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11. 发明授权

US07208062B2 Method of producing multilayer printed wiring board 有权
标题翻译：多层印刷线路板的制造方法
公开(公告)号：US07208062B2
公开(公告)日：2007-04-24
申请号：US10849172
申请日：2004-05-20
申请人： Shigeo Nakamura , Tadahiko Yokota
发明人： Shigeo Nakamura , Tadahiko Yokota
IPC分类号： C09J163/00 , B32B37/14
CPC分类号： B32B7/12 , B32B15/02 , B32B27/08 , B32B27/20 , B32B27/26 , B32B27/38 , B32B2457/08 , H05K3/387 , H05K3/4661 , H05K3/4673 , H05K2201/0195 , H05K2201/0209 , H05K2203/066 , Y10S428/901 , Y10T29/49128 , Y10T29/49155 , Y10T428/287
摘要： Adhesive films which are useful for preparing laminated circuit boards may be produced by laminating a resin composition layer made of a layer A and layer B on a support base film, in which layer A is a layer of a thermosetting resin composition that has an inorganic filler content of from 0 to less than 40% by weight, has a cured surface which after roughening, allows forming a conductor layer by plating, and is solid at ambient temperature, layer B is a layer of a thermosetting resin composition that has an inorganic filler content of 40% by weight or more, and is solid at ambient temperature, layer A is laminated adjacent to the support base film, and layer B layer has a fluidity that allows the filling of a resin into a through hole and/or a via hole.
摘要翻译：可用于制备层压电路板的粘合膜可以通过将由A层和B层制成的树脂组合物层压在支撑基底膜上来制备，其中层A是具有无机填料的热固性树脂组合物层含量为0〜40重量％以下，具有经粗糙化后的固化表面，可以通过电镀形成导体层，在环境温度下为固体，B层为具有无机填料的热固性树脂组合物层含量为40重量％以上，并且在环境温度下为固体，层A邻近支撑基膜层压，并且层B层具有允许将树脂填充到通孔和/或通孔中的流动性孔。

12. 发明授权

US07037586B2 Film for circuit board 失效
标题翻译：电路板胶片
公开(公告)号：US07037586B2
公开(公告)日：2006-05-02
申请号：US10754618
申请日：2004-01-12
申请人： Tadahiko Yokota , Shigeo Nakamura
发明人： Tadahiko Yokota , Shigeo Nakamura
IPC分类号： B32B15/00 , B32B27/38 , C08L63/00
CPC分类号： H05K3/387 , B32B15/08 , B32B27/08 , H05K1/036 , H05K3/181 , H05K3/381 , H05K2201/0141 , H05K2201/0154 , H05K2201/0394 , H05K2203/0264 , Y10S428/901 , Y10T428/24917 , Y10T428/2495 , Y10T428/265 , Y10T428/2804 , Y10T428/2852 , Y10T428/31511 , Y10T428/31515 , Y10T428/31522 , Y10T428/31529
摘要： The present invention relates to a film for a circuit board characterized in that the following A layer is adjacent to the following B layer is disclosed in the present application. A circuit board excellent in adhesion strength of a conductor layer can easily be produced by using this film.A layer: a heat-resistant resin layer with a thickness of from 2 to 250 μm which layer is made of a heat-resistant resin having a glass transition point of 200° C. or more or a decomposition temperature of 300° C. or more, andB layer: a roughenable cured resin layer with a thickness of from 5 to 20 μm which layer is made of a cured product of a thermosetting resin composition containing at least component (a) of an epoxy resin having two or more epoxy groups in a molecule and component (b) of an epoxy curing agent, the cured product being capable of roughening with an oxidizing agent.
摘要翻译：本发明涉及一种用于电路板的薄膜，其特征在于在本申请中公开了以下A层与以下B层相邻。通过使用该膜，可以容易地制造出导体层的粘合强度优异的电路板。层：厚度为2〜250μm的耐热树脂层，该层由玻璃化转变点为200℃以上或分解温度为300℃的耐热性树脂构成，或更多和B层：厚度为5〜20μm的可粗化固化树脂层，该层由至少含有至少两种以上环氧基的环氧树脂组分（a）的热固性树脂组合物的固化产物形成，在环氧固化剂的分子和组分（b）中，固化产物能够用氧化剂粗化。

