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11. 发明授权

US07198962B2 Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step 失效
标题翻译：半导体器件及其制造方法，包括探针测试步骤和老化测试步骤
公开(公告)号：US07198962B2
公开(公告)日：2007-04-03
申请号：US10411283
申请日：2003-04-11
申请人： Ryuji Kohno , Tetsuo Kumazawa , Makoto Kitano , Akihiko Ariga , Yuji Wada , Naoto Ban , Shuji Shibuya , Yasuhiro Motoyama , Kunio Matsumoto , Susumu Kasukabe , Terutaka Mori , Hidetaka Shigi , Takayoshi Watanabe
发明人： Ryuji Kohno , Tetsuo Kumazawa , Makoto Kitano , Akihiko Ariga , Yuji Wada , Naoto Ban , Shuji Shibuya , Yasuhiro Motoyama , Kunio Matsumoto , Susumu Kasukabe , Terutaka Mori , Hidetaka Shigi , Takayoshi Watanabe
IPC分类号： G01R31/26 , H01L21/66 , H01L21/00 , H01L21/48
CPC分类号： G01R3/00 , G01R1/0735
摘要： Dispersion of load may be kept within an allowance even when a plurality of probes in a large area are pressed in batch by pressing the probes provided in a membrane to a wafer by applying a pressure load to a plurality of places of a plane of pressure members on the side opposite from the wafer in a probe test step/burn-in test step which is one of semiconductor device manufacturing steps. It is then possible to provide semiconductor devices and a manufacturing method thereof which enhance the reliability and productivity of the semiconductor devices by probing a large number of integrated circuits or a large size integrated circuit in the same time.
摘要翻译：即使当大量区域中的多个探针通过将设置在膜中的探针压迫到晶片而将压力负载施加到压力构件的平面的多个位置时，负载的分散也可以保持在容许范围内在作为半导体器件制造步骤之一的探针测试步骤/老化测试步骤中与晶片相对的一侧。因此，可以提供通过同时探测大量集成电路或大尺寸集成电路来提高半导体器件的可靠性和生产率的半导体器件及其制造方法。

12. 发明授权

US06759258B2 Connection device and test system 失效
标题翻译：连接设备和测试系统
公开(公告)号：US06759258B2
公开(公告)日：2004-07-06
申请号：US09971606
申请日：2001-10-09
申请人： Susumu Kasukabe , Terutaka Mori , Akihiko Ariga , Hidetaka Shigi , Takayoshi Watanabe , Ryuji Kono
发明人： Susumu Kasukabe , Terutaka Mori , Akihiko Ariga , Hidetaka Shigi , Takayoshi Watanabe , Ryuji Kono
IPC分类号： G01R3126
CPC分类号： G01R31/2889 , G01R1/06744 , G01R1/06772 , G01R1/0735 , G01R3/00 , G01R31/2863
摘要： To achieve high speed exchange of electrical signals between a connection device and a tester, a support member is provided for supporting the connection device, a plurality of pointed contact terminals are arrayed in an area on the probing side, a multiplayer film is provided having a plurality of lead out wires electrically connected to the contact terminals and a ground layer enclosing an insulation layer, and a frame is clamped on the rear side of the multiplayer film. A clamping member is provided on the frame to make the multiplayer film project out to eliminate slack in the multiplayer film. A contact pressure means is provided for making the tips of the contact terminals contact each of the electrodes with predetermined contact pressure from the support member to the clamping member. A compliance mechanism is provided so that the contact terminal group of the tip surface is arrayed in parallel with the electrode group terminal surface, so that the tips of the contact terminals contact the surface of the electrodes with an equal pressure.
摘要翻译：为了在连接装置和测试器之间实现电信号的高速交换，提供了一种用于支撑连接装置的支撑构件，多个尖端接触端子被排列在探测侧的区域中，提供了一种多层膜，其具有电连接到接触端子的多个引出线和包围绝缘层的接地层，并且框架被夹持在多人膜的后侧。夹持构件设置在框架上以使多人影片投射出来以消除多人影片中的松弛。提供接触压力装置，用于使接触端子的尖端以预定的从支撑构件到夹紧构件的接触压力接触每个电极。提供了一种符合机构，使得尖端表面的接触端子组与电极组端子表面平行地排列，使得接触端子的尖端以相等的压力接触电极的表面。

