专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07405088B2 Method for analyzing fail bit maps of waters and apparatus therefor 失效
标题翻译：分析水域及其设备失效位图的方法
公开(公告)号：US07405088B2
公开(公告)日：2008-07-29
申请号：US10801992
申请日：2004-03-17
申请人： Hiroshi Matsushita , Kenichi Kadota , Kenji Kawabata , Yoshiyuki Shioyama
发明人： Hiroshi Matsushita , Kenichi Kadota , Kenji Kawabata , Yoshiyuki Shioyama
IPC分类号： H01L21/00
CPC分类号： H01L22/20
摘要： A failure analysis method according to the invention includes inputting the positions of failures in multiple wafers of an input device; preparing multiple sections in the multiple wafers; calculating feature amounts, which are represented by at least one numerical value representing a distribution of the failures in the multiple wafers, for each of the multiple sections; and representing by a first numerical value, the degree of similarity between the multiple wafers in terms of the feature amounts. Subsequently, the method includes detecting another wafer, which has the first numerical value greater than a predetermined first threshold, for each of the multiple wafers and forming a similar wafer group of multiple wafers with similar distributions of the failures.
摘要翻译：根据本发明的故障分析方法包括在输入设备的多个晶片中输入故障的位置; 准备多个晶片的多个部分; 计算特征量，其由表示多个晶片中的故障的分布的至少一个数值表示，用于多个部分中的每一个; 并且通过第一数值表示在特征量方面的多个晶片之间的相似度。随后，该方法包括对于每个多个晶片检测具有大于预定第一阈值的第一数值的另一个晶片，并且形成具有类似故障分布的多个晶片的相似晶片组。

2. 发明授权

US07043384B2 Failure detection system, failure detection method, and computer program product 失效
标题翻译：故障检测系统，故障检测方法和计算机程序产品
公开(公告)号：US07043384B2
公开(公告)日：2006-05-09
申请号：US10784819
申请日：2004-02-24
申请人： Hiroshi Matsushita , Kenichi Kadota , Yoshiyuki Shioyama
发明人： Hiroshi Matsushita , Kenichi Kadota , Yoshiyuki Shioyama
IPC分类号： G01R31/28 , G01R31/00
CPC分类号： G11C29/006 , G01R31/01 , G11C29/56 , G11C2029/0403 , G11C2029/5604
摘要： A failure detection system includes a wafer test information input unit which acquires pass/fail maps for wafers for a plurality of types of semiconductor devices, displaying failure chip areas based on results of electrical tests performed on chips; an analogous test information input unit which classifies the electrical tests into analogous electrical tests with regard to analogous failures among the semiconductor devices; a subarea setting unit which assigns subareas common to the types of semiconductor devices on a wafer surface; a characteristic quantity calculation unit which statistically calculates characteristic quantities based on a number of the failure chip areas included in the subareas for each analogous electrical test; and a categorization unit which obtains correlation coefficients between the characteristic quantities corresponding to the subareas, and classifies clustering failure patterns of the failure chip areas into categories by comparing the correlation coefficients with a threshold.
摘要翻译：故障检测系统包括晶片测试信息输入单元，其获取多种类型的半导体器件的晶片的通过/失败映射，基于对芯片执行的电测试的结果显示故障芯片区域; 类似的测试信息输入单元，其将电测试分类为关于半导体器件中的类似故障的类似电测试; 子区域设定单元，其在晶片表面上分配与所述半导体器件的类型相同的子区域; 特征量计算单元，其基于每个类似电测试在所述子区域中包括的故障码片区域的数量来统计计算特征量; 以及分类单元，其获得与所述子区域相对应的特征量之间的相关系数，并且通过将所述相关系数与阈值进行比较来将所述故障码片区域的聚类故障模式分类。

