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    • 11. 发明授权
    • Integrated circuit device and electronic device
    • 集成电路器件和电子器件
    • US07391668B2
    • 2008-06-24
    • US11468548
    • 2006-08-30
    • Kanji NatoriKimihiro MaemuraTakashi Kumagai
    • Kanji NatoriKimihiro MaemuraTakashi Kumagai
    • G11C8/00
    • G09G3/3611G09G3/3648G09G2320/08G11C16/0433
    • An integrated circuit device, a first direction being a direction extending from a first side which is a shorter side of the integrated circuit device to a third side opposed to the first side, a second direction being a direction extending from a second side which is a longer side of the integrated circuit device to a fourth side opposed to the second side, includes: a first to a Nth circuit blocks (N is an integer more than 2) arranged in the first direction. One of the first to the Nth circuit blocks is a programmable ROM block in which at least a part of data programmed is stored by a user; the programmable ROM block includes a plurality of word lines, a plurality of bit lines, and a plurality of memory cells connected to the plurality of word lines and the plurality of bit lines; and the plurality of word lines extend in the second direction.
    • 集成电路器件,第一方向是从集成电路器件的短边的第一侧延伸到与第一侧相对的第三侧的方向,第二方向是从第二侧延伸的方向,第二侧为 集成电路器件的长边与第二侧相对的第四侧包括:沿第一方向布置的第一至第N电路块(N为大于2的整数)。 第一至第N电路块之一是可编程ROM块,其中编程的数据的至少一部分由用户存储; 可编程ROM块包括多个字线,多个位线和连接到多个字线和多个位线的多个存储器单元; 并且所述多个字线在所述第二方向上延伸。
    • 12. 发明申请
    • Integrated circuit device and electronic instrument
    • 集成电路器件和电子仪器
    • US20070013685A1
    • 2007-01-18
    • US11270694
    • 2005-11-10
    • Satoru KodairaNoboru ItomiShuji KawaguchiTakashi KumagaiHisanobu IshiyamaKazuhiro Maekawa
    • Satoru KodairaNoboru ItomiShuji KawaguchiTakashi KumagaiHisanobu IshiyamaKazuhiro Maekawa
    • G09G5/00
    • G09G3/2007G09G2310/027G09G2360/18
    • An integrated circuit device having a display memory, wherein a plurality of first power supply interconnects VSSL for supplying a first power supply voltage VSS to memory cells MC are formed in a metal interconnect layer in which a plurality of wordlines WL are formed; and wherein a plurality of second power supply interconnects VDDL for supplying a second power supply voltage VDD to the memory cells are formed in another metal interconnect layer in which a plurality of bitlines BL are formed, the second power supply voltage VDD being higher than the first power supply voltage VSS. A plurality of bitline protection interconnects SHD are formed in a layer above the bitlines BL, and each of the bitline protection interconnects SHD at least partially covers one of the bitlines BL in a plan view. A third power supply interconnect GL for supplying a third power supply voltage to circuits other than the display memory are formed in a layer above the bitline protection interconnects SHD, the third power supply voltage being higher than the second power supply voltage VDD.
    • 一种具有显示存储器的集成电路器件,其中在形成有多个字线WL的金属互连层中形成有用于向存储单元MC提供第一电源电压VSS的多个第一电源互连VSSL; 并且其中,在形成有多个位线BL的另一个金属互连层中形成有用于将第二电源电压VDD提供给存储单元的多个第二电源互连VDDL,第二电源电压VDD高于第一电源电压VDD 电源电压VSS。 多个位线保护互连SHD形成在位线BL上方的层中,并且每个位线保护互连SHD在平面图中至少部分地覆盖位线BL之一。 用于将第三电源电压提供给除了显示存储器之外的电路的第三电源互连GL形成在位线保护互连SHD上方的层中,第三电源电压高于第二电源电压VDD。
    • 19. 发明授权
    • Semiconductor memory device and method of fabricating the same
    • 半导体存储器件及其制造方法
    • US06534864B1
    • 2003-03-18
    • US09428821
    • 1999-10-28
    • Kazuo TanakaTakashi KumagaiJunichi KarasawaKunio Watanabe
    • Kazuo TanakaTakashi KumagaiJunichi KarasawaKunio Watanabe
    • H01L2348
    • H01L27/11H01L27/1104Y10S257/903
    • A semiconductor memory device (SRAM) comprises memory cells, each of which includes two load transistors, two driver transistors and two transfer transistors. The SRAM cell includes a semiconductor substrate in which the transistors are formed, a first interlayer dielectric formed on the semiconductor substrate, first contact portions formed in the first interlayer dielectric and first wiring layers (node wiring layers and pad layers) formed on the first interlayer dielectric. The first contact portions and the first wiring layers include metal layers made of refractory metal and a refractory metal nitride layers. This semiconductor memory device of the present invention is capable of enhancing an integration degree of wiring layers and achieving a microfabrication.
    • 半导体存储器件(SRAM)包括存储单元,每个存储单元包括两个负载晶体管,两个驱动晶体管和两个转移晶体管。 SRAM单元包括其中形成晶体管的半导体衬底,形成在半导体衬底上的第一层间电介质,形成在第一层间电介质中的第一接触部分和形成在第一层间电介质上的第一布线层(节点布线层和衬垫层) 电介质。 第一接触部分和第一布线层包括由难熔金属制成的金属层和难熔金属氮化物层。 本发明的半导体存储器件能够提高布线层的集成度并实现微细加工。
    • 20. 发明授权
    • Semiconductor memory device and method of fabricating the same
    • 半导体存储器件及其制造方法
    • US06232670B1
    • 2001-05-15
    • US09361043
    • 1999-07-26
    • Takashi KumagaiJunichi KarasawaKazuo TanakaKunio Watanabe
    • Takashi KumagaiJunichi KarasawaKazuo TanakaKunio Watanabe
    • H01L2711
    • H01L27/1104
    • First and second memory cells of an SRAM comprises first, second, and third conductive layers. The first conductive layer is a gate electrode for a first load transistor and a first driver transistor. The second conductive layer diverges from the first conductive layer on a field oxide region and is electrically connected to a second driver transistor active region. The third conductive layer is a gate electrode for a second load transistor and a second driver transistor. The third conductive layer is electrically connected to a first load transistor active region. The pattern of the first, second, and third conductive layers of the second memory cell is a rotated pattern of the first, second, and third conductive layers in the first memory cell at an angle of 180 degrees around an axis perpendicular to the main surface of a semiconductor substrate.
    • SRAM的第一和第二存储单元包括第一,第二和第三导电层。 第一导电层是用于第一负载晶体管和第一驱动晶体管的栅电极。 第二导电层从场氧化物区域上的第一导电层发散,并且电连接到第二驱动器晶体管有源区。 第三导电层是用于第二负载晶体管的栅电极和第二驱动晶体管。 第三导电层电连接到第一负载晶体管有源区。 第二存储单元的第一,第二和第三导电层的图案是第一存储单元中的第一,第二和第三导电层的旋转图案,围绕垂直于主表面的轴以180度的角度 的半导体衬底。