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11. 发明授权

US06742980B2 Method for aligning conveying position of object processing system, and object processing system 有权
标题翻译：对象处理系统的输送位置对准方法和对象处理系统
公开(公告)号：US06742980B2
公开(公告)日：2004-06-01
申请号：US10088892
申请日：2002-03-25
申请人： Yoshiaki Sasaki
发明人： Yoshiaki Sasaki
IPC分类号： B25J900
CPC分类号： H01L21/67259 , H01L21/681 , Y10S414/136
摘要： There is provided a processing system for processing a processing object, capable of precisely and efficiently carrying out alignment during a teaching operation. In a processing system for processing a processing object, the processing system comprising: processing apparatuses 12A and 12B, which have supporting tables 14A and 14B for supporting thereon objects to be processed, respectively, and which serve to carry out a predetermined processing for the processing objects; an orienter/positioner 32 for detecting an eccentric quantity and eccentric direction of the processing object mounted on a reference table 52; at least one transfer mechanism 20, 40A, 40B provided between the orienter/positioner and the processing apparatus; and a control part 70 for controlling the transfer mechanism and the orienter/positioner, the control part obtains a position shift quantity of the aligning substrate when the transfer mechanism causes the to-and-fro conveyance of the aligning substrate between the reference table and the supporting table to return the aligning substrate, as a to-and-fro position shift quantity, and obtains a position shift quantity of the aligning substrate when the aligning substrate precisely aligned to be mounted on the supporting table is conveyed to the reference table by the transfer mechanism, as a one-way position shift quantity, the control part modifying an conveying position of a processing object, which is conveyed toward the supporting table by the transfer mechanism, on the basis of the to-and-fro position shift quantity and the one-way position shift quantity. Thus, alignment during a teaching operation is precisely and efficiently carried out.
摘要翻译：提供了一种用于处理处理对象的处理系统，能够在教学操作期间精确且有效地执行对准。在处理对象的处理系统中，处理系统包括：具有支持表的处理设备12A和12B 14A，14B分别支撑待处理物体，用于对处理对象进行预定处理; 用于检测安装在基准台52上的处理对象的偏心量和偏心方向的取向器/定位器32; 设置在取向器/定位器与处理装置之间的至少一个传送机构20,40A，40B; 以及用于控制传送机构和定向器/定位器的控制部70，当传送机构使得对准基板在基准台和第二对准基板之间的往复传送时，控制部获得对准基板的位置偏移量支撑台返回对准基板，作为来回位置移动量，并且当将安装在支撑台上的精确对准的对准基板输送到参考台时，获得对准基板的位置偏移量传送机构，作为单向位置偏移量，控制部件根据来回位置移动量，修正由传送机构向支承台传送的处理对象的传送位置，以及单向位置偏移量。因此，精确有效地执行教学操作期间的对准。

12. 发明授权

US08318238B2 Film position adjusting method, memory medium and substrate processing system 有权
标题翻译：胶片位置调整方法，记忆介质和底物处理系统
公开(公告)号：US08318238B2
公开(公告)日：2012-11-27
申请号：US12298570
申请日：2007-04-26
申请人： Yoshiaki Sasaki , Hirofumi Yamaguchi
发明人： Yoshiaki Sasaki , Hirofumi Yamaguchi
IPC分类号： C23C16/52 , C23C16/00
CPC分类号： H01L21/681 , C23C16/04 , C23C16/52 , H01L21/67259 , H01L21/67288
摘要： A substrate processing system includes a processing chamber 12, and an orienter 16 centering a wafer W. The orienter 16 is provided with an orienter sensor 42 measuring a central position discrepancy of the wafer W, and an image sensor 41 measuring a width of a non-film forming portion at circumferential portions of the wafer W. After a film deposition processing in the processing chamber 12, the wafer W is loaded into the orienter 16 where a central position discrepancy of the wafer W is measured, and the wafer W is then centered. Further, the width of the non-film forming portion of the wafer W is measured, and a film position discrepancy is calculated based on the width of the non-film forming portion. To correct the calculated film position discrepancy, a target transfer position of the wafer W on a mounting table 13 in the processing chamber 12 is adjusted.
摘要翻译：基板处理系统包括处理室12和定向晶片W定向器16.定向器16设置有测量晶片W的中心位置偏差的定向传感器42和测量晶片W的宽度的图像传感器41，在晶片W的圆周部分处形成膜。在处理室12中进行成膜处理之后，将晶片W装载到定向器16中，其中测量晶片W的中心位置差异，然后晶片W 居中此外，测量晶片W的非成膜部分的宽度，并且基于非成膜部分的宽度计算膜位置差异。为了校正计算出的胶片位置偏差，调整处理室12中的安装台13上的晶片W的目标转印位置。