3. 发明申请

US20050102591A1 Failure detection system, failure detection method, and computer program product 失效
标题翻译：故障检测系统，故障检测方法和计算机程序产品
公开(公告)号：US20050102591A1
公开(公告)日：2005-05-12
申请号：US10784819
申请日：2004-02-24
申请人： Hiroshi Matsushita , Kenichi Kadota , Yoshiyuki Shioyama
发明人： Hiroshi Matsushita , Kenichi Kadota , Yoshiyuki Shioyama
IPC分类号： G01R31/26 , G01R31/01 , G11C29/00 , G11C29/56 , H01L21/66 , G01R31/28
CPC分类号： G11C29/006 , G01R31/01 , G11C29/56 , G11C2029/0403 , G11C2029/5604
摘要： A failure detection system includes a wafer test information input unit which acquires pass/fail maps for wafers for a plurality of types of semiconductor devices, displaying failure chip areas based on results of electrical tests performed on chips; an analogous test information input unit which classifies the electrical tests into analogous electrical tests with regard to analogous failures among the semiconductor devices; a subarea setting unit which assigns subareas common to the types of semiconductor devices on a wafer surface; a characteristic quantity calculation unit which statistically calculates characteristic quantities based on a number of the failure chip areas included in the subareas for each analogous electrical test; and a categorization unit which obtains correlation coefficients between the characteristic quantities corresponding to the subareas, and classifies clustering failure patterns of the failure chip areas into categories by comparing the correlation coefficients with a threshold.
摘要翻译：故障检测系统包括晶片测试信息输入单元，其获取多种类型的半导体器件的晶片的通过/失败映射，基于对芯片执行的电测试的结果显示故障芯片区域; 类似的测试信息输入单元，其将电测试分类为关于半导体器件中的类似故障的类似电测试; 子区域设定单元，其在晶片表面上分配与所述半导体器件的类型相同的子区域; 特征量计算单元，其基于每个类似电测试在所述子区域中包括的故障码片区域的数量来统计计算特征量; 以及分类单元，其获得与所述子区域相对应的特征量之间的相关系数，并且通过将所述相关系数与阈值进行比较来将所述故障码片区域的聚类故障模式分类。

4. 发明授权

US08081814B2 Linear pattern detection method and apparatus 有权
标题翻译：线性图案检测方法和装置
公开(公告)号：US08081814B2
公开(公告)日：2011-12-20
申请号：US12393797
申请日：2009-02-26
申请人： Hiroshi Matsushita , Kenichi Kadota , Toshiyuki Aritake
发明人： Hiroshi Matsushita , Kenichi Kadota , Toshiyuki Aritake
IPC分类号： G06K9/00 , G01N21/00
CPC分类号： G06K9/4604 , G06T7/0004 , G06T2207/20021 , G06T2207/30148
摘要： The present invention provides a linear pattern detection method which can extract and detect linear patterns distinguished by a microscopic defect distribution profile even if skipped measurements are taken. The linear pattern detection method acquires a defect map created based on results of defect inspection of a wafer; divides the defect map into a plurality of first segments; calculates a correlation coefficient of a point sequence in each of the first segments, the point sequence corresponding to a defect group contained in the first segments; calculates a total number of those first segments in which the correlation coefficient is equal to or larger than a first threshold; and determines that the wafer contains a linear pattern if the total number is equal to or larger than a second threshold.
摘要翻译：本发明提供一种线性图案检测方法，其可以提取和检测由微观缺陷分布轮廓区分的线性图案，即使进行了跳过的测量。线性图案检测方法获取基于晶片的缺陷检查结果创建的缺陷图; 将缺陷图划分成多个第一段; 计算每个第一段中的点序列的相关系数，对应于包含在第一段中的缺陷组的点序列; 计算相关系数等于或大于第一阈值的那些第一段的总数; 并且如果总数等于或大于第二阈值，则确定晶片包含线性模式。

5. 发明授权

US08170707B2 Failure detecting method, failure detecting apparatus, and semiconductor device manufacturing method 有权
标题翻译：故障检测方法，故障检测装置和半导体器件制造方法
公开(公告)号：US08170707B2
公开(公告)日：2012-05-01
申请号：US12256265
申请日：2008-10-22
申请人： Hiroshi Matsushita , Kenichi Kadota , Toshiyuki Aritake
发明人： Hiroshi Matsushita , Kenichi Kadota , Toshiyuki Aritake
IPC分类号： G06F19/00
CPC分类号： G05B19/41875 , G05B23/0229 , G05B2219/1112 , G05B2219/32222 , G05B2219/45031 , G05B2223/02 , Y02P90/22
摘要： A method for inputting a foreign substance inspection map created by foreign substance inspection for a wafer surface after each processing process in a wafer processing process, inputting a die sort map created by a die sort test after the wafer processing process, setting region segments in the wafer, setting a region number for each segment, calculating foreign substance density of the region segments, based on the foreign substance inspection map, and plotting the foreign substance density, using the region numbers, to calculate a foreign substance inspection map waveform characteristic amount, calculating failure density in the region segments, based on the die sort map, and plotting the failure density, using the region numbers, to calculate a die sort map waveform characteristic amount, calculating similarity between the foreign substance inspection map waveform characteristic amount and the die sort map waveform characteristic amount, and identifying a processing process cause of failure occurrence.
摘要翻译：一种用于在晶片处理过程中的每个处理过程之后输入通过异物检查创建的异物检查图的方法，输入在晶片处理过程之后通过管芯分类测试创建的管芯分类图，在晶片，根据异物检查图来计算各段的区域编号，计算区域段的异物密度，并使用区域编号绘制异物密度，计算异物检查图波形特征量，计算区域段中的故障密度，并使用区域编号绘制故障密度，计算模具分类图波形特征量，计算异物检查图波形特征量与模具之间的相似度排序图波形特征量，并识别处理过程原因的失败发生。