13. 发明授权

US06566150B2 Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step 失效
公开(公告)号：US06566150B2
公开(公告)日：2003-05-20
申请号：US10171695
申请日：2002-06-17
申请人： Ryuji Kohno , Tetsuo Kumazawa , Makoto Kitano , Akihiko Ariga , Yuji Wada , Naoto Ban , Shuji Shibuya , Yasuhiro Motoyama , Kunio Matsumoto , Susumu Kasukabe , Terutaka Mori , Hidetaka Shigi , Takayoshi Watanabe
发明人： Ryuji Kohno , Tetsuo Kumazawa , Makoto Kitano , Akihiko Ariga , Yuji Wada , Naoto Ban , Shuji Shibuya , Yasuhiro Motoyama , Kunio Matsumoto , Susumu Kasukabe , Terutaka Mori , Hidetaka Shigi , Takayoshi Watanabe
IPC分类号： G01R3126
CPC分类号： G01R3/00 , G01R1/0735
摘要： Dispersion of load may be kept within an allowance even when a plurality of probes in a large area are pressed in batch by pressing the probes provided in a membrane to a wafer by applying a pressure load to a plurality of places of a plane of pressure members on the side opposite from the wafer in a probe test step/burn-in test step which is one of semiconductor device manufacturing steps. It is then possible to provide semiconductor devices and a manufacturing method thereof which enhance the reliability and productivity of the semiconductor devices by probing a large number of integrated circuits or a large size integrated circuit in the same time.

14. 发明授权

US5929133A Anti-bacterial film suitable for food packaging 失效
标题翻译：抗菌膜适合食品包装
公开(公告)号：US5929133A
公开(公告)日：1999-07-27
申请号：US875118
申请日：1997-07-21
申请人： Takayoshi Watanabe , Satoru Aoki , Shinichi Ohta , Katsuhiro Shirono , Atsushi Tanaka
发明人： Takayoshi Watanabe , Satoru Aoki , Shinichi Ohta , Katsuhiro Shirono , Atsushi Tanaka
IPC分类号： C08J5/18 , C08K3/26 , C08K5/00 , C08K5/103 , C08K5/15 , C08K5/09 , C08K5/36 , C08K5/51
CPC分类号： C08J5/18 , C08K3/26 , C08K5/0008 , C08K5/0058 , C08K5/103 , C08J2327/06
摘要： Anti-bacterial film according to the present invention is suitable for use as food packaging wrap, and is given with the properties required for such film, such as a clinging property, transparency, and an anti-fogging property, as well as a high anti-bacterial property. The anti-bacterial film according to the present invention comprises, for 100 weight parts of PVC resin, 5 to 50 weight parts of a plasticizer, 0.3 to 3.0 weight parts of a stabilizer, 0.02 to 1.0 weight parts of hydrotalcite, 0.5 to 5.0 weight parts of an anti-fogging agent, and 0.02 to 2.0 weight parts of an anti-bacterial compound. The anti-bacterial compound may consist of a compound obtained by ion exchanging metallic ions of inorganic oxo-acid salt in the form of irregular particles having a particle diameter no more than 0.5 .mu.m with metallic ions having an anti-bacterial property, or a compound obtained by physically or chemically attaching metallic components having an anti-bacterial property to colloidal particles of inorganic oxides such as SiO.sub.2, TiO.sub.2, SiO.sub.2.Al.sub.2 O.sub.3 and SiO.sub.2.B.sub.2 O.sub.3 having a particle diameter no more than 500 nm and forming a colloidal solution.
摘要翻译： PCT No.PCT / JP96 / 02023 Sec。 371日期1997年7月21日 102（e）日期1997年7月21日PCT 1996年1月19日PCT PCT。公开号WO97 / 30115 PCT 日本1997年8月21日根据本发明的抗菌膜适合用作食品包装包装，并具有这种膜所需的性质，例如粘附性，透明性和防雾性，如以及高抗菌性。根据本发明的抗菌膜，对于100重量份的PVC树脂，包含5〜50重量份的增塑剂，0.3〜3.0重量份的稳定剂，0.02〜1.0重量份的水滑石，0.5〜5.0重量份防雾剂的一部分，以及0.02〜2.0重量份的抗菌化合物。抗细菌化合物可以由通过离子交换无机含氧酸盐的金属离子而获得的化合物，其为具有不超过0.5μm的粒径的不规则颗粒形式，具有抗菌性的金属离子，或将具有抗细菌性的金属成分物理或化学附着于粒径不大于500nm的SiO 2，TiO 2，SiO 2，Al 2 O 3，SiO 2，B 2 O 3等无机氧化物的胶体粒子，形成胶体溶液。