13. 发明申请

US20050005437A1 Adhesive film for use in multilayer printed wiring board and method of producing multilayer printed wiring board 有权
公开(公告)号：US20050005437A1
公开(公告)日：2005-01-13
申请号：US10849172
申请日：2004-05-20
申请人： Shigeo Nakamura , Tadahiko Yokota
发明人： Shigeo Nakamura , Tadahiko Yokota
IPC分类号： B32B7/12 , B32B15/02 , H05K3/38 , H05K3/46 , B44C1/00 , H05K3/02
CPC分类号： B32B7/12 , B32B15/02 , B32B27/08 , B32B27/20 , B32B27/26 , B32B27/38 , B32B2457/08 , H05K3/387 , H05K3/4661 , H05K3/4673 , H05K2201/0195 , H05K2201/0209 , H05K2203/066 , Y10S428/901 , Y10T29/49128 , Y10T29/49155 , Y10T428/287
摘要： The present invention provides a laminating method, when a multilayer printed wiring board is produced according to a build-up technique, for easily introducing an insulating layer that, under the lamination conditions, allows filling a resin inside a through hole and/or a via hole simultaneously with laminating a circuit board, is low in the thermal expansion coefficient of a formed insulating layer, and, after roughening a surface of the insulating layer, is excellent in the adhesiveness with a conductor layer that is formed according to plating. The present invention also provides a method of forming the insulating layer; and a method of producing the multilayer printed wiring board; and furthermore an adhesive film that is used in these methods. The laminating method is a method of laminating a circuit board characterized in that the adhesive film formed by laminating a resin composition layer made of the following A layer and B layer on a support base film; Layer A is a layer of a thermosetting resin composition that contains an epoxy resin having two or more epoxy groups in one molecule and an epoxy curing agent, has an inorganic filler content of from 0 to less than 40% by weight, has a cured surface obtained by thermally curing which after roughening with an alkaline permanganic acid solution, allows forming a conductor layer according to the plating, and is solid at ambient temperature, and; Layer B is a layer of a thermosetting resin composition that contains an epoxy resin having two or more epoxy groups in one molecule and an epoxy curing agent, has an inorganic filler content of 40% by weight or more, and is solid at ambient temperature; Layer A is laminated adjacent to the support base film; Layer B layer has a fluidity that allows under lamination conditions the filling of a resin into a through hole and/or a via hole simultaneously with the lamination of the circuit board; and The lamination is carried out while keeping the B layer directly in contact with the circuit board.

14. 发明授权

US06221972B1 Photosensitive resin and photosensitive resin composition containing the same 失效
标题翻译：感光树脂和含有它们的感光性树脂组合物
公开(公告)号：US06221972B1
公开(公告)日：2001-04-24
申请号：US08927086
申请日：1997-09-10
申请人： Shigeo Nakamura , Tadahiko Yokota
发明人： Shigeo Nakamura , Tadahiko Yokota
IPC分类号： C08F830
CPC分类号： G03F7/038 , C08G59/1433 , C09D163/10 , G03F7/029 , Y10S522/904
摘要： The present invention relates to a novel photosensitive resin which can be developed in water and which can be used as a photosensitive resin composition. More specifically, the present invention relates to a composition which is useful as a photosensitive soldering resist for printed circuit board.
摘要翻译：本发明涉及一种可在水中显影并可用作感光性树脂组合物的新型感光性树脂。更具体地说，本发明涉及可用作印刷电路板的感光性抗蚀剂的组合物。

