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11. 发明授权

US5407882A Olefin polymerization catalyst and olefin polymerization process 失效
标题翻译：烯烃聚合催化剂和烯烃聚合方法
公开(公告)号：US5407882A
公开(公告)日：1995-04-18
申请号：US100174
申请日：1993-08-02
申请人： Satoru Yamada , Akihiro Yano
发明人： Satoru Yamada , Akihiro Yano
IPC分类号： C08F4/646 , C08F4/659 , C08F4/6592 , C08F10/00 , B01J31/14
CPC分类号： C08F10/00 , C08F4/65908 , C08F4/65912 , C08F4/65922
摘要： A catalyst for polymerization of olefin is provided which comprises (A) a metallocene compound, (B) an organoaluminum compound, and (C) a metal borate or a metal aluminate. The metallocene compound (A) is represented by the general formula (1) below: ##STR1## where Cp.sup.1 and Cp.sup.2 are cyclopentadienyl group; R.sup.1 is an alkylene, arylalkylene, dialkylsilylene, dialkylgermanylene, alkylphosphinediyl, or alkylimino group, R.sup.1 crosslinking Cp.sup.1 and Cp.sup.2 together; m is 0 or 1; M is titanium, zirconium, or hafnium; and R.sup.2 and R.sup.3 are independently hydrogen, halogen, or a hydrocarbon group, an alkoxy group, or an aryloxy group having 1 to 12 carbons, the organic aluminum compound (B) is represented by the general formula (2) below:AlR.sup.4.sub.3 (2)where each R.sup.4 is independently hydrogen, alkyl, alkoxy, or an aryl group, at least one R.sup.4 being an alkyl group, and the metal borate or the metal aluminate (C) being represented by the general formula (3):(C(L).sub.n).sub.b (A).sub.d (3)where C is an alkali metal cation or an alkaline earth metal cation; L is a Lewis base; A is an art ion having elemental boron or elemental aluminum; n is an integer of from 0 to 6; b and d are respectively an integer selected to balance the electric charge.
摘要翻译：提供了一种用于烯烃聚合的催化剂，其包含（A）茂金属化合物，（B）有机铝化合物和（C）金属硼酸盐或金属铝酸盐。金属茂化合物（A）由下述通式（1）表示：二烯基; R1是亚烷基，芳基亚烷基，二烷基亚甲硅烷基，二烷基炔丙基，烷基亚膦酰基或烷基亚氨基，R1交联Cp1和Cp2; m为0或1; M是钛，锆或铪; R2和R3独立地为氢，卤素或烃基，烷氧基或碳数为1〜12的芳氧基，有机铝化合物（B）由下述通式（2）表示：AlR43（2 ）其中每个R 4独立地是氢，烷基，烷氧基或芳基，至少一个R 4是烷基，并且金属硼酸盐或金属铝酸盐（C）由通式（3）表示：（C（ L）n）b（A）d（3）其中C是碱金属阳离子或碱土金属阳离子; L是路易斯碱; A是具有元素硼或元素铝的艺术离子; n为0〜6的整数。 b和d分别是选择用于平衡电荷的整数。

12. 发明授权

US06777621B2 Flat panel display module and method of manufacturing the same 有权
标题翻译：平板显示模块及其制造方法
公开(公告)号：US06777621B2
公开(公告)日：2004-08-17
申请号：US09927498
申请日：2001-08-13
申请人： Takashi Ishikawa , Yuji Kondo , Akihiro Yano
发明人： Takashi Ishikawa , Yuji Kondo , Akihiro Yano
IPC分类号： H05K116
CPC分类号： H05B33/04 , G09F9/30 , H01L27/3241 , H05K1/189 , H05K2201/053 , H05K2201/056 , H05K2201/10106 , H05K2201/10128 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49169
摘要： A flat panel display module includes a transparent substrate, a light emitting section, a sealing cap, a flexible printed circuit board and a semiconductor device. The transparent substrate with a wiring line terminal section is formed on one of surfaces of the transparent substrate in at least one of opposing ends of the transparent substrate. The light emitting section is provided in a display region in a center section on the surface on which the wiring line terminal section of the transparent substrate is formed. The sealing cap is provided for a sealing region to cover the light emitting section such that ends of the sealing cap does not reach the ends of the transparent substrate or the wiring line terminal section of the transparent substrate. The flexible printed circuit board is connected to the wiring line terminal section and extending along the sealing cap of the transparent substrate. The semiconductor device is mounted on the flexible printed circuit board for the light emitting section.
摘要翻译：平板显示模块包括透明基板，发光部分，密封盖，柔性印刷电路板和半导体器件。具有布线端子部分的透明基板在透明基板的至少一个相对端部中的一个表面上形成。发光部设置在形成透明基板的布线端子部的表面的中央部的显示区域中。密封盖被设置用于密封区域以覆盖发光部分，使得密封帽的端部不到达透明基板的端部或透明基板的布线端子部分。柔性印刷电路板连接到布线端子部分并且沿着透明基板的密封盖延伸。半导体器件安装在用于发光部分的柔性印刷电路板上。