15. 发明授权

US07285430B2 Connection device and test system 失效
标题翻译：连接设备和测试系统
公开(公告)号：US07285430B2
公开(公告)日：2007-10-23
申请号：US10873168
申请日：2004-06-23
申请人： Susumu Kasukabe , Terutaka Mori , Akihiko Ariga , Hidetaka Shigi , Takayoshi Watanabe , Ryuji Kono
发明人： Susumu Kasukabe , Terutaka Mori , Akihiko Ariga , Hidetaka Shigi , Takayoshi Watanabe , Ryuji Kono
IPC分类号： G01R31/26
CPC分类号： G01R31/2889 , G01R1/06744 , G01R1/06772 , G01R1/0735 , G01R3/00 , G01R31/2863
摘要： To achieve high speed exchange of electrical signals between a connection device and a tester, a support member is provided for supporting the connection device, a plurality of pointed contact terminals are arrayed in an area on the probing side, a multiplayer film is provided having a plurality of lead out wires electrically connected to the contact terminals and a ground layer enclosing an insulation layer, and a frame is clamped on the rear side of the multiplayer film. A clamping member is provided on the frame to make the multiplayer film project out to eliminate slack in the multiplayer film. A contact pressure means is provided for making the tips of the contact terminals contact each of the electrodes with predetermined contact pressure from the support member to the clamping member. A compliance mechanism is provided so that the contact terminal group of the tip surface is arrayed in parallel with the electrode group terminal surface, so that the tips of the contact terminals contact the surface of the electrodes with an equal pressure.
摘要翻译：为了在连接装置和测试器之间实现电信号的高速交换，提供了一种用于支撑连接装置的支撑构件，多个尖端接触端子被排列在探测侧的区域中，提供了一种多层膜，其具有电连接到接触端子的多个引出线和包围绝缘层的接地层，并且框架被夹持在多人膜的后侧。夹持构件设置在框架上以使多人影片投射出来以消除多人影片中的松弛。提供接触压力装置，用于使接触端子的尖端以预定的从支撑构件到夹紧构件的接触压力接触每个电极。提供了一种符合机构，使得尖端表面的接触端子组与电极组端子表面平行地排列，使得接触端子的尖端以相等的压力接触电极的表面。

16. 发明授权

US06197603B1 Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step 失效
标题翻译：半导体器件及其制造方法，包括探针测试步骤和老化测试步骤
公开(公告)号：US06197603B1
公开(公告)日：2001-03-06
申请号：US09157153
申请日：1998-09-18
申请人： Ryuji Kohno , Tetsuo Kumazawa , Makoto Kitano , Akihiko Ariga , Yuji Wada , Naoto Ban , Shuji Shibuya , Yasuhiro Motoyama , Kunio Matsumoto , Susumu Kasukabe , Terutaka Mori , Hidetaka Shigi , Takayoshi Watanabe
发明人： Ryuji Kohno , Tetsuo Kumazawa , Makoto Kitano , Akihiko Ariga , Yuji Wada , Naoto Ban , Shuji Shibuya , Yasuhiro Motoyama , Kunio Matsumoto , Susumu Kasukabe , Terutaka Mori , Hidetaka Shigi , Takayoshi Watanabe
IPC分类号： G01R3126
CPC分类号： G01R3/00 , G01R1/0735
摘要： Dispersion of a load may be kept within a predetermined allowance even when a plurality of probes in a large area are pressed in batch by pressing the probes provided in a membrane against a wafer by applying a pressure load to a plurality of places on a plane of the pressure members on the side opposite the wafer in a probe test step, burn-in test step which represent typical semiconductor device manufacturing steps. It is then possible to provide semiconductor devices and a manufacturing method thereof which enhance the reliability and productivity of the semiconductor devices by probing a large number of integrated circuits or a large size integrated circuit at the same time.
摘要翻译：即使当大量区域中的多个探针通过将设置在膜中的探针压在晶片上时，通过将压力负载施加到多个位置的平面上的多个位置，负载的分散也可以保持在预定容限内在探针测试步骤中与晶片相对的一侧的压力构件，代表典型的半导体器件制造步骤的老化测试步骤。因此，可以提供通过同时探测大量集成电路或大尺寸集成电路来提高半导体器件的可靠性和生产率的半导体器件及其制造方法。