15. 发明申请

US20100040874A1 FILM FOR METAL FILM TRANSFER, METHOD FOR TRANSFERRING METAL FILM AND METHOD FOR MANUFACTURING CIRCUIT BOARD 审中-公开
标题翻译：用于金属膜转移的膜，用于转移金属膜的方法和用于制造电路板的方法
公开(公告)号：US20100040874A1
公开(公告)日：2010-02-18
申请号：US12551776
申请日：2009-09-01
申请人： Hirohisa Narahashi , Shigeo Nakamura , Tadahiko Yokota
发明人： Hirohisa Narahashi , Shigeo Nakamura , Tadahiko Yokota
IPC分类号： B32B15/09 , B32B15/04 , B32B15/082 , B32B15/20 , B32B38/10
CPC分类号： H05K3/025 , H05K2203/0769 , H05K2203/0786 , Y10T428/265 , Y10T428/266 , Y10T428/31692 , Y10T428/31703
摘要： Films for metal film transfer, which contain (a) a support layer, (b) a release layer formed on the support layer, which is comprised of one or more kinds of water-soluble polymers selected from a water-soluble cellulose resin, a water-soluble polyester resin, and a water-soluble acrylic resin, and (c) a metal film layer formed on the release layer, show superior transferability of the metal film layer. Such films are useful for efficiently producing circuit boards by laminating the film for metal film transfer on a curable resin composition layer on a substrate such that the metal film layer is in contact with a surface of the curable resin composition layer, curing the curable resin composition layer, detaching the support layer, and removing the release layer on the metal film layer by dissolving the release layer in an aqueous solution.
摘要翻译：用于金属膜转移的膜，其包含（a）支撑层，（b）形成在载体层上的剥离层，其由一种或多种选自水溶性纤维素树脂的水溶性聚合物，水溶性聚酯树脂和水溶性丙烯酸树脂，（c）形成在剥离层上的金属膜层，显示出优异的金属膜层的转印性。通过将金属膜转印用膜层叠在基板上的固化性树脂组合物层上，使得金属膜层与固化性树脂组合物层的表面接触，使固化性树脂组合物固化，可以有效地制造电路板通过将剥离层溶解在水溶液中，分离支撑层，以及除去金属膜层上的剥离层。

16. 发明授权

US06805958B2 Epoxy resin composition, and adhesive film and prepreg using the composition, and multilayer printed-wiring board using them, and process for manufacturing the same 有权
标题翻译：环氧树脂组合物，使用该组合物的粘合膜和预浸料，使用它们的多层印刷布线板及其制造方法
公开(公告)号：US06805958B2
公开(公告)日：2004-10-19
申请号：US10164403
申请日：2002-06-10
申请人： Shigeo Nakamura , Tadahiko Yokota
发明人： Shigeo Nakamura , Tadahiko Yokota
IPC分类号： B32B2738
CPC分类号： H05K3/4661 , C08G59/621 , C08L63/00 , C08L71/00 , C08L71/02 , G03F7/038 , H01L23/49894 , H01L2924/0002 , Y10S428/901 , Y10T428/24994 , Y10T428/249941 , Y10T428/26 , Y10T428/287 , Y10T428/2971 , Y10T428/31511 , Y10T428/31515 , Y10T428/31522 , Y10T428/31529 , C08L2666/14 , H01L2924/00
摘要： The present invention provides an epoxy resin composition containing (A) an epoxy resin having two or more epoxy groups in one molecule, (B) a phenolic curing agent, (C) a phenoxy resin containing a bisphenol S skeleton and having a weight average molecular weight of 5,000 to 100,000, and (D) a curing accelerator, wherein the epoxy resin (A) contains a phosphorus atom, and wherein 5 to 50 parts by weight of the phenoxy resin (C) and 0.05 to 10 parts by weight of the curing accelerator (D) are mixed with 100 parts by weight in total of the epoxy resin (A) and the phenolic curing agent (B).
摘要翻译：本发明提供一种环氧树脂组合物，其含有（A）在一个分子中具有两个以上环氧基的环氧树脂，（B）酚类固化剂，（C）含有双酚S骨架的苯氧基树脂，并具有重均分子量重量为5,000〜100,000，（D）固化促进剂，其中环氧树脂（A）含有磷原子，其中5〜50重量份苯氧基树脂（C）和0.05〜10重量份固化促进剂（D）与100重量份的环氧树脂（A）和酚类固化剂（B）的总量混合。

