专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

11. 发明授权

US06355878B1 Clip type conductive gasket 失效
标题翻译：夹式导电垫片
公开(公告)号：US06355878B1
公开(公告)日：2002-03-12
申请号：US09586808
申请日：2000-06-05
申请人： Sun-Ki Kim
发明人： Sun-Ki Kim
IPC分类号： H05K900
CPC分类号： H05K9/0016 , H05K9/0015 , Y10S277/92
摘要： A clip type conductive gasket having a conductive metal finger strip that is fitted to a part of an electric or electronic apparatus to be electrically connected or electrically block electromagnetic interference (EMI) and particularly radio frequency interference (RFI). A conductive elastic body is dispensed on an upper portion of the conductive metal finger strip. According to the clip type conductive gasket, a physical binding force is increased, the electrical conductivity and the contact area is increased so that the contact resistance is lowered. Therefore, the manufacturing cost is lowered.
摘要翻译：一种夹式导电垫片，其具有导电金属指条，其装配到电气或电子设备的一部分以电连接或电阻塞电磁干扰（EMI），特别是射频干扰（RFI）。导电弹性体分配在导电金属指条的上部。根据夹式导电垫片，物理结合力增加，导电性和接触面积增加，使得接触电阻降低。因此，制造成本降低。

12. 发明申请

US20170229795A1 ELASTIC ELECTRIC CONTACT TERMINAL WITH IMPROVED ENVIRONMENTAL RESISTANCE AND FABRICARION METHOD THEREFOR 审中-公开
公开(公告)号：US20170229795A1
公开(公告)日：2017-08-10
申请号：US15463509
申请日：2017-03-20
申请人： Sun-Ki Kim , JOINSET CO., LTD.
发明人： Sun-Ki Kim
IPC分类号： H01R4/62 , H05K3/34 , H05K1/11 , H01R43/00 , H01R12/57
CPC分类号： H01R4/625 , H01R4/58 , H01R11/01 , H01R12/57 , H01R13/24 , H01R13/2414 , H01R13/6584 , H01R43/007 , H05K1/11 , H05K3/34 , H05K3/3431 , H05K2201/1031 , Y02P70/611
摘要： Disclosed is an elastic electric contact terminal comprising: an elastic core; a polymer film which is bonded while covering the core, with an adhesive layer being interposed therebetween; and a copper foil capable of being soldered, which is bonded while covering the polymer film. A metal plating layer is formed on every surface exposed outwardly from the copper foil.

13. 发明申请

US20160240918A1 ANTENNA BANDWIDTH EXPANDER 有权
标题翻译：天线带宽扩展器
公开(公告)号：US20160240918A1
公开(公告)日：2016-08-18
申请号：US14987212
申请日：2016-01-04
申请人： Sun-Ki Kim , JOINSET CO., LTD.
发明人： Jong-Cheol Yoon , Sun-Ki Kim , In-Yeup Song
IPC分类号： H01Q1/50 , H04B1/40
CPC分类号： H01Q1/50 , H01Q1/24 , H01Q1/38 , H01Q5/314 , H04B1/0458 , H04B1/18 , H04B1/40
摘要： Disclosed is an antenna bandwidth expander capable of improving transmission/reception performance of a wireless communication device by expanding a bandwidth of an antenna in which broadband frequency characteristics including various communication bands are necessary like an LTE smartphone. The antenna bandwidth expander may improve the transmission and reception performance of a terminal by easily and conveniently expanding a bandwidth of an antenna in first and second resonant frequency bands.
摘要翻译：公开了一种天线带宽扩展器，其能够通过扩展其中需要包括各种通信频带的宽带频率特性的天线的带宽来改善无线通信设备的发送/接收性能，如LTE智能手机。天线带宽扩展器可以通过容易且方便地扩展第一和第二谐振频带中的天线的带宽来提高终端的发射和接收性能。

