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    • 13. 发明授权
    • Nanocomposites with high thermoelectric figures of merit
    • 具有高热值性能的纳米复合材料
    • US08293168B2
    • 2012-10-23
    • US12273783
    • 2008-11-19
    • Gang ChenMildred DresselhausZhifeng Ren
    • Gang ChenMildred DresselhausZhifeng Ren
    • B22F3/105H01L35/12
    • B29C43/36H01L35/16H01L35/22Y10S257/00Y10T428/2938
    • The present invention is generally directed to nanocomposite thermoelectric materials that exhibit enhanced thermoelectric properties. The nanocomposite materials include two or more components, with at least one of the components forming nano-sized structures within the composite material. The components are chosen such that thermal conductivity of the composite is decreased without substantially diminishing the composite's electrical conductivity. Suitable component materials exhibit similar electronic band structures. For example, a band-edge gap between at least one of a conduction band or a valence band of one component material and a corresponding band of the other component material at interfaces between the components can be less than about 5kBT, wherein kB is the Boltzman constant and T is an average temperature of said nanocomposite composition.
    • 本发明一般涉及显示增强的热电性质的纳米复合热电材料。 纳米复合材料包括两种或多种组分,其中至少一种组分在复合材料内形成纳米尺寸的结构。 选择这些组分使得复合材料的热导率降低而基本上不会降低复合材料的导电性。 合适的组分材料表现出类似的电子带结构。 例如,在一个组分材料的导带或价带中的至少一个与组分之间的界面处的另一组分材料的相应带之间的带边间隙可以小于约5kBT,其中kB是玻尔兹曼 常数,T是所述纳米复合材料组合物的平均温度。