磨盘的内部设置一个粗磨盘。研磨工具将半导体棒的下表面平滑地平滑地研磨。第一电解修复器与外部平滑抛光研磨盘一起操作，而第二电解修整器与内部粗磨盘一起操作。示踪器布置成限定研磨盘的研磨表面之间的轴向偏移，使得杆的下表面平滑。该装置还具有用于将棒切割成具有平滑平面形状的晶片的切片工具。

15. 发明授权

US5142756A Apparatus for loading and re-slicing semiconductor wafer 失效
标题翻译：装载和重新放置半导体波形的装置
公开(公告)号：US5142756A
公开(公告)日：1992-09-01
申请号：US599861
申请日：1990-10-19
申请人： Tadashi Ibaraki , Tsutomu Sato
发明人： Tadashi Ibaraki , Tsutomu Sato
IPC分类号： H01L21/304 , B28D1/00 , B28D5/00 , B28D5/02 , H01L21/677
CPC分类号： B28D1/005 , B28D5/0058 , B28D5/0094 , B28D5/028 , H01L21/67778 , Y10T29/41
摘要： The present invention is directed to an apparatus for loading an unprocessed semiconductor wafer which is doped in advance with impurity diffusion layers on both sides or not doped, re-slicing the wafer and unloading two sheets of the re-sliced wafer as processed wafers upon completion of re-slicing the unprocessed wafer into two sheets to a recovery wafer magazine as a total system. More particularly, the present invention provides an improved loading and unloading mechanism arranged between a storage space of both unprocessed and processed wafers and a re-slicing mechanism, with chucking mechanisms and wafer magazines in the storage space. The loading and unloading mechanism includes a loading manipulator and an unloading manipulator, wherein the loading manipulator receives an unprocessed wafer from the storage space and then conveys and loads the wafer on a chucking mechanism which is operated in combination with a re-slicing mechanism, and then the unloading manipulator recovers two sheets of re-sliced wafers from the chucking mechanism and further unloads them into another wafer magazine. While the unloading manipulator is unloading the two sheets of re-sliced wafers into the magazine, simultaneously the loading manipulator will take out a new unprocessed wafer, wherein the new wafer is conveyed to a stand-by position and awaits until the completion of re-slicing an earlier wafer on the chucking mechanism.

16. 发明授权

US4991475A Method and apparatus for sawing bar-shaped workpieces into slices 失效
标题翻译：将棒状工件切割成切片的方法和装置
公开(公告)号：US4991475A
公开(公告)日：1991-02-12
申请号：US479480
申请日：1990-02-13
申请人： Hanifi Malcok , Hermann Zwirglmaier
发明人： Hanifi Malcok , Hermann Zwirglmaier
IPC分类号： B23D59/00 , B24B27/06 , B24D5/12 , B28D1/22 , B28D5/00 , B28D5/02
CPC分类号： B24D5/126 , B23D59/002 , B24B27/0675 , B28D5/0058 , B28D5/028 , Y10T82/16442 , Y10T82/2502 , Y10T82/2527 , Y10T83/04
摘要： The invention is a method and apparatus for sawing bar-shaped workpieces o slices by means of an annular saw. The saw blade deviation, from its nominal position in the axial direction during the sawing operation, is compensated for. According to the invention, the deviation can be compensated for by the workpiece and the clamping system of the saw blade performing an appropriate relative translatory axial movement in accordance with the measured deviation. This movement is conveniently controlled by a computer, which compares the actual and nominal position of the saw blade with one another. The method can be used especially in the sawing of semiconductor bars.
摘要翻译：本发明是用于通过环形锯将棒状工件切割成切片的方法和装置。在锯切操作期间，锯片偏离其在轴向方向上的标称位置被补偿。根据本发明，可以通过工件补偿偏差，并且锯片的夹紧系统根据测量的偏差执行适当的相对平移轴向运动。该运动由计算机方便地控制，计算机将锯片的实际和标称位置相互比较。该方法特别适用于半导体棒的锯切。

