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11. 发明申请

US20130244545A1 POLISHING PAD AND METHOD FOR PRODUCING SAME 有权
标题翻译：抛光垫及其制造方法
公开(公告)号：US20130244545A1
公开(公告)日：2013-09-19
申请号：US13881336
申请日：2010-10-26
申请人： Yoshiyuki Nakai , Kazuyuki Ogawa , Kenji Nakamura
发明人： Yoshiyuki Nakai , Kazuyuki Ogawa , Kenji Nakamura
IPC分类号： B24B37/24 , B24B37/04
CPC分类号： B24B37/24 , B24B37/042 , B24D11/00
摘要： A polishing pad has a polishing layer including a non-foamed polyurethane, wherein the non-foamed polyurethane is a reaction cured body of a polyurethane raw material composition containing an isocyanate-terminated prepolymer obtained by reacting a prepolymer raw material composition containing a diisocyanate, a high-molecular-weight polyol and a low-molecular-weight polyol; an isocyanate modified body polymerized by adding three or more diisocyanates; and a chain extender, and the addition amount of the isocyanate-modified body is 5 to 30 parts by weight with respect to 100 parts by weight of the isocyanate-terminated prepolymer. The polishing pad hardly causes scratches on the surface of an object to be polished and has an improved dressing property.
摘要翻译：抛光垫具有包括非发泡聚氨酯的抛光层，其中非发泡聚氨酯是含有异氰酸酯封端的预聚物的聚氨酯原料组合物的反应固化体，其通过使含有二异氰酸酯的预聚物原料组合物，高分子量多元醇和低分子量多元醇; 通过加入三种或更多种二异氰酸酯聚合的异氰酸酯改性体; 和增链剂，相对于100重量份异氰酸酯封端的预聚物，异氰酸酯改性体的添加量为5〜30重量份。抛光垫几乎不会在被抛光物体的表面上产生划痕，并且具有改善的敷料性能。

12. 发明申请

US20130217309A1 POLISHING PAD AND METHOD FOR PRODUCING SAME 有权
公开(公告)号：US20130217309A1
公开(公告)日：2013-08-22
申请号：US13881341
申请日：2010-10-26
申请人： Yoshiyuki Nakai , Kazuyuki Ogawa , Kenji Nakamura
发明人： Yoshiyuki Nakai , Kazuyuki Ogawa , Kenji Nakamura
IPC分类号： B24B37/24 , H01L21/304
CPC分类号： B24B37/24 , H01L21/304
摘要： A polishing pad has a polishing layer including a non-foamed polyurethane, wherein the non-foamed polyurethane is a reaction cured body of a polyurethane raw material composition containing an isocyanate-terminated prepolymer obtained by reacting a prepolymer raw material composition containing a diisocyanate, a high-molecular-weight polyol and a low-molecular-weight polyol; an isocyanate modified body polymerized by adding three or more diisocyanates; and a chain extender, and the addition amount of the isocyanate-modified body is 5 to 30 parts by weight with respect to 100 parts by weight of the isocyanate-terminated prepolymer. The polishing pad hardly causes scratches on the surface of an object to be polished and has an improved dressing property.

13. 发明授权

US09132524B2 Polishing pad and method for producing same 有权
标题翻译：抛光垫及其制造方法
公开(公告)号：US09132524B2
公开(公告)日：2015-09-15
申请号：US13881341
申请日：2010-10-26
申请人： Yoshiyuki Nakai , Kazuyuki Ogawa , Kenji Nakamura
发明人： Yoshiyuki Nakai , Kazuyuki Ogawa , Kenji Nakamura
IPC分类号： B24B37/14 , B24D11/00 , B24B37/24 , H01L21/304
CPC分类号： B24B37/24 , H01L21/304
摘要： A polishing pad has a polishing layer including a non-foamed polyurethane, wherein the non-foamed polyurethane is a reaction cured body of a polyurethane raw material composition containing an isocyanate-terminated prepolymer obtained by reacting a prepolymer raw material composition containing a diisocyanate, a high-molecular-weight polyol and a low-molecular-weight polyol; an isocyanate modified body polymerized by adding three or more diisocyanates; and a chain extender, and the addition amount of the isocyanate-modified body is 5 to 30 parts by weight with respect to 100 parts by weight of the isocyanate-terminated prepolymer. The polishing pad hardly causes scratches on the surface of an object to be polished and has an improved dressing property.
摘要翻译：抛光垫具有包括非发泡聚氨酯的抛光层，其中非发泡聚氨酯是含有异氰酸酯封端的预聚物的聚氨酯原料组合物的反应固化体，其通过使含有二异氰酸酯的预聚物原料组合物，高分子量多元醇和低分子量多元醇; 通过加入三种或更多种二异氰酸酯聚合的异氰酸酯改性体; 和增链剂，相对于100重量份异氰酸酯封端的预聚物，异氰酸酯改性体的添加量为5〜30重量份。抛光垫几乎不会在待抛光物体的表面上产生划痕，并且具有改善的敷料性能。