6. 发明申请

US20090117673A1 FAILURE DETECTING METHOD, FAILURE DETECTING APPARATUS, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD 有权
标题翻译：故障检测方法，故障检测装置和半导体器件制造方法
公开(公告)号：US20090117673A1
公开(公告)日：2009-05-07
申请号：US12256265
申请日：2008-10-22
申请人： Hiroshi MATSUSHITA , Kenichi Kadota , Toshiyuki Aritake
发明人： Hiroshi MATSUSHITA , Kenichi Kadota , Toshiyuki Aritake
IPC分类号： G01R31/26
CPC分类号： G05B19/41875 , G05B23/0229 , G05B2219/1112 , G05B2219/32222 , G05B2219/45031 , G05B2223/02 , Y02P90/22
摘要： A failure detecting method has inputting a foreign substance inspection map created by foreign substance inspection for a wafer surface after each processing process in a wafer processing process, inputting a die sort map created by a die sort test after the wafer processing process, setting a plurality of region segments in the wafer, setting a region number for each of the region segments, calculating foreign substance density in each of the region segments, based on the foreign substance inspection map, and plotting the foreign substance density, using the region numbers, to calculate a foreign substance inspection map waveform characteristic amount, calculating failure density in each of the region segments, based on the die sort map, and plotting the failure density, using the region numbers, to calculate a die sort map waveform characteristic amount, calculating similarity between the foreign substance inspection map waveform characteristic amount and the die sort map waveform characteristic amount, and identifying a processing process that is a cause of failure occurrence, based on the similarity.
摘要翻译：失败检测方法在晶片处理过程中，在每个处理过程之后输入通过异物检查产生的异物检查图，在晶片处理过程之后输入通过管芯分类测试创建的管芯分类图，设置多个的区域段，根据异物检查图，设定各区域段的区域编号，计算各区域段中的异物密度，使用区域编号绘制异物密度，计算异物检查图波形特征量，根据模具分类图计算每个区域段中的故障密度，并使用区域编号绘制故障密度，计算模具分类图波形特征量，计算相似度异物检查图波形特征量和管芯分类图波形ch之间基于相似性，确定作为故障发生的原因的处理过程。

7. 发明授权

US07221991B2 System and method for monitoring manufacturing apparatuses 失效
标题翻译：用于监控制造装置的系统和方法
公开(公告)号：US07221991B2
公开(公告)日：2007-05-22
申请号：US11068778
申请日：2005-03-02
申请人： Hiroshi Matsushita , Tomonobu Noda , Kenichi Kadota , Junji Sugamoto , Yukihiro Ushiku
发明人： Hiroshi Matsushita , Tomonobu Noda , Kenichi Kadota , Junji Sugamoto , Yukihiro Ushiku
IPC分类号： G06F19/00
CPC分类号： H01L22/20 , G01R31/2894 , G05B23/0248 , G05B2219/31357 , Y02P90/14
摘要： A control system for a manufacturing apparatus includes manufacturing information input unit acquiring time series data of apparatus parameters controlling manufacturing apparatuses; failure pattern classification module classifying in-plane distributions of failures of each of the wafers into failure patterns; an index calculation unit configured to statistically process the time series data by algorithms to calculate indices corresponding to the respective algorithms; an index analysis unit providing first and second frequency distributions of the indices categorized with and without the target failure pattern, to implement significance test between the first and second frequency distributions; and an abnormal parameter extraction unit extracting failure cause index of failure pattern by comparing value of the significance test with test reference value.
摘要翻译：一种制造装置的控制系统，包括制造信息输入单元，其获取控制制造装置的装置参数的时间序列数据; 故障模式分类模块将每个晶片的故障平面内分布分为故障模式; 索引计算单元，被配置为通过算法对所述时间序列数据进行统计处理，以计算与各个算法对应的索引; 索引分析单元，提供分类有和没有目标故障模式的索引的第一和第二频率分布，以实现第一和第二频率分布之间的显着性测试; 异常参数提取单元通过比较显着性检验值与检测参考值，提取失效原因指标的故障模式。