13. 发明申请

US20100326637A1 LOAD-LOCK APPARATUS AND SUBSTRATE COOLING METHOD 审中-公开
标题翻译：负载装置和底板冷却方法
公开(公告)号：US20100326637A1
公开(公告)日：2010-12-30
申请号：US12865225
申请日：2009-01-19
申请人： Yoshiaki Sasaki , Takao Sugimoto
发明人： Yoshiaki Sasaki , Takao Sugimoto
IPC分类号： F28F7/00
CPC分类号： H01L21/67201 , H01L21/67109
摘要： A load-lock apparatus includes a vessel arranged to change a pressure between a pressure corresponding to the vacuum chamber and the atmospheric pressure, a pressure adjusting mechanism which adjusts a pressure in the vessel to a pressure corresponding to the vacuum chamber and the atmospheric pressure, a cooling member having a cooling mechanism and arranged in the vessel to cool a substrate by having the substrate placed on or in proximity to the cooling member, a substrate deformation detection unit for detecting deformation of the substrate in the vessel, and a controller which reduces a cooling rate of the substrate when the substrate deformation is detected during a substrate cooling period until the vessel is adjusted to have the atmospheric pressure after the vessel is adjusted to have a pressure corresponding to the vacuum chamber and a high temperature substrate is loaded into the vessel from the vacuum chamber.
摘要翻译：一种装载锁定装置包括：设置用于改变与真空室对应的压力与大气压力之间的压力的容器;将容器内的压力调节到与真空室对应的压力和压力的压力调节机构; 冷却部件，其具有冷却机构，并且设置在所述容器中，通过将所述基板设置在所述冷却部件上或所述冷却部件附近来冷却基板;基板变形检测部，其检测所述容器内的基板的变形;以及控制部，在基板冷却期间检测到基板变形之前的基板的冷却速度，直到容器被调节为在容器被调节为具有对应于真空室的压力和高温基板之后被调节为具有大气压力容器从真空室。

14. 发明授权

US07697745B2 Enclosure inspection method and apparatus thereof 有权
标题翻译：外壳检查方法及其装置
公开(公告)号：US07697745B2
公开(公告)日：2010-04-13
申请号：US11452525
申请日：2006-06-14
申请人： Chiko Otani , Yoshiaki Sasaki , Gosei Okazaki , Kazunori Ninomiya , Masahiro Yamashita , Kengo Takahashi , Atsushi Takasuka , Toru Kitaguchi
发明人： Chiko Otani , Yoshiaki Sasaki , Gosei Okazaki , Kazunori Ninomiya , Masahiro Yamashita , Kengo Takahashi , Atsushi Takasuka , Toru Kitaguchi
IPC分类号： G06K9/00 , G01N23/04 , G01J5/00
CPC分类号： G01N21/3581 , G01N21/3563 , G01N22/00 , G01T1/1603 , G01V5/0033
摘要： In an enclosure inspection apparatus 11, when a sealed letter 2 is inputted into a sealed letter loading station A, visual inspecting means 27 and X-ray inspecting means 33 determine thickness of the sealed letter and whether an enclosure in the sealed letter is a predetermined suspected object. The sealed letter not less than a predetermined thickness is rejected in first sorting station D, and the sealed letter which is not thicker than the predetermined thickness and in which the suspected object is not detected is conveyed as it is to second sorting station G. As for the sealed letter which is not thicker than the predetermined thickness and in which the suspected object is detected, after the suspected object in the sealed letter is positioned in a positioning station E, a suspected object inspecting station F determines whether the above-described suspected object is a predetermined object, such as an explosive or a narcotic drug, using a terahertz wave.It is possible to detect promptly the presence of the objects even if there are a large number of sealed letters.
摘要翻译：在外壳检查装置11中，当将密封字母2输入到密封信函装载站A中时，目视检查装置27和X射线检查装置33确定密封字母的厚度以及密封字母中的外壳是否是预定的怀疑对象。在第一分拣站D中拒绝不小于预定厚度的密封字母，并且将未被检测到可疑物体的不厚于预定厚度的密封字母原样传送到第二分拣站G. 对于不厚于预定厚度并且其中检测到可疑物体的密封字母，在密封字母中的可疑物体位于定位站E中之后，疑似物体检查站F确定上述可疑物体物体是使用太赫兹波的预定物体，例如爆炸物或麻醉药物。即使有大量的密封字母，也可以及时检测物体的存在。

15. 发明授权

US06579056B2 Cart for mounting/demounting wafer transfer robot 有权
标题翻译：用于安装/拆卸晶片传送机器人的购物车
公开(公告)号：US06579056B2
公开(公告)日：2003-06-17
申请号：US09870728
申请日：2001-06-01
申请人： Yoshiaki Sasaki , Takaaki Hirooka , Shuji Hagihara
发明人： Yoshiaki Sasaki , Takaaki Hirooka , Shuji Hagihara
IPC分类号： B65G2900
CPC分类号： H01L21/67724 , H01L21/67736
摘要： An object of the present invention is to provide a wafer transfer robot mount/demount cart for simply mounting and demounting a wafer transfer robot which is linearly, substantially horizontally reciprocated in a wafer transfer apparatus to transfer wafers. A pair of mount/demount cart-side rails 9 which can be connected to a pair of wafer transfer apparatus-side guide rails mounted inside a wafer transfer apparatus D is mounted on a raised portion 5 of the mount/demount cart A. A joint rail S is mounted in a gap between the pair of wafer transfer apparatus-side rails and the pair of mount/demount cart-side rails 9 so as to slide a wafer transfer robot R onto the pair of mount/demount cart-side rails 9 via the joint rail S.
摘要翻译：本发明的目的是提供一种用于简单地安装和拆卸晶片传送机器人的晶片传送机器人安装/拆卸车，其在晶片传送装置中线性地基本上水平往复运动以转移晶片。可安装在晶片传送装置D内的一对晶片传送装置侧导轨上的一对安装/拆卸车侧导轨9安装在安装/卸载车A的凸起部5上。轨道S安装在一对晶片转印装置侧轨道和一对安装/拆卸车侧导轨9之间的间隙中，以将晶片传送机器人R滑动到一对安装/拆卸车侧导轨9上通过联合轨道S.

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