14. 发明授权

US09079288B2 Polishing pad and method for producing same 有权
公开(公告)号：US09079288B2
公开(公告)日：2015-07-14
申请号：US13881336
申请日：2010-10-26
申请人： Yoshiyuki Nakai , Kazuyuki Ogawa , Kenji Nakamura
发明人： Yoshiyuki Nakai , Kazuyuki Ogawa , Kenji Nakamura
IPC分类号： B24B37/14 , B24D11/00 , B24B37/24 , B24B37/04
CPC分类号： B24B37/24 , B24B37/042 , B24D11/00
摘要： A polishing pad has a polishing layer including a non-foamed polyurethane, wherein the non-foamed polyurethane is a reaction cured body of a polyurethane raw material composition containing an isocyanate-terminated prepolymer obtained by reacting a prepolymer raw material composition containing a diisocyanate, a high-molecular-weight polyol and a low-molecular-weight polyol; an isocyanate modified body polymerized by adding three or more diisocyanates; and a chain extender, and the addition amount of the isocyanate-modified body is 5 to 30 parts by weight with respect to 100 parts by weight of the isocyanate-terminated prepolymer. The polishing pad hardly causes scratches on the surface of an object to be polished and has an improved dressing property.

15. 发明申请

US20090137189A1 POLISHING PAD 有权
标题翻译：抛光垫
公开(公告)号：US20090137189A1
公开(公告)日：2009-05-28
申请号：US12294402
申请日：2007-05-15
申请人： Takeshi Fukuda , Junji Hirose , Yoshiyuki Nakai , Tsuyoshi Kimura
发明人： Takeshi Fukuda , Junji Hirose , Yoshiyuki Nakai , Tsuyoshi Kimura
IPC分类号： B24B49/12 , B24D3/00
CPC分类号： B24B37/205
摘要： An object of the present invention is to provide a polishing pad excellent in optical detection accuracy in a broad wavelength range (particularly at the short-wavelength side) and capable of preventing a slurry from leaking from the boundary between a polishing region and a light-transmitting region. Disclosed is a polishing pad including at least a transparent support film laminated on one side of a polishing layer including a polishing region and a light-transmitting region, wherein the light transmittance of an optical detection region containing at least the light-transmitting region and the transparent support film is 40% or more in the overall range of wavelengths of 300 to 400 nm.
摘要翻译：本发明的目的是提供一种在宽波长范围（特别是短波长侧）的光学检测精度优异且能够防止浆料从抛光区域和发光体之间的边界泄漏的抛光垫，传输区域。公开了一种抛光垫，其至少包括层叠在包括抛光区域和透光区域的抛光层的一侧上的透明支撑膜，其中至少包含透光区域和透明支撑膜在波长为300〜400nm的整个范围内为40％以上。

16. 发明授权

US07927183B2 Polishing pad 有权
标题翻译：抛光垫
公开(公告)号：US07927183B2
公开(公告)日：2011-04-19
申请号：US12294391
申请日：2007-05-15
申请人： Takeshi Fukuda , Junji Hirose , Yoshiyuki Nakai , Tsuyoshi Kimura
发明人： Takeshi Fukuda , Junji Hirose , Yoshiyuki Nakai , Tsuyoshi Kimura
IPC分类号： B24B49/00
CPC分类号： B24B37/205
摘要： A polishing pad provides excellent optical detection accuracy properties over a broad wavelength range (particularly at the short-wavelength side). A method for manufacturing a semiconductor device includes a process of polishing the surface of a semiconductor wafer with this polishing pad. The polishing pad has a polishing layer containing a polishing region and a light-transmitting region, wherein the light-transmitting region includes a polyurethane resin having an aromatic ring density of 2 wt % or less, and the light transmittance of the light-transmitting region is 30% or more in the overall range of wavelengths of 300 to 400 nm.
摘要翻译：抛光垫在宽波长范围（特别是在短波长侧）提供优异的光学检测精度特性。半导体器件的制造方法包括利用该研磨垫对半导体晶片的表面进行研磨的工序。抛光垫具有包含抛光区域和透光区域的抛光层，其中透光区域包括芳族环密度为2重量％以下的聚氨酯树脂，透光区域的透光率在波长为300〜400nm的整个范围内为30％以上。

17. 发明授权

US07874894B2 Polishing pad 有权
标题翻译：抛光垫
公开(公告)号：US07874894B2
公开(公告)日：2011-01-25
申请号：US12294402
申请日：2007-05-15
申请人： Takeshi Fukuda , Junji Hirose , Yoshiyuki Nakai , Tsuyoshi Kimura
发明人： Takeshi Fukuda , Junji Hirose , Yoshiyuki Nakai , Tsuyoshi Kimura
IPC分类号： B24B49/00
CPC分类号： B24B37/205
摘要： A polishing pad provides excellent optical detection accuracy properties over a broad wavelength range (particularly at the short-wavelength side) and is capable of preventing a slurry from leaking from the boundary between a polishing region and a light-transmitting region. The polishing pad includes at least a transparent support film laminated on one side of a polishing layer including a polishing region and a light-transmitting region; the light transmittance of an optical detection region containing at least the light-transmitting region and the transparent support film is 40% or more in the overall range of wavelengths of 300 to 400 nm.
摘要翻译：抛光垫在宽波长范围（特别是短波长侧）提供优异的光学检测精度特性，并且能够防止浆料从抛光区域和透光区域之间的边界泄漏。抛光垫至少包括层叠在包括抛光区域和透光区域的抛光层的一侧上的透明支撑膜; 至少含有透光区域和透明支撑膜的光学检测区域的光透射率在波长为300〜400nm的整个范围内为40％以上。