14. 发明授权

US09397419B2 Solderable electric connector 有权
标题翻译：可焊电连接器
公开(公告)号：US09397419B2
公开(公告)日：2016-07-19
申请号：US14284730
申请日：2014-05-22
申请人： JOINSET CO., LTD. , Sun-Ki Kim
发明人： Tae-Man Kang , Heung-Yong Shim , Sun-Ki Kim , Yun-Heui Han
IPC分类号： H01R12/00 , H05K1/00 , H01R12/53 , H01R4/48 , H01R13/115 , H01R13/627
CPC分类号： H01R12/53 , H01R4/4818 , H01R13/115 , H01R13/6278
摘要： A solderable electric connector formed of a metal sheet as a single body includes a flat bottom portion soldered to a conductive pattern of a printed circuit board (PCB), an elastic fastening portion bent and extended from one end of the bottom portion in a longitudinal direction thereof, and a housing vertically bent and extended from one end of the bottom portion in a width direction and surrounding the elastic fastening portion. Herein, a front end of the housing is vertically bent downwards and forms a supporting plate and a penetration hole is formed in a certain location on the supporting plate. Also, a pressurizing projection projects from a top surface of the elastic fastening portion and a metal core of a wire passing through the penetration hole is pressurized between the pressurizing projection and a bottom surface of the housing and coupled therewith.
摘要翻译：由作为单体的金属板形成的可焊接电连接器包括焊接到印刷电路板（PCB）的导电图案的平坦底部部分，弹性紧固部分从纵向方向的底部的一端弯曲并延伸以及在宽度方向上从底部的一端垂直弯曲并延伸并围绕弹性紧固部的壳体。这里，壳体的前端向下垂直弯曲并形成支撑板，并且在支撑板上的某个位置形成有贯通孔。此外，加压突起从弹性紧固部的顶面突出，并且通过贯通孔的线的金属芯在加压突起和壳体的底面之间被加压并与其连接。

15. 发明申请

US20150162122A1 SURFACE MOUNT DEVICE TYPE INDUCTOR AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：表面安装装置类型的电感器及其制造方法
公开(公告)号：US20150162122A1
公开(公告)日：2015-06-11
申请号：US14560047
申请日：2014-12-04
申请人： Sun-Ki Kim , JOINSET CO., LTD.
发明人： Kee-Han Park , Jae-Gil Choi , Sun-Ki Kim
IPC分类号： H01F27/22 , H01F41/02 , H01F27/24 , H01F27/29 , H01F27/28
CPC分类号： H01F27/292 , H01F17/04 , H01F2017/048 , Y10T29/49071
摘要： Provided is a surface-mount device (SMD) type inductor reducing electric contact resistance between external electrodes and a metal core of an insulating coil. The inductor includes a core formed of magnetic material, an insulating coil wound on an outer surface of the core, a mold body containing the core and the insulating coil to be embedded therein, ends of the insulating coil protruding respectively from both sides of the mold body, which are opposite to each other, the mold body formed of soft magnetic metal compact using soft magnetic metal powder, and external electrodes formed on the both sides of the mold body and electrically connected to a metal core of the protruding ends of the insulating coil. Herein, the protruding ends of the insulating coil are partially removed by physical force to expose the metal core and the external electrodes are electrically connected to the exposed metal core.
摘要翻译：提供了一种降低外部电极与绝缘线圈的金属芯之间的接触电阻的表面贴装器件（SMD）型电感器。电感器包括由磁性材料形成的芯，缠绕在芯的外表面上的绝缘线圈，包含芯的模体和要嵌入其中的绝缘线圈，绝缘线圈的端部分别从模具的两侧突出使用软磁性金属粉末的软磁性金属压块形成的模具体以及形成于模体两侧的外部电极，与绝缘体的突出端部的金属芯电连接，线圈这里，通过物理力部分去除绝缘线圈的突出端以露出金属芯，并且外部电极电连接到暴露的金属芯。

16. 发明授权

US08853536B2 Solderable elastic electric contact terminal 有权
标题翻译：可焊接弹性电接触端子
公开(公告)号：US08853536B2
公开(公告)日：2014-10-07
申请号：US13490519
申请日：2012-06-07
申请人： Sun-Ki Kim
发明人： Sun-Ki Kim
IPC分类号： H05K9/00
CPC分类号： H01R13/03 , H01R13/2414 , H01R13/6599
摘要： Provided is a solderable elastic electric contact terminal, which includes an elastic core having a height smaller than a width thereof, and including two or more through holes separately disposed therein and having a dumbbell shaped cross section, wherein the through holes extend along a longitudinal direction of the elastic core, an elastic rubber coating layer enveloping the elastic core to adhere thereto, and a heat-resistant polymer film having a surface adhered to the elastic rubber coating layer to envelop the elastic rubber coating layer, and another surface integrally formed with a metal layer. A top surface of the metal layer is horizontal for vacuum pickup.
摘要翻译：提供一种可焊接弹性电接触端子，其包括具有小于其宽度的高度的弹性芯，并且包括分开设置在其中并且具有哑铃形横截面的两个或更多个通孔，其中所述通孔沿着纵向方向延伸弹性芯的弹性橡胶涂层，包覆弹性芯的粘合剂的弹性橡胶涂层，以及具有粘合到弹性橡胶涂层上的表面以包覆弹性橡胶涂层的耐热性聚合物膜，以及与弹性芯一体形成的另一表面金属层。金属层的顶表面是水平的用于真空拾取。

