专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

11. 发明授权

US4370386A Reinforced unsaturated polyester resin laminate 失效
标题翻译：强化不饱和聚酯树脂层压板
公开(公告)号：US4370386A
公开(公告)日：1983-01-25
申请号：US189860
申请日：1980-09-15
申请人： Masakazu Uekita , Yasuo Fushiki , Masaharu Abe
发明人： Masakazu Uekita , Yasuo Fushiki , Masaharu Abe
IPC分类号： B32B15/04 , B32B15/08 , B32B15/09 , C08J5/24 , H01B17/60 , H05K1/03 , H05K3/02 , B32B15/12 , B32B27/04 , B32B27/42
CPC分类号： H05K1/036 , B32B15/08 , H05K3/022 , B32B2457/08 , H05K1/0366 , H05K2201/0145 , H05K2201/0284 , H05K2201/0293 , H05K2203/068 , H05K2203/1476 , Y10T428/31681 , Y10T428/31688 , Y10T428/31703 , Y10T428/3179 , Y10T428/31794 , Y10T428/31949 , Y10T428/31964
摘要： An electrical laminate comprising layers of an unsaturated polyester resin-impregnated fibrous cellulosic substrate is disclosed. The substrate is preimpregnated with a mixture and/or a condensate of an aminoplast with a higher fatty derivative having at least one functional group capable of condensation with the methylol group of aminoplast. The laminate exhibits improved moisture resistance and punchability.
摘要翻译：公开了一种包含不饱和聚酯树脂浸渍的纤维状纤维素基材层的电气层压材料。将底物与氨基塑料的混合物和/或缩合物与具有至少一个能够与氨基塑料的羟甲基缩合的官能团的高级脂肪衍生物预先浸渍。层压材料具有改善的耐湿性和冲压性。

12. 发明授权

US4336297A Electrical laminate 失效
标题翻译：电气层压板
公开(公告)号：US4336297A
公开(公告)日：1982-06-22
申请号：US143086
申请日：1980-04-23
申请人： Yasuo Fushiki , Masaharu Abe , Masakazu Uekita
发明人： Yasuo Fushiki , Masaharu Abe , Masakazu Uekita
IPC分类号： B32B27/36 , B32B15/08 , B32B27/04 , B32B27/16 , B32B38/08 , C08J5/24 , H01B3/42 , H05K1/03 , H05K3/02 , B32B7/00
CPC分类号： B32B38/08 , H05K3/022 , B32B2457/08 , H05K1/036 , H05K1/0366 , H05K2203/068 , Y10S428/901 , Y10T428/3188 , Y10T428/31906
摘要： An electrical laminate comprising layers of a polyester resin-impregnated fibrous cellulosic substrate is disclosed. The substrate is preimpregnated with a nitrogen-containing composition having (a) an N-methylol or N-lower alkoxymethyl group attached to said nitrogen atom, and (b) an unsaturated group capable of copolymerizing with a cross-linking monomer present in the polyester resin.
摘要翻译：公开了一种包含聚酯树脂浸渍的纤维状纤维素基材层的电气层压材料。将底物用含有（a）与所述氮原子连接的N-羟甲基或N-低级烷氧基甲基的含氮组合物进行预浸渍，和（b）能够与聚酯中存在的交联单体共聚的不饱和基团树脂。

13. 发明授权

US5261935A Clean air apparatus 失效
标题翻译：清洁空气装置
公开(公告)号：US5261935A
公开(公告)日：1993-11-16
申请号：US23394
申请日：1993-02-26
申请人： Katsumi Ishii , Takanobu Asano , Masaharu Abe , Kenichi Yamaga , Kazunari Sakata , Takashi Tanahashi , Syuji Moriya
发明人： Katsumi Ishii , Takanobu Asano , Masaharu Abe , Kenichi Yamaga , Kazunari Sakata , Takashi Tanahashi , Syuji Moriya
IPC分类号： C30B33/00 , H01L21/00 , H01L21/677 , B01D46/04
CPC分类号： H01L21/67757 , C30B33/00 , H01L21/67017 , H01L21/67769 , H01L21/67772 , Y10S414/137 , Y10S414/139 , Y10S414/14
摘要： A clean air apparatus includes a housing having an opening through which a carrier housing semiconductor wafers is supplied into the housing and an I/O port for supporting the carrier and a furnace for treating the wafer, provided in the upper portion of the housing. The carriers are at the same time supported by a first carrier stage provided in the upper portion of the housing and supported by a second carrier stage provided in the lower portion of the housing. The carrier or carriers are selectively moved between the I/O port and the first stage, between the I/O port and the second stage, and between the first stage and the second stage. A clean air is applied to the wafers in the carriers supported by the I/O port, the first stage and the second stage.
摘要翻译：清洁空气装置包括壳体，壳体具有开口，载体壳体半导体晶片被供给到壳体中，以及用于支撑载体的I / O端口和设置在壳体的上部中的晶片处理炉。载体同时由设置在壳体的上部中的第一载体台支撑并由设置在壳体的下部中的第二载体台支撑。载体或载体选择性地在I / O端口和第一级之间，I / O端口和第二级之间以及在第一级和第二级之间移动。将清洁空气施加到由I / O端口，第一级和第二级支撑的载体中的晶片。