18. 发明申请

US20090075568A1 POLISHING PAD, METHOD OF PRODUCING THE SAME AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE BY USING THE SAME 审中-公开
标题翻译：抛光垫，其制造方法和使用该方法制造半导体器件的方法
公开(公告)号：US20090075568A1
公开(公告)日：2009-03-19
申请号：US11912092
申请日：2006-02-24
申请人： Tsuyoshi Kimura , Yoshiyuki Nakai , Masahiro Watanabe
发明人： Tsuyoshi Kimura , Yoshiyuki Nakai , Masahiro Watanabe
IPC分类号： B24D11/00 , B24B1/00 , B24D18/00 , B24B7/20
CPC分类号： B24B37/26 , B24D3/32 , Y10T29/49995 , Y10T83/0304 , Y10T409/303808 , Y10T409/304536
摘要： The present invention provides a polishing pad used for planarizing inter layer dielectrics and the like by CMP (chemical mechanical polishing) in the manufacturing process of a semiconductor device, a method of producing the polishing pad and a method of producing a semiconductor device by using the polishing pad. The present invention relates to a semiconductor wafer polishing pad having grooves in a polishing surface and formed from a foamed polyurethane, wherein a processed surface of the groove comprising a side surface and a bottom surface has a surface roughness Ra of not more than 10.
摘要翻译：本发明提供了一种用于在半导体器件的制造工艺中通过CMP（化学机械抛光）平坦化层间电介质等的抛光垫，制造抛光垫的方法以及通过使用该半导体器件制造半导体器件的方法抛光垫本发明涉及一种半导体晶片抛光垫，该抛光垫在抛光表面上由发泡聚氨酯形成，其中包括侧面和底面的槽的加工表面的表面粗糙度Ra不大于10。

19. 发明申请

US20130000459A1 POLISHING PAD, METHOD OF PRODUCING THE SAME AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE BY USING THE SAME 有权
公开(公告)号：US20130000459A1
公开(公告)日：2013-01-03
申请号：US13615065
申请日：2012-09-13
申请人： Tsuyoshi KIMURA , Yoshiyuki Nakai , Masahiro Watanabe
发明人： Tsuyoshi KIMURA , Yoshiyuki Nakai , Masahiro Watanabe
IPC分类号： B26D3/06
CPC分类号： B24B37/26 , B24D3/32 , Y10T29/49995 , Y10T83/0304 , Y10T409/303808 , Y10T409/304536
摘要： The present invention provides a polishing pad used for planarizing inter layer dielectrics and the like by CMP (chemical mechanical polishing) in the manufacturing process of a semiconductor device, a method of producing the polishing pad and a method of producing a semiconductor device by using the polishing pad. The present invention relates to a semiconductor wafer polishing pad having grooves in a polishing surface and formed from a foamed polyurethane, wherein a processed surface of the groove comprising a side surface and a bottom surface has a surface roughness Ra of not more than 10.

20. 发明授权

US08517798B2 Polishing pad, method of producing the same and method of producing semiconductor device by using the same 有权
标题翻译：抛光垫，其制造方法以及使用该半导体器件的方法
公开(公告)号：US08517798B2
公开(公告)日：2013-08-27
申请号：US13615065
申请日：2012-09-13
申请人： Tsuyoshi Kimura , Yoshiyuki Nakai , Masahiro Watanabe
发明人： Tsuyoshi Kimura , Yoshiyuki Nakai , Masahiro Watanabe
IPC分类号： B24B49/00
CPC分类号： B24B37/26 , B24D3/32 , Y10T29/49995 , Y10T83/0304 , Y10T409/303808 , Y10T409/304536
摘要： The present invention provides a polishing pad used for planarizing inter layer dielectrics and the like by CMP (chemical mechanical polishing) in the manufacturing process of a semiconductor device, a method of producing the polishing pad and a method of producing a semiconductor device by using the polishing pad. The present invention relates to a semiconductor wafer polishing pad having grooves in a polishing surface and formed from a foamed polyurethane, wherein a processed surface of the groove comprising a side surface and a bottom surface has a surface roughness Ra of not more than 10.
摘要翻译：本发明提供了一种用于在半导体器件的制造工艺中通过CMP（化学机械抛光）平坦化层间电介质等的抛光垫，制造抛光垫的方法以及通过使用该半导体器件制造半导体器件的方法抛光垫本发明涉及一种半导体晶片抛光垫，该抛光垫在抛光表面上由发泡聚氨酯形成，其中包括侧面和底面的槽的加工表面的表面粗糙度Ra不大于10。

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