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    • 13. 发明授权
    • Semiconductor apparatus having conductive thin films and manufacturing apparatus therefor
    • 具有导电薄膜的半导体装置及其制造装置
    • US06468845B1
    • 2002-10-22
    • US09536642
    • 2000-03-28
    • Takashi NakajimaHideo MiuraHiroyuki OhtaNoriaki Okamoto
    • Takashi NakajimaHideo MiuraHiroyuki OhtaNoriaki Okamoto
    • H01L2184
    • H01L21/28097H01L21/28035H01L21/28518H01L21/28525H01L21/32053H01L21/76838H01L21/76877H01L21/823437H01L23/485H01L23/53257H01L23/53271H01L28/40H01L29/4925H01L29/4975H01L2924/0002Y10T117/10Y10T117/1004H01L2924/00
    • In forming an electrode 2 on a silicon oxide film 5 on a semiconductor substrate 4 through a silicon oxide film 5, for example, the gate electrode 2 is structured in a laminated structure of a plurality of polycrystalline silicon layers 6. The portion of the gate electrode 2 is formed by a method of manufacturing a thin film having a process of depositing amorphous layers and a process of crystallizing (recrystallizing) this amorphous material. In this case, depositing of the amorphous layers is carried out dividedly by a plurality of times so that the thickness of an amorphous layer to be deposited at one time is not larger than a thickness to be prescribed by a critical stress value determined according to a fail event, the amorphous material is crystallized after each process of depositing each amorphous layer has been finished, and the process of depositing amorphous layers and the process of crystallizing the amorphous material are repeated, whereby a laminated structure of the polycrystalline layer 6 having a necessary film thickness is obtained. With the above-described arrangement, it is possible to prevent a deterioration of electric characteristics of a semiconductor device and an occurrence of a defect, such as a peeling off between layers, cracks in a layer, etc., and it is possible to obtain a polycrystalline layer of small grain size in a desired film thickness by a lamination of polycrystalline materials.
    • 例如,通过氧化硅膜5在半导体衬底4上的氧化硅膜5上形成电极2时,栅电极2被构成为多个多晶硅层6的层叠结构。栅极部分 通过制造具有沉积非晶层的工艺的薄膜的方法和使该非晶材料结晶(再结晶)的方法形成电极2。 在这种情况下,非晶层的沉积被分开多次进行,使得一次沉积的非晶层的厚度不大于根据根据下式确定的临界应力值规定的厚度 在每个非晶层的沉积过程完成之后,非晶材料结晶,重复沉积非晶层的过程和结晶非晶材料的过程,由此多晶层6的层压结构具有必要的 获得膜厚度。 利用上述结构,可以防止半导体器件的电特性的恶化和层之间的剥离等缺陷的发生,层中的裂纹等,并且可以获得 通过多晶材料的层叠,具有所需膜厚度的小晶粒尺寸的多晶层。
    • 15. 发明授权
    • Magnetic disk having an improved surface configuration
    • 具有改进的表面构造的磁盘
    • US5202810A
    • 1993-04-13
    • US513609
    • 1990-04-24
    • Takao NakamuraNobuya SekiyamaMasaki OhuraYoshiki KatoNoriaki OkamotoMasami Masuda
    • Takao NakamuraNobuya SekiyamaMasaki OhuraYoshiki KatoNoriaki OkamotoMasami Masuda
    • G11B5/82G11B5/84
    • G11B5/8404G11B5/82Y10S428/90
    • A magnetic disk includes a non-magnetic substrate with a surface processed layer having fine irregularities formed at least on a main surface thereof, and at least thin film magnetic film and a protective film formed in that order on the non-magnetic substrate in such a manner that the fine irregularities are duplicated thereof. The surface of the surface processed layer of the non-magnetic substrate has protrusions whose surfaces are made flat and a configuration which exhibits a three-dimensional bearing curve in which the bearing ratio at a section taken at a depth from the top of the surface which corresponds to the portion of the top portion deformed by the head load during the contact start-stops drive is between 0.1% and 10%. The protrusions formed on the surface processed layer have a height ranging from several nm to several tens of nm. The bearing ratio is a value obtained at a depth of 5 to 10 nm from the top of the protrusions.