17. 发明授权

US5379765A Monitoring apparatus for use in obtaining bronchial electrocardiogram 失效
标题翻译：用于获得支气管心电图的监测装置
公开(公告)号：US5379765A
公开(公告)日：1995-01-10
申请号：US986039
申请日：1992-12-04
申请人： Nagao Kajiwara , Takayoshi Watanabe
发明人： Nagao Kajiwara , Takayoshi Watanabe
IPC分类号： A61B5/042 , A61F2/958 , A61B5/0402
CPC分类号： A61B5/6853 , A61B5/0421 , A61M25/10
摘要： An intrabronchial catheter has an inflatable balloon on which the bronchial ECG lead electrodes are mounted. Upon inserting the intrabronchial catheter into the trachea or bronchus of a human body, air is supplied to the balloon so that the balloon is stably retained in the trachea or bronchus, thereby bringing the bronchial ECG lead electrodes in close contact with the internal wall surface of the trachea or bronchus so as to effectively obtain a bronchial electrocardiogram or effect cardiac pacing.
摘要翻译：支气管内导管具有可充气气囊，支气管ECG引导电极安装在该气囊上。将支气管内导管插入人体的气管或支气管内时，将空气供给气囊，使气球稳定地保持在气管或支气管内，从而使支气管ECG引导电极与内壁面气管或支气管，以有效获得支气管心电图或心脏起搏效果。

18. 发明授权

US4713494A Multilayer ceramic circuit board 失效
标题翻译：多层陶瓷电路板
公开(公告)号：US4713494A
公开(公告)日：1987-12-15
申请号：US851729
申请日：1986-04-14
申请人： Shoji Oikawa , Hiroshi Yamagishi , Shigeru Saito , Tsuyoshi Fujita , Takayoshi Watanabe
发明人： Shoji Oikawa , Hiroshi Yamagishi , Shigeru Saito , Tsuyoshi Fujita , Takayoshi Watanabe
IPC分类号： H05K3/12 , H05K1/03 , H05K1/09 , H05K3/18 , H05K3/24 , H05K3/40 , H05K3/46 , H05K1/00
CPC分类号： H05K3/4061 , H05K1/0306 , H05K1/092 , H05K2201/0347 , H05K2201/035 , H05K2201/0769 , H05K2201/09563 , H05K3/246 , H05K3/248 , H05K3/4667
摘要： A multilayer ceramic circuit board and method of forming such circuit board are disclosed. The wiring pattern for the multilayer ceramic circuit board includes multiple-layer portions, the multiple-layer portions including first and second electrically conductive layers, respectively a tungsten layer and a copper thick film, for example, with a diffusion layer therebetween for improving adhesivity of the first and second electrically conductive layers to each other. Such multiple-layer portions are provided by providing first and second electrically conductive layers, and an intermediate layer between the first and second electrically conductive layers, and diffusing at least one component from the intermediate layer into both the first and second electrically conductive layers. Thus, a multilayer ceramic circuit board with, e.g., a firmly coupled tungsten layer and copper thick film can be provided.
摘要翻译：公开了一种多层陶瓷电路板及其形成方法。多层陶瓷电路板的布线图案包括多层部分，多层部分包括第一和第二导电层，分别为钨层和铜厚膜，例如其间具有用于提高粘合性的粘合性的扩散层第一和第二导电层彼此。通过提供第一和第二导电层以及在第一和第二导电层之间的中间层，并且将至少一个组分从中间层扩散到第一和第二导电层中来提供这样的多层部分。因此，可以提供具有例如牢固结合的钨层和铜厚膜的多层陶瓷电路板。

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