17. 发明授权

US4903681A Method and apparatus for cutting a cylindrical material 失效
标题翻译：用于切割圆柱形材料的方法和装置
公开(公告)号：US4903681A
公开(公告)日：1990-02-27
申请号：US156748
申请日：1988-02-18
申请人： Katsuo Honda , Shuichi Tsukada
发明人： Katsuo Honda , Shuichi Tsukada
IPC分类号： B28D5/00 , B28D5/02
CPC分类号： B28D5/0058 , B28D5/0094 , B28D5/028 , Y10T83/0443 , Y10T83/2185 , Y10T83/7527 , Y10T83/754 , Y10T83/7553 , Y10T83/7573
摘要： Method and apparatus for cutting a cylindrical material formed of silicone or the like which is an original material to produce semiconductor devices, using a rotary blade. In the cutting method, the base end side of the cylindrical material is fixed and at the same time, before the cutting of the cylindrical material is started, the cutting side of the cylindrical material is also fixed according to the shape thereof. The cutting is performed while maintaining such fixed conditions until the cutting is completed.

18. 发明授权

US4881518A Apparatus for manufacturing and handling thin wafers 失效
标题翻译：用于制造和处理薄晶片的装置
公开(公告)号：US4881518A
公开(公告)日：1989-11-21
申请号：US266790
申请日：1988-11-03
申请人： Fritz Feldmeier
发明人： Fritz Feldmeier
IPC分类号： B24B27/06 , B23P23/02 , B24B7/16 , B24B7/22 , B28D1/00 , B28D5/00 , B28D5/02 , H01L21/304
CPC分类号： H01L21/02013 , B23P23/02 , B24B7/16 , B24B7/228 , B28D1/003 , B28D5/0094 , B28D5/028 , Y10T29/49792 , Y10T29/49798 , Y10T29/49821 , Y10T29/5176 , Y10T29/5177
摘要： Apparatus for manufacturing thin wafers from bars, such as in the manufacture of wafers for use as semiconductor substrates, include an arrangement wherein a holder member is fastened to the bar, the bar is sliced to separate a disc-shaped wafer therefrom and wherein prior to completion of the slicing operation, the end face of the bar is leveled to a precisely planar condition. The slicing operation is terminated after the bar is sliced completely through and the holder member is partially, but not completely, sliced through so that a wafer formed by the slicing operation remains connected to the bar by the holder member. The wafer is disconnected from the bar by abrading a portion of the holder member connecting the wafer to the bar.
摘要翻译：用于从棒制造薄晶片的装置，例如在用作半导体衬底的晶片的制造中，包括一种将保持器构件紧固到杆上的装置，将棒切片以从其分离圆盘形晶片，并且其中在完成切片操作后，杆的端面平整到精确的平面状态。切片操作在棒完全切割穿过之后终止，并且保持器部件部分地但不完全切片，使得通过切片操作形成的晶片通过保持器部件保持连接到杆。通过研磨将晶片连接到杆的保持器构件的一部分将晶片与棒断开。

19. 发明授权

US4420909B1 失效
公开(公告)号：US4420909B1
公开(公告)日：1989-11-14
申请号：US32009781
申请日：1981-11-10
IPC分类号： B28D1/22 , B23Q7/04 , B28D5/00 , B28D5/02 , H01L21/304 , H01L21/683
CPC分类号： B28D5/0094 , B23Q7/047 , B28D5/028

20. 发明授权

US4420909A Wafering system 失效
标题翻译：晶圆系统
公开(公告)号：US4420909A
公开(公告)日：1983-12-20
申请号：US320097
申请日：1981-11-10
申请人： Robert E. Steere, Jr.
发明人： Robert E. Steere, Jr.
IPC分类号： B28D1/22 , B23Q7/04 , B28D5/00 , B28D5/02 , H01L21/304 , H01L21/683 , B24B7/20
CPC分类号： B28D5/0094 , B23Q7/047 , B28D5/028
摘要： The wafering system employs a chuck assembly for moving a severed wafer from a crystal through the aperture in the cutting blade to a take-off conveyor. The chuck assembly includes a suction head which is pivotally mounted via a pivot arm assembly, a slide for moving the head back and forth and a carriage for vertically moving the head up and down. A motor is used to actuate the carriage while air cylinders are used to actuate the slide and pivot arm assembly.
摘要翻译：晶圆系统采用卡盘组件，用于将切割的晶片从晶片通过切割刀片中的孔移动到起飞输送机。卡盘组件包括通过枢转臂组件可枢转地安装的吸头，用于前后移动头部的滑块和用于使头部上下移动的滑架。当气缸用于致动滑动件和枢转臂组件时，电动机用于致动托架。

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