17. 发明授权

US06376609B2 Photosensitive resin and photosensitive resin composition containing the same 失效
标题翻译：感光树脂和含有它们的感光性树脂组合物
公开(公告)号：US06376609B2
公开(公告)日：2002-04-23
申请号：US09782256
申请日：2001-02-14
申请人： Shigeo Nakamura , Tadahiko Yokota
发明人： Shigeo Nakamura , Tadahiko Yokota
IPC分类号： G03F7028
CPC分类号： G03F7/038 , C08G59/1433 , C09D163/10 , G03F7/029 , Y10S522/904
摘要： The present invention relates to a novel photosensitive resin which can be developed in water and which can be used as a photosensitive resin composition. More specifically, the present invention relates to a composition which is useful as a photosensitive soldering resist for printed circuit board.
摘要翻译：本发明涉及一种可在水中显影并可用作感光性树脂组合物的新型感光性树脂。更具体地说，本发明涉及可用作印刷电路板的感光性抗蚀剂的组合物。

18. 发明授权

US08382996B2 Metal-clad laminate 有权
标题翻译：覆金属层压板
公开(公告)号：US08382996B2
公开(公告)日：2013-02-26
申请号：US12723165
申请日：2010-03-12
申请人： Hirohisa Narahashi , Shigeo Nakamura , Tadahiko Yokota
发明人： Hirohisa Narahashi , Shigeo Nakamura , Tadahiko Yokota
IPC分类号： H01B13/00
CPC分类号： H05K3/381 , H05K3/025 , H05K2203/072 , H05K2203/0786 , H05K2203/1152 , Y10T29/49155
摘要： Metal-clad laminates in which a conductor layer having superior peel strength is formed on a smooth surface of an insulating layer can be obtained by a method comprising (A) a step of preparing a metal-clad laminate precursor by providing one or more sheets of prepreg between two sheets of film having a metal film layer on a support layer, and heating and pressing them under reduced pressure, (B) a step of removing the support layer, (C) a step of removing the metal film layer, and (D) a step of forming a metal film layer on the surface of an insulating layer by electroless plating.
摘要翻译：在绝缘层的光滑表面上形成具有优良剥离强度的导体层的覆金属层压体可以通过以下方法获得：（A）通过提供一层或多层片材来制备覆金属层压板前体的步骤在支撑层上具有金属膜层的两片薄膜之间的预浸料坯，并且在减压下加热和加压它们;（B）去除支撑层的步骤，（C）去除金属膜层的步骤和（ D）通过化学镀在绝缘层的表面上形成金属膜层的步骤。