    • 磁盘包括具有至少在其主表面上形成有细微凹凸的表面处理层的非磁性基板,以及至少在非磁性基板上形成的薄膜磁性膜和保护膜。 方式是细微的不规则被复制。 非磁性基板的表面处理层的表面具有突起,其表面是平坦的,并且具有三维轴承曲线的构造,其中在从表面的顶部开始的深度处截取的截面的轴承比 对应于在接触开始 - 停止期间头部负载变形的顶部的部分在0.1%和10%之间。 形成在表面处理层上的突起具有几nm至几十nm的高度。 轴承比是从突起的顶部开始的深度为5〜10nm的值。
    • 16. 发明授权
    • Method of designing a semiconductor device
    • 设计半导体器件的方法
    • US06949387B2
    • 2005-09-27
    • US10626718
    • 2003-07-25
    • Hideo MiuraMakoto OgasawaraHiroo MasudaJun MurataNoriaki Okamoto
    • Hideo MiuraMakoto OgasawaraHiroo MasudaJun MurataNoriaki Okamoto
    • H01L21/762H01L27/08H01L21/66
    • H01L21/76205H01L21/76202H01L27/0802
    • A technique for a semiconductor device is provided that includes forming circuit regions on a device formation region and device isolation regions on a semiconductor substrate, a ratio of the width of a device isolation region to the width of adjacent circuit regions thereto is set at 2 to 50. A design method is also provided and includes conducting measurements such as of thicknesses of a pad oxide film and a nitride film, the internal stress of the nitride film, the width of both device formation and isolation regions, the depth of the etched portion of the nitride film for forming the groove in a device isolation region, conducting stress analysis in the proximity of the groove due to thermal oxidation, and setting values pertaining to the width of the device formation region and of the device isolation region which do not lead to occurrence of dislocation.
    • 提供了一种半导体器件的技术,其包括在器件形成区域上形成电路区域和半导体衬底上的器件隔离区域,器件隔离区域的宽度与其相邻电路区域的宽度的比率被设置为2至 还提供了一种设计方法,包括进行测量,例如衬垫氧化膜和氮化物膜的厚度,氮化物膜的内部应力,器件形成和隔离区域的宽度,蚀刻部分的深度 的用于在器件隔离区域中形成沟槽的氮化物膜,由于热氧化而在沟槽附近进行导电应力分析,以及与器件形成区域的宽度和不引导的器件隔离区域的设定值 发生脱位。
    • 20. 发明授权
    • Sorter for an image forming apparatus
    • 用于图像形成装置的分拣机
    • US5452887A
    • 1995-09-26
    • US214710
    • 1994-03-18
    • Keiji OkumuraTakeshi AokiToru HimegiNoriaki Okamoto
    • Keiji OkumuraTakeshi AokiToru HimegiNoriaki Okamoto
    • B65H39/11B42C1/12B65H31/30B65H31/34G03G15/00B65H39/10
    • B42C1/125
    • A sorter for sorting sheets discharged from an image forming apparatus, comprising a sorter frame; a plurality of bins disposed in the vertical direction, for making stacks of the discharged sheets; a bin frame incorporating the bins and having an opening on a front side adapting the sorter for a stack-removal operation; a processing mechanism provided on the image-forming-apparatus side of the bins, for processing the stacks; a first driving mechanism for driving a bin at a bin-processing position opposite the processing mechanism to slide toward the processing mechanism for feeding the image-forming-apparatus side end of said stack to the processing mechanism; a single unit slide guide for guiding a bin at the bin processing position toward the processing mechanism; a second driving mechanism including a pair of rods disposed vertically on the front and back sides of the sorter frame, the rods move the bins and the bin frame vertically and support the bins from either side at a position inward from an image-forming-apparatus end of the bins, whereby the bins extend outward from the bin support position toward the image-forming-apparatus; and a tamping mechanism including a member for abutting with a side of the stacks to make neat stacks of sheets in the bins, the abutting member is provided on the front side of the sorter frame and beside the bin support position of the rod.
    • 一种用于对从图像形成装置排出的纸张进行分类的分拣机,包括分拣机框架; 沿垂直方向设置的多个箱,用于使排出的纸张堆叠; 一个装有箱子的箱体框架,并且在正面上具有一个开口,使得分类器能够进行排纸操作; 处理机构,设置在所述箱的图像形成装置侧,用于处理所述堆叠; 用于在与所述处理机构相对的仓处理位置处驱动仓的第一驱动机构朝向所述堆叠的图像形成装置侧端向处理机构供给的处理机构滑动; 单个单元滑动引导件,用于将处理仓处理位置处的仓导向处理机构; 第二驱动机构,其包括垂直设置在分拣机框架的前侧和后侧的一对杆,所述杆垂直地移动所述箱和所述仓箱,并且在图像形成装置内侧的位置处从所述一侧支撑所述箱体 从而使箱从箱支撑位置朝向图像形成装置向外延伸; 以及捣固机构,其包括用于与所述堆叠的一侧抵接以在所述箱中形成整齐的片材的构件,所述抵接构件设置在所述分拣机框架的前侧以及所述杆的所述料仓支撑位置的旁边。