14. 发明授权

US4370191A Electrical laminate 失效
标题翻译：电气层压板
公开(公告)号：US4370191A
公开(公告)日：1983-01-25
申请号：US164512
申请日：1980-07-02
申请人： Masakazu Uekita , Masaharu Abe
发明人： Masakazu Uekita , Masaharu Abe
IPC分类号： B32B15/08 , C09J5/00 , D21H17/53 , H05K1/03 , C09J5/02
CPC分类号： H05K1/0326 , B32B15/08 , C09J5/00 , D21H17/53 , Y10T428/31681 , Y10T428/3179 , Y10T428/31794
摘要： An electrical laminate comprising layers of a resin impregnated fibrous substrate is disclosed. The resin has a glass transition point from about 20.degree. C. to 80.degree. C. and comprises a cured product of a mixture of an unsaturated polyester polymer and a cross-linking monomer. The laminate exhibits an improved punchability at a temperature not lower but not 20.degree. C. higher than the glass transition point of the resin.
摘要翻译：公开了一种包含树脂浸渍纤维基材层的电气层压板。树脂的玻璃化转变点为约20℃至80℃，并且包含不饱和聚酯聚合物和交联单体的混合物的固化产物。在不低于但不高于树脂的玻璃化转变点的20℃的温度下，该层压体显示出改进的冲压性。

15. 外观设计

USD339376S Adjustable drafting tool for making perspective drawings 失效
公开(公告)号：USD339376S
公开(公告)日：1993-09-14
申请号：US506358
申请日：1990-04-09
申请人： Masaharu Abe
设计人： Masaharu Abe

16. 发明授权

US5236181A Vertical heat treating apparatus 失效
标题翻译：立式热处理装置
公开(公告)号：US5236181A
公开(公告)日：1993-08-17
申请号：US765890
申请日：1991-09-26
申请人： Katsumi Ishii , Takanobu Asano , Masaharu Abe
发明人： Katsumi Ishii , Takanobu Asano , Masaharu Abe
IPC分类号： C30B33/00
CPC分类号： C30B33/00
摘要： A vertical heating apparatus comprises a casing having an opening through which a plurality of transport members receiving articles to be processed are loaded in and unloaded from the casing, a heat treating furnace provided in an upper portion of the casing, a transport member storing portion provided in the casing at a side space of the heat treating furnace, for receiving the transport members, a processing member for transporting the articles to be processed in the heat treating furnace, a transferring mechanism for transferring the articles to be processed and received by the transport members to the processing member, and a vertically moving mechanism provided below the heat treating furnace in the casing, for loading and unloading the articles to be processed and received by the processing member in and from the heat treating furnace.
摘要翻译：立式加热装置包括具有开口的多个运送构件的容纳体，所述多个运送构件容纳待加工物品从所述壳体上装卸的壳体，设置在所述壳体的上部的热处理炉，在热处理炉的侧空间的壳体中，为了接收输送构件，在处理炉中输送待处理物品的搬运机构，用于转运待处理物品的运送机构，构件到加工构件，以及设置在壳体内的热处理炉下方的垂直移动机构，用于将处理构件加工和被处理物品加载和卸载在热处理炉内。