13. 发明授权

US6110858A Olefin polymerization catalysts and process for producing olefin polymers 失效
标题翻译：烯烃聚合催化剂和烯烃聚合物的制备方法
公开(公告)号：US6110858A
公开(公告)日：2000-08-29
申请号：US991658
申请日：1997-12-16
申请人： Toshiyuki Kaneko , Akihiro Yano
发明人： Toshiyuki Kaneko , Akihiro Yano
IPC分类号： C08F4/02 , C08F4/602 , C08F4/619 , C08F4/6192 , C08F4/642 , C08F10/00 , C08F110/06 , C08F210/16 , C08F210/18 , B01J29/00
CPC分类号： C08F10/00 , C08F110/06 , C08F210/16 , C08F210/18 , C08F4/61912 , C08F4/61916 , C08F4/61922
摘要： Catalysts for olefin polymerization which consist essentially of a transition metal compound, a modified clay compound and an organic aluminum compound, wherein the modified clay compound comprises a reaction product of a clay mineral and a proton acid salt of a specific amine compound, as well as a method of polymerizing olefins using such catalysts. It is possible thereby to obtain olefin polymers with high productivity and low ash content.
摘要翻译：用于烯烃聚合的催化剂，其基本上由过渡金属化合物，改性粘土化合物和有机铝化合物组成，其中改性粘土化合物包括粘土矿物和特定胺化合物的质子酸盐的反应产物，以及使用这种催化剂聚合烯烃的方法。从而可以获得具有高生产率和低灰分含量的烯烃聚合物。

14. 发明授权

US6042442A Enhancement in bonding strength in field emission electron source 失效
标题翻译：增强场致发射电子源的接合强度
公开(公告)号：US6042442A
公开(公告)日：2000-03-28
申请号：US131924
申请日：1998-08-10
申请人： Akihiro Yano
发明人： Akihiro Yano
IPC分类号： H01J9/02 , H01J1/304 , H01J5/52 , H01J9/36 , H01J29/92
CPC分类号： H01J5/52 , H01J29/92 , H01J9/36 , H01J2201/304 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/4823 , H01L2224/73265 , H01L2924/01019 , H01L2924/01322 , H01L2924/19107
摘要： There is provided a field emission electron source including (a) a substrate at least a surface of which is electrically conductive, (b) at least one conically shaped, electrically conductive emitter, the emitter being formed on the substrate, (c) an electrically insulating layer formed on the substrate for electrically insulating the substrate from a gate electrode, (d) a gate electrode formed on the electrically insulating layer, the gate electrode and the electrically insulating layer being formed with an opening in which the emitter is disposed, (e) a bonding pad formed on the electrically insulating layer and in electrical communication with the gate electrode, (f) a first metal layer formed on the bonding pad, and (g) a second metal layer formed on the first metal layer, the second metal layer having a higher melting point than that of the first metal layer. For instance, the first metal layer is made of Au--Sn alloy, and the second metal layer is made of Au--Si alloy, Au--Ge alloy, Au--K alloy, Al--Si alloy, Au or Al. In accordance with the above mentioned field emission electron source, a bonding pad has a metal surface including Au or Al as a principal component. Hence, even if Al wire or Au wire is used for wire-bonding, there can be obtained sufficiently high bonding strength between a bonding pad and a wire.
摘要翻译：提供场致发射电子源，其包括（a）至少其表面导电的衬底，（b）至少一个锥形导电发射极，发射极形成在衬底上，（c）电形成在基板上的绝缘层，用于将基板与栅极电绝缘，（d）形成在电绝缘层上的栅电极，栅电极和电绝缘层形成有设置有发射极的开口（ e）形成在所述电绝缘层上并与所述栅极电连通的焊盘，（f）形成在所述焊盘上的第一金属层，和（g）形成在所述第一金属层上的第二金属层，所述第二金属层金属层的熔点高于第一金属层的熔点。例如，第一金属层由Au-Sn合金制成，第二金属层由Au-Si合金，Au-Ge合金，Au-K合金，Al-Si合金，Au或Al制成。根据上述场发射电子源，接合焊盘具有包括Au或Al作为主要成分的金属表面。因此，即使使用Al线或Au线进行引线接合，也可以获得足够高的接合焊盘和线之间的接合强度。