17. 发明授权

US08026787B2 Ceramic component element and ceramic component and method for the same 有权
标题翻译：陶瓷元件和陶瓷元件及其制作方法
公开(公告)号：US08026787B2
公开(公告)日：2011-09-27
申请号：US12224976
申请日：2007-02-15
申请人： Kwang-Hwi Choi , Seong-Soo Jo , Sun-Ki Kim
发明人： Kwang-Hwi Choi , Seong-Soo Jo , Sun-Ki Kim
IPC分类号： H01C7/10
CPC分类号： H01C7/18 , C04B37/001 , C04B2235/96 , C04B2235/9669 , C04B2237/34 , C04B2237/343 , C04B2237/346 , C04B2237/366 , C04B2237/60 , C04B2237/704 , H01C7/003 , H01C7/008 , H01C17/065 , H01G2/14 , H01G4/12 , H01G4/224 , H01G4/30 , H01G4/33 , Y10T29/49085 , Y10T428/24926
摘要： A ceramic component element is provided. The ceramic component element includes: an insulating ceramic base with pores formed on its surface and previously fired; and a functional ceramic sheet bonded to the insulating ceramic base and having electrical characteristics. The functional ceramic sheet is physically bonded to the insulating ceramic base by forming pressing a green sheet for the functional ceramic sheet on the insulating ceramic base at constant temperature and pressure so that parts of the green sheet are forced to put into the pores and anchored, and the functional ceramic sheet is chemically bonded to the insulating ceramic base by firing the anchored green sheet in such a manner that functional oxides of the green sheet penetrate the insulating ceramic base by solid diffusion to form a diffusion bonding layer.
摘要翻译：提供陶瓷元件。陶瓷元件包括：绝缘陶瓷基体，其表面上形成有预先烧制的孔; 和与绝缘陶瓷基体结合并具有电特性的功能陶瓷片。功能性陶瓷片通过在绝缘陶瓷基体上在恒温恒压下形成压制功能性陶瓷片的生片而物理地结合到绝缘陶瓷基底上，使得生片的一部分被迫放入孔中并锚定，并且功能性陶瓷片通过以这样的方式烧结锚定的生片以化学方式结合到绝缘陶瓷基底，使得生坯的功能氧化物通过固体扩散渗透绝缘陶瓷基底以形成扩散粘合层。

18. 发明申请

US20090096569A1 Ceramic Component Element And Ceramic Component And Method For The Same 有权
标题翻译：陶瓷元件和陶瓷元件及其方法
公开(公告)号：US20090096569A1
公开(公告)日：2009-04-16
申请号：US12224976
申请日：2007-02-15
申请人： Kwang-Hwi Choi , Seong-Soo Jo , Sun-Ki Kim
发明人： Kwang-Hwi Choi , Seong-Soo Jo , Sun-Ki Kim
IPC分类号： H01C7/10 , B32B18/00 , C03B29/00
CPC分类号： H01C7/18 , C04B37/001 , C04B2235/96 , C04B2235/9669 , C04B2237/34 , C04B2237/343 , C04B2237/346 , C04B2237/366 , C04B2237/60 , C04B2237/704 , H01C7/003 , H01C7/008 , H01C17/065 , H01G2/14 , H01G4/12 , H01G4/224 , H01G4/30 , H01G4/33 , Y10T29/49085 , Y10T428/24926
摘要： A ceramic component element is provided. The ceramic component element includes: an insulating ceramic base with pores formed on its surface and previously fired; and a functional ceramic sheet bonded to the insulating ceramic base and having electrical characteristics. The functional ceramic sheet is physically bonded to the insulating ceramic base by forming pressing a green sheet for the functional ceramic sheet on the insulating ceramic base at constant temperature and pressure so that parts of the green sheet are forced to put into the pores and anchored, and the functional ceramic sheet is chemically bonded to the insulating ceramic base by firing the anchored green sheet in such a manner that functional oxides of the green sheet penetrate the insulating ceramic base by solid diffusion to form a diffusion bonding layer.
摘要翻译：提供陶瓷元件。陶瓷元件包括：绝缘陶瓷基体，其表面上形成有预先烧制的孔; 和与绝缘陶瓷基体结合并具有电特性的功能陶瓷片。功能性陶瓷片通过在绝缘陶瓷基体上在恒温恒压下形成压制功能性陶瓷片的生片而物理地结合到绝缘陶瓷基底上，使得生片的一部分被迫放入孔中并锚定，并且功能性陶瓷片通过以这样的方式烧结锚定的生片以化学方式结合到绝缘陶瓷基底，使得生坯的功能氧化物通过固体扩散渗透绝缘陶瓷基底以形成扩散粘合层。