17. 发明授权

US06576179B1 Injection molding process using a pair of reservoirs and an injection device 失效
标题翻译：注射成型工艺使用一对储存器和注射装置
公开(公告)号：US06576179B1
公开(公告)日：2003-06-10
申请号：US09613283
申请日：2000-07-10
申请人： Masaharu Abe , Hiroshi Yamamoto , Kyoichi Nakamura
发明人： Masaharu Abe , Hiroshi Yamamoto , Kyoichi Nakamura
IPC分类号： B29C4554
CPC分类号： B29C45/542 , B29C45/50 , B29C2045/466
摘要： An injection-molding process including kneading functional particles with a binder resin in a kneader, temporarily storing the kneaded material supplied from the kneader in a reservoir device and feeding the kneaded material stored in the reservoir device to an injection device, the reservoir device including a pair of reservoirs, the kneaded material stored in one reservoir device is fed to the injection device where the kneaded material is then injection-molded, and simultaneously the kneaded material is fed from the kneader to another reservoir device and stored in it. Then, the kneaded material stored in the other reservoir device is fed to the injection device where the kneaded material is then injection-molded, and simultaneously the kneaded material is fed from the kneader to the one reservoir device and stored in it, so that the injection molding process is conducted by alternately repeating the above steps by switching operations. This injection-molding process is capable of producing a molded product of uniform quality by preventing feed pressure of the kneaded material fed to an injection device from being transmitted to the kneader.
摘要翻译：一种注射成型方法，包括在捏合机中将功能性颗粒与粘合剂树脂捏合，将从捏合机供给的捏合材料临时储存在储存装置中，并将储存在储存装置中的捏合材料进料到注射装置，该储存装置包括存储在一个贮存器中的捏合物料被供给到注射装置，在该注入装置中捏合的材料然后被注射成型，同时将捏合的材料从捏合机进料到另一储存装置并储存在其中。然后，将存储在另一个储存装置中的捏合物供给到注射装置，在该装置中捏合材料然后注射成型，同时将捏合材料从捏合机供给到一个储存装置并储存在其中，通过切换操作交替重复上述步骤进行注射成型工艺。这种注射成型工艺能够通过防止供给到注射装置的捏合材料的进料压力传递到捏合机来产生质量均匀的模制产品。

18. 发明授权

US6042757A Injection-molding apparatus and method of injection-molding 失效
标题翻译：注射成型装置和注射成型方法
公开(公告)号：US6042757A
公开(公告)日：2000-03-28
申请号：US84921
申请日：1998-05-28
申请人： Masaharu Abe , Shigeru Takaragi , Hiroshi Yamamoto , Kyoichi Nakamura , Osamu Sasaki
发明人： Masaharu Abe , Shigeru Takaragi , Hiroshi Yamamoto , Kyoichi Nakamura , Osamu Sasaki
IPC分类号： B29C45/00 , B29C45/42 , B29C45/72
CPC分类号： B29C45/4225 , B29C45/0013 , B29C45/7207
摘要： An injection-molding device including an injection machine, a mold unit connected to the injection machine having separable molds defining a cavity for forming a molded product, and chucks next to the mold unit for removing a molded product from the mold. The molded product is initially coolied in the mold cavity then again cooled after removal from the mold unit. Plural chucks are advanced into and retreated from a region defined by the open molds, the chucks being a pair of blocks grasping the surface of the molded product, each block having a circulating path through which a heating medium is passed to cool the grasping surface. The injection-molding apparatus produces articles having high dimensional accuracy, for example, electronic parts such as a magnet roll or the like.
摘要翻译：一种注射成型装置，包括注射机，连接到注射机的模具单元，其具有限定用于形成模制产品的空腔的可分离模具，以及紧靠模具单元卡住从模具中移出模制产品。模制产品最初在模腔中冷却，然后在从模具单元移除之后再次冷却。多个卡盘从由开放模具限定的区域前进和退出，卡盘是抓握模制产品表面的一对块，每个块具有循环路径，加热介质通过该循环路径来冷却抓握表面。注射成型装置生产具有高尺寸精度的制品，例如电磁部件如磁辊等。