19. 发明申请

US20100044078A1 PROCESS FOR PRODUCING CIRCUIT BOARD 有权
标题翻译：生产电路板的工艺
公开(公告)号：US20100044078A1
公开(公告)日：2010-02-25
申请号：US12551802
申请日：2009-09-01
申请人： Hirohisa Narahashi , Shigeo Nakamura , Tadahiko Yokota
发明人： Hirohisa Narahashi , Shigeo Nakamura , Tadahiko Yokota
IPC分类号： H05K1/00 , B32B37/00 , B32B33/00
CPC分类号： H05K3/025 , B32B37/025 , B32B38/10 , B32B2038/0076 , B32B2311/00 , B32B2457/08 , H05K3/386 , H05K2201/0358 , H05K2203/0264 , H05K2203/0769 , H05K2203/0786 , Y10T428/14 , Y10T428/1438 , Y10T428/1443 , Y10T428/1476 , Y10T428/26 , Y10T428/263 , Y10T428/264 , Y10T428/265 , Y10T428/266 , Y10T428/269
摘要： Producing a circuit board, by laminating, on a substrate, an adhesive film with a metal film, which comprises a water-soluble polymer release layer, a metal film layer and a curable resin composition layer, which are formed in this order on a support layer, and has a release property enabling detachment of said water-soluble polymer release layer from the support layer after curing of the curable resin composition layer, such that the curable resin composition layer contacts the substrate; curing the curable resin composition layer; detaching the support layer, and removing the water-soluble polymer release layer present on the metal film layer by dissolving the release layer in an aqueous solution, efficiently forms an insulating layer and a metal film layer superior in adhesiveness to the insulating layer and in uniformity. By this method, a metal film layer having high adhesiveness and high property uniformity can be formed on the surface without the need for roughening the surface of an insulating layer with an oxidant such as alkaline potassium permanganate solution and the like. Thus, etching for circuit formation can be performed under milder conditions, which in turn provides a superior effect on micro wiring on circuit boards such as multi-layer printed wiring boards, flexible printed wiring boards, and the like.
摘要翻译：通过在基板上层叠具有金属膜的粘合膜来制造电路板，所述金属膜包括依次形成在支撑体上的水溶性聚合物剥离层，金属膜层和固化性树脂组合物层并且具有能够使固化性树脂组合物层固化后使所述水溶性高分子脱离层从支撑层脱离的脱模性，使得固化性树脂组合物层与基材接触; 固化树脂组合物层; 通过将剥离层溶解在水溶液中，分离保护层，除去存在于金属膜层上的水溶性聚合物释放层，有效地形成绝缘层和与绝缘层的粘合性优异的金属膜层，均匀性。通过这种方法，可以在表面上形成具有高粘合性和高性能均匀性的金属膜层，而不需要用氧化剂如碱式高锰酸钾溶液等来粗糙化绝缘层的表面。因此，可以在更温和的条件下进行电路形成蚀刻，这又对诸如多层印刷线路板，柔性印刷线路板等的电路板上的微接线提供了优异的效果。

20. 发明申请

US20050178501A1 Process for producing a multi-layer printer wiring board 审中-公开
公开(公告)号：US20050178501A1
公开(公告)日：2005-08-18
申请号：US11058700
申请日：2005-02-16
申请人： Shigeo Nakamura , Tadahiko Yokota
发明人： Shigeo Nakamura , Tadahiko Yokota
IPC分类号： C08L63/00 , H05K1/00 , H05K3/46 , B32B31/26
CPC分类号： H05K3/4655 , C08L63/00 , H05K3/4652 , H05K3/4661 , H05K3/4676 , H05K2201/0209 , H05K2201/0212 , H05K2201/0355 , H05K2203/066 , H05K2203/0773 , Y10S428/901 , Y10T428/24917 , Y10T428/287
摘要： The present invention is directed to an inter-laminar adhesive composition containing a liquid epoxy resin, a polyfunctional epoxy resin having a softening point higher than a lamination temperature of the adhesive and with two or more epoxy groups within the molecule; and a latent epoxy curing agent initiating a reaction at a temperature higher than the lamination temperature. The adhesive composition optionally contains a liquid resin other than the liquid epoxy resin and/or an organic solvent and the liquid resin includes the liquid epoxy resin, the organic solvent or both constituting from 10 to 55% by weight of the composition. This inter-laminar adhesive composition allows for the preparation of a multi-layer printed wiring board. The process for preparing the multi-layer printed wiring board is provided. The resulting multi-layer printed wiring board of the invention possesses excellent embedding properties in the internal-layer circuit, excellent surface smoothness and can be provided at high productivity levels in a building up process using the present adhesive.

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