19. 发明申请

US20060158205A1 Method for testing standby current of semiconductor package 失效
标题翻译：半导体封装待机电流测试方法
公开(公告)号：US20060158205A1
公开(公告)日：2006-07-20
申请号：US11335270
申请日：2006-01-18
申请人： Moon-Bo Sim , Joo-Seok Kwak , Seong-Su Kim , Yun-Bo Yang , Sun-Ki Kim
发明人： Moon-Bo Sim , Joo-Seok Kwak , Seong-Su Kim , Yun-Bo Yang , Sun-Ki Kim
IPC分类号： G01R31/02
CPC分类号： G01R31/3008
摘要： A system and method for testing standby current of a semiconductor package is provided. The method includes testing semiconductor chips formed on a wafer having a predetermined wafer run number, collecting measured values of standby current of the semiconductor chips, and storing the measured values of standby current in a database, by using a wafer tester; recognizing a wafer run number of each of semiconductor packages to be tested; downloading measured values of standby current of semiconductor chips corresponding to the recognized wafer run number from the database to a semiconductor package tester; extracting a boundary value defining predetermined upper values of the downloaded measured values of standby current, by using the semiconductor package tester; setting the boundary value as a standby current limit of a program for testing the semiconductor packages by use of the semiconductor package tester; and testing the semiconductor packages based on the standby current limit.
摘要翻译：提供一种用于测试半导体封装的待机电流的系统和方法。该方法包括测试形成在具有预定晶圆行程号的晶片上的半导体芯片，收集半导体芯片的待机电流的测量值，并通过使用晶片测试器将待机电流的测量值存储在数据库中; 识别要测试的每个半导体封装的晶片运行次数; 将与识别的晶片运行数相对应的半导体芯片的待机电流的测量值从数据库下载到半导体封装测试器; 通过使用半导体封装测试器提取定义下载的待机电流测量值的预定上限值的边界值; 将边界值设置为通过使用半导体封装测试器来测试半导体封装的程序的备用电流极限; 并根据待机电流限制测试半导体封装。

20. 发明申请

US20050093112A1 Semiconductor package capable of absorbing electromagnetic wave 审中-公开
标题翻译：能够吸收电磁波的半导体封装
公开(公告)号：US20050093112A1
公开(公告)日：2005-05-05
申请号：US10980216
申请日：2004-11-03
申请人： Sun-Ki Kim
发明人： Sun-Ki Kim
IPC分类号： H01L23/495 , H01L23/552
CPC分类号： H01L24/45 , H01L23/4952 , H01L23/49586 , H01L23/552 , H01L24/48 , H01L2224/4556 , H01L2224/45565 , H01L2224/45599 , H01L2224/4579 , H01L2224/45886 , H01L2224/45893 , H01L2224/48091 , H01L2224/48247 , H01L2224/484 , H01L2924/00014 , H01L2924/01006 , H01L2924/01012 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01056 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/15173 , H01L2924/19043 , H01L2924/3025 , H01L2924/01025 , H01L2224/45099 , H01L2224/43 , H01L2224/85399 , H01L2224/05599 , H01L2224/43848
摘要： A semiconductor package has a semiconductor chip electrically connected to a conductive lead of a lead frame through a bonding wire and it is encapsulated by an insulating molding body. In such a semiconductor package, an electromagnetic wave absorbing film is formed by coating an electromagnetic wave absorbent on predetermined portions or either of the bonding wire and the conductive lead to a predetermined constant thickness, and the electromagnetic wave absorbing film forms a closed loop. In this manner, the electromagnetic interference between the conductive lead and the bonding wire can be surely attenuated. The lead frame and the conductive lead can be shield from the electromagnetic wave applied from the outside of the semiconductor package. In addition, the spurious signal flowing through the conductive lead and the bonding wire can also be reduced.
摘要翻译：半导体封装具有通过接合线与引线框架的导电引线电连接的半导体芯片，并且由绝缘成型体封装。在这种半导体封装中，电磁波吸收膜是通过在预定部分或接合线和导电引线之一上涂覆电磁波吸收剂而形成预定的恒定厚度而形成的，并且电磁波吸收膜形成闭环。以这种方式，可以可靠地衰减导电引线和接合线之间的电磁干扰。引线框架和导电引线可以屏蔽从半导体封装的外部施加的电磁波。此外，还可以减少流过导电引线和接合线的杂散信号。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式