19. 发明授权

US5318633A Heat treating apparatus 失效
标题翻译：热处理设备
公开(公告)号：US5318633A
公开(公告)日：1994-06-07
申请号：US846948
申请日：1992-03-06
申请人： Akihito Yamamoto , Naohiko Yasuhisa , Noriyoshi Mashimo , Masaharu Abe , Shingo Watanabe
发明人： Akihito Yamamoto , Naohiko Yasuhisa , Noriyoshi Mashimo , Masaharu Abe , Shingo Watanabe
IPC分类号： C23C16/44 , C23C16/455 , C23C16/46 , C30B25/08 , F27B17/00 , F27D7/02 , C23C16/00
CPC分类号： F27B17/0025 , C23C16/4404 , C23C16/45578 , C23C16/45591 , C23C16/46 , C30B25/08 , F27D7/02
摘要： A heat treating apparatus comprises a reaction tube for receiving a plurality of articles to be treated and a heating unit surrounding at least part of the reaction tube. The reaction tube comprises a first structural section, at least part of which is surrounded by the heating unit and a second structural section, at least part of which extends from the heating unit. The first structural section is made of material having thermal resistivity and thermal conductivity higher than the second structural section.
摘要翻译：热处理装置包括用于接收多个待处理物品的反应管和围绕反应管的至少一部分的加热单元。反应管包括第一结构部分，其至少一部分由加热单元包围，第二结构部分至少部分从加热单元延伸。第一结构部分由具有高于第二结构部分的热阻和热导率的材料制成。

20. 发明申请

US20100193972A1 SPHERICAL SINTERED FERRITE PARTICLES, RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION COMPRISING THEM AND SEMICONDUCTOR DEVICES PRODUCED BY USING THE SAME 审中-公开
标题翻译：球形烧结粉末颗粒，用于包含其使用它们的半导体器件的半导体封装的树脂组合物
公开(公告)号：US20100193972A1
公开(公告)日：2010-08-05
申请号：US12303856
申请日：2006-06-06
申请人： Kazumi Yamamoto , Masaharu Abe , Shigehisa Yamamoto , Kazushi Nishimoto , Tomohiro Dote , Kazumasa Igarashi , Kazuhiro Ikemura , Takuya Eto , Masataka Tada , Katsumi Okayama , Kaoru Kato
发明人： Kazumi Yamamoto , Masaharu Abe , Shigehisa Yamamoto , Kazushi Nishimoto , Tomohiro Dote , Kazumasa Igarashi , Kazuhiro Ikemura , Takuya Eto , Masataka Tada , Katsumi Okayama , Kaoru Kato
IPC分类号： H01L23/29 , C08K3/10 , C08K3/36
CPC分类号： C01G49/0018 , C01G49/0063 , C01G49/0072 , C01P2002/32 , C01P2002/50 , C01P2004/32 , C01P2004/51 , C01P2004/53 , C01P2004/61 , C01P2006/12 , C01P2006/14 , C01P2006/22 , C01P2006/42 , C01P2006/80 , C04B35/2625 , C04B35/265 , C04B35/6263 , C04B35/62655 , C04B35/62675 , C04B35/62685 , C04B35/62695 , C04B2235/3206 , C04B2235/3262 , C04B2235/3279 , C04B2235/3281 , C04B2235/3284 , C04B2235/528 , C04B2235/5409 , C04B2235/5436 , C04B2235/5445 , C04B2235/5472 , C04B2235/763 , C04B2235/79 , C08G59/621 , C08L63/00 , C09C1/24 , H01L23/295 , H01L23/3107 , H01L23/3128 , H01L23/552 , H01L24/45 , H01L24/48 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/48247 , H01L2224/48465 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01079 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , Y10T428/2982 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A resin composition for semiconductor encapsulation having good moldability, of which the cured product has effective electromagnetic wave shieldability, is provided. A resin composition for semiconductor encapsulation, containing spherical sintered ferrite particles having the following properties (a) to (c) : (a) the soluble ion content of the particles is at most 5 ppm; (b) the mean particle size of the particles is from 10 to 50 μm; (c) the crystal structure of the particles by X-ray diffractiometry is a spinel structure.
摘要翻译：提供了具有良好成型性的半导体封装用树脂组合物，其固化物具有有效的电磁波屏蔽性。一种半导体封装用树脂组合物，含有具有以下特性（a）〜（c）的球状烧结铁氧体颗粒：（a）颗粒的可溶性离子含量为5ppm以下，（b）颗粒的平均粒度为10〜50μm; （c）通过X射线衍射法测定的颗粒的晶体结构是尖晶石结构。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式