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    • 14. 发明申请
    • Apparatus and method of predicting performance of semiconductor manufacturing process and semiconductor device, and manufacturing method of semiconductor device
    • 半导体制造工艺和半导体器件的性能预测装置及方法以及半导体器件的制造方法
    • US20070042512A1
    • 2007-02-22
    • US11504048
    • 2006-08-15
    • Kenji Kawabata
    • Kenji Kawabata
    • H01L21/66
    • G05B17/02
    • Apparatus and method of predicting performance of a semiconductor manufacturing process and device, which reduces simulation resources to predict the performance distribution in the wafer and manufacturing method of a semiconductor device are disclosed. According to one aspect, it is provided a performance prediction apparatus comprising a uniform mesh data generator generating uniform mesh data by dividing a wafer using a uniform mesh to predict an in-plane characteristics distribution of performance in a series of process steps, a non-uniform mesh generator generating a non-uniform mesh by combining element meshes based on the uniform mesh data and predetermined threshold, a common mesh generator generating a common mesh by superimposing the non-uniform meshes and selecting a minimum mesh by region, a common mesh data generator generating common mesh data by representing the performance using the common mesh, and a predicting section predicting a comprehensive performance after processing the series of processes.
    • 公开了一种预测半导体制造工艺和器件的性能的装置和方法,其减少了模拟资源以预测晶片的性能分布以及半导体器件的制造方法。 根据一个方面,提供了一种性能预测装置,其包括均匀网格数据生成器,其通过使用均匀网格划分晶片来生成均匀网格数据,以预测一系列处理步骤中的平面性能分布特性, 均匀网格生成器通过基于均匀网格数据和预定阈值组合元素网格来生成不均匀网格;公共网格生成器,通过叠加非均匀网格并且逐区选择最小网格来生成公共网格,公共网格数据 发生器通过使用公共网格表示性能来生成公共网格数据,以及预测部分,其在处理一系列处理之后预测综合性能。