8. 发明授权

US07197414B2 System and method for identifying a manufacturing tool causing a fault 失效
标题翻译：用于识别造成故障的制造工具的系统和方法
公开(公告)号：US07197414B2
公开(公告)日：2007-03-27
申请号：US11090217
申请日：2005-03-28
申请人： Hiroshi Matsushita , Kenichi Kadota
发明人： Hiroshi Matsushita , Kenichi Kadota
IPC分类号： G06F19/00
CPC分类号： G05B19/4184 , G05B2219/31356 , G05B2219/32222 , Y02P90/10 , Y02P90/14 , Y02P90/22
摘要： A system for identifying a manufacturing tool causing a failure, includes a data generating module generating factorial effect data, based on information on a failure lot group by using an orthogonal array, a chart generating module generating a factorial effect chart based on the factorial effect data, a selection module selecting failure lots caused by the same reason for a failure from among the failure lot group, based on the factorial effect chart, and an identification module identifying a manufacturing tool used as a common tool for the selected plurality of failure lots, based on history information of the manufacturing tool group.
摘要翻译：一种用于识别导致故障的制造工具的系统包括：数据生成模块，基于通过使用正交阵列的故障批次组的信息来生成因子效果数据;图表生成模块，基于所述因子效应数据生成阶乘效果图选择模块，基于所述阶乘效应图，选择由所述失败批次群组中与故障相同原因造成的故障批次;以及识别模块，其识别用作所选择的多个故障批次的共同工具的制造工具，根据制造工具组的历史信息。

9. 发明申请

US20050194590A1 System and method for controlling manufacturing apparatuses 失效
标题翻译：用于控制制造装置的系统和方法
公开(公告)号：US20050194590A1
公开(公告)日：2005-09-08
申请号：US11068778
申请日：2005-03-02
申请人： Hiroshi Matsushita , Tomonobu Noda , Kenichi Kadota , Junji Sugamoto , Yukihiro Ushiku
发明人： Hiroshi Matsushita , Tomonobu Noda , Kenichi Kadota , Junji Sugamoto , Yukihiro Ushiku
IPC分类号： H01L21/66 , G01R31/26 , H01L21/02 , H01L23/58
CPC分类号： H01L22/20 , G01R31/2894 , G05B23/0248 , G05B2219/31357 , Y02P90/14
摘要： A control system for a manufacturing apparatus includes manufacturing information input unit acquiring time series data of apparatus parameters controlling manufacturing apparatuses; failure pattern classification module classifying in-plane distributions of failures of each of the wafers into failure patterns; an index calculation unit configured to statistically process the time series data by algorithms to calculate indices corresponding to the respective algorithms; an index analysis unit providing first and second frequency distributions of the indices categorized with and without the target failure pattern, to implement significance test between the first and second frequency distributions; and an abnormal parameter extraction unit extracting failure cause index of failure pattern by comparing value of the significance test with test reference value.
摘要翻译：一种制造装置的控制系统，包括制造信息输入单元，其获取控制制造装置的装置参数的时间序列数据; 故障模式分类模块将每个晶片的故障平面内分布分为故障模式; 索引计算单元，被配置为通过算法对所述时间序列数据进行统计处理，以计算与各个算法对应的索引; 索引分析单元，提供分类有和没有目标故障模式的索引的第一和第二频率分布，以实现第一和第二频率分布之间的显着性测试; 异常参数提取单元通过比较显着性检验值与检测参考值，提取失效原因指标的故障模式。

10. 发明申请

US20090220142A1 LINEAR PATTERN DETECTION METHOD AND APPARATUS 有权
标题翻译：线性图案检测方法和装置
公开(公告)号：US20090220142A1
公开(公告)日：2009-09-03
申请号：US12393797
申请日：2009-02-26
申请人： Hiroshi MATSUSHITA , Kenichi Kadota , Toshiyuki Aritake
发明人： Hiroshi MATSUSHITA , Kenichi Kadota , Toshiyuki Aritake
IPC分类号： G06K9/00
CPC分类号： G06K9/4604 , G06T7/0004 , G06T2207/20021 , G06T2207/30148
摘要： The present invention provides a linear pattern detection method which can extract and detect linear patterns distinguished by a microscopic defect distribution profile even if skipped measurements are taken. The linear pattern detection method acquires a defect map created based on results of defect inspection of a wafer; divides the defect map into a plurality of first segments; calculates a correlation coefficient of a point sequence in each of the first segments, the point sequence corresponding to a defect group contained in the first segments; calculates a total number of those first segments in which the correlation coefficient is equal to or larger than a first threshold; and determines that the wafer contains a linear pattern if the total number is equal to or larger than a second threshold.
摘要翻译：本发明提供一种线性图案检测方法，其可以提取和检测由微观缺陷分布轮廓区分的线性图案，即使进行了跳过的测量。线性图案检测方法获取基于晶片的缺陷检查结果创建的缺陷图; 将缺陷图划分成多个第一段; 计算每个第一段中的点序列的相关系数，对应于包含在第一段中的缺陷组的点序列; 计算相关系数等于或大于第一阈值的那些第一段的总数; 并且如果总数等于或大于第二阈值，则确定晶片包含线性模式。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式