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    • 12. 发明授权
    • Method for manufacturing a gallium nitride group compound semiconductor
    • 氮化镓基化合物半导体的制造方法
    • US06984536B2
    • 2006-01-10
    • US10052347
    • 2002-01-23
    • Katsuhide ManabeAkira MabuchiHisaki KatoMichinari SassaNorikatsu KoideShiro YamazakiMasafumi HashimotoIsamu Akasaki
    • Katsuhide ManabeAkira MabuchiHisaki KatoMichinari SassaNorikatsu KoideShiro YamazakiMasafumi HashimotoIsamu Akasaki
    • H01L21/20
    • H01L33/32H01L33/007H01L33/025
    • Disclosed herein are (1) a light-emitting semiconductor device that uses a gallium nitride compound semiconductor (AlxGa1−xN) in which the n-layer of n-type gallium nitride compound semiconductor (AlxGa1−xN) is of double-layer structure including an n-layer of low carrier concentration and an n+-layer of high carrier concentration, the former being adjacent to the i-layer of insulating gallium nitride compound semiconductor (AlxGa1−xN); (2) a light-emitting semiconductor device of similar structure as above in which the i-layer is of double-layer structure including an iL-layer of low impurity concentration containing p-type impurities in comparatively low concentration and an iH-layer of high impurity concentration containing p-type impurities in comparatively high concentration, the former being adjacent to the n-layer; (3) a light-emitting semiconductor device having both of the above-mentioned features and (4) a method of producing a layer of an n-type gallium nitride compound semiconductor (AlxGa1−xN) having a controlled conductivity from an organometallic compound by vapor phase epitaxy, by feeding a silicon-containing gas and other raw material gases together at a controlled mixing ratio.
    • 本文公开了(1)使用氮化镓化合物半导体(Al x Ga 1-x N)的发光半导体器件,其中n层n 型氮化镓化合物半导体(Al x Ga 1-x N)是包括低载流子浓度的n层和n < 高载流子浓度的+层,前者与绝缘氮化镓化合物半导体(Al x Ga 1-x N)的i层相邻, ; (2)具有上述类似结构的发光半导体器件,其中i层是双层结构,包括相对较低的含有p型杂质的低杂质浓度的i L层 低浓度和高浓度的含有p型杂质的高杂质浓度的i H +层,前者与n层相邻; (3)具有上述两个特征的发光半导体器件和(4)制造n型氮化镓系化合物半导体层的方法(Al x Ga Ga 1-x N),通过气相外延从有机金属化合物具有受控的导电性,通过以可控混合比将含硅气体和其它原料气体一起供给到一起。
    • 18. 发明授权
    • Method for producing group III nitride semiconductor
    • III族氮化物半导体的制造方法
    • US09028611B2
    • 2015-05-12
    • US12926995
    • 2010-12-22
    • Shiro Yamazaki
    • Shiro Yamazaki
    • C30B19/10C30B19/04C30B29/40C30B9/10C30B19/02C30B9/06
    • C30B29/403C30B9/06C30B9/10C30B19/02C30B19/04C30B29/406
    • A method for producing a Group III nitride semiconductor includes reacting a molten mixture containing at least a Group III element and an alkali metal with a gas containing at least nitrogen, to thereby grow a Group III nitride semiconductor crystal on the seed crystal. The method includes forming a template substrate including a sapphire substrate and a first Group III nitride semiconductor layer as the seed crystal which is formed by vapor phase growth and which includes a c-plane as a main plane is employed, and the template substrate is placed and maintained in the molten mixture under conditions where crystal growth of the Group III nitride semiconductor is inhibited, to thereby partially melt back a plurality of separated parts of the first Group III nitride semiconductor layer to such a depth that the sapphire substrate is partially exposed.
    • 制备III族氮化物半导体的方法包括使至少含有III族元素和碱金属的熔融混合物与至少含有氮的气体反应,从而在晶种上生长III族氮化物半导体晶体。 该方法包括形成包含蓝宝石衬底和第一III族氮化物半导体层的模板衬底,作为通过气相生长形成并且包括c面作为主平面的晶种,并且将模板衬底放置 并且在III族氮化物半导体的晶体生长被抑制的条件下保持在熔融混合物中,从而部分地将第一III族氮化物半导体层的多个分离部分熔融回到蓝宝石衬底部分暴露的深度。