15. 发明授权

US5965946A Package having Au layer semiconductor device having Au layer 失效
标题翻译：具有Au层的Au层半导体器件的封装
公开(公告)号：US5965946A
公开(公告)日：1999-10-12
申请号：US824408
申请日：1997-03-26
申请人： Akihiro Yano , Yuji Kondo
发明人： Akihiro Yano , Yuji Kondo
IPC分类号： H01S5/00 , H01J1/304 , H01J29/04 , H01L21/60 , H01L23/482 , H01L23/48
CPC分类号： H01L23/4827 , H01L24/29 , H01L24/31 , H01L24/83 , H01L2224/29109 , H01L2224/29111 , H01L2224/8319 , H01L2224/83205 , H01L2224/83801 , H01L2224/83805 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01044 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/3025
摘要： A method of mounting a semiconductor device first forms a barrier layer on one surface of an semiconductor substrate made of Si. Then, a first Au layer is formed on the barrier layer. Accordingly, a semiconductor device is provided. The barrier layer is formed of metal for preventing mutual diffusion of Si in the Si semiconductor substrate with Au in the first Au layer at a high temperature of 600.degree. C. or higher. A step of acquiring a package substrate forms a metal coated layer on a base first and then forms a second Au layer on the surface of the metal coated layer. Then, the semiconductor device is placed on the package substrate with the first and second Au layers contacting with each other, and the semiconductor device and the package substrate are scrubbed against each other. Consequently, the first and second Au layers form Au--Au eutectic layer, thereby connect the semiconductor device to the package substrate.
摘要翻译：首先安装半导体器件的方法首先在由Si制成的半导体衬底的一个表面上形成阻挡层。然后，在阻挡层上形成第一Au层。因此，提供了半导体器件。阻挡层由金属形成，用于防止Si半导体衬底中的Si与第一Au层中的Au在600℃或更高的高温下相互扩散。获取封装衬底的步骤首先在基底上形成金属涂层，然后在金属涂层的表面上形成第二Au层。然后，将第一和第二Au层彼此接触地将半导体器件放置在封装衬底上，并且半导体器件和封装衬底相互擦洗。因此，第一和第二Au层形成Au-Au共晶层，从而将半导体器件连接到封装衬底。

16. 发明授权

US5412046A Polyethylene and method of production thereof 失效
标题翻译：聚乙烯及其生产方法
公开(公告)号：US5412046A
公开(公告)日：1995-05-02
申请号：US212337
申请日：1994-03-14
申请人： Akihiro Yano , Yutaka Naito , Kunitaka Yamada , Masaaki Ohtsuru
发明人： Akihiro Yano , Yutaka Naito , Kunitaka Yamada , Masaaki Ohtsuru
IPC分类号： C08F4/70 , C08F4/60 , C08F4/80 , C08F10/02 , C08F110/02 , C08F210/16 , C08F4/26
CPC分类号： C08F10/02 , C08F110/02 , C08F210/16 , Y10S526/903
摘要： A polyethylene, having 1 to 60 methyl branches and 1 to 60 hexyl or higher branches per 1000 carbon atoms, a g-value of 0.5 to 0.8, and a limiting viscosity [.eta.] of 0.005 to 20.0 dl/g as measured at 140.degree. C. in o-dichlorobenzene, and a method for producing the same by polymerizing ethylene using a catalyst system comprising a coordination nickel compound of zero- or two-valent nickel and an aminobis(imino)phosphorane represented by a general formula (I): ##STR1## where R.sub.1, R.sub.2, R.sub.3 and R.sub.4 may be the same as or different from each other and are respectively n-alkyl, isoalkyl, aryl or trialkylsilyl, in the presence of .alpha.-olefin.
摘要翻译：聚乙烯，每1000个碳原子具有1至60个甲基支链和1至60个己基或更高的支链，g值为0.5至0.8，极限粘度η为0.005至20.0dl / g，在140℃下测量以及其通过使用包含由0或2价镍构成的配位镍化合物和由通式（I）表示的氨基双（亚氨基）正膦）的催化剂体系使乙烯聚合的制备方法：（I）其中R 1，R 2，R 3和R 4可以彼此相同或不同，并且在α-烯烃的存在下分别为正烷基，异烷基，芳基或三烷基甲硅烷基。

17. 发明授权

US07678866B2 Polyethylene composition and process for producing same 有权
标题翻译：聚乙烯组合物及其制备方法
公开(公告)号：US07678866B2
公开(公告)日：2010-03-16
申请号：US10832342
申请日：2004-04-27
申请人： Satoru Yamada , Masayuki Yamaguchi , Akihiro Yano , Yasutake Wakabayashi , Kei Inatomi
发明人： Satoru Yamada , Masayuki Yamaguchi , Akihiro Yano , Yasutake Wakabayashi , Kei Inatomi
IPC分类号： C08L23/06 , C08L23/00 , C08F255/00
CPC分类号： C08L23/06 , C08F290/042 , C08L23/08 , C08L2205/02 , C08L2314/06 , Y10S526/903 , C08L2666/06 , C08F210/02
摘要： A polyethylene composition prepared by polymerizing ethylene and an optional olefin with ≧3 carbon atoms in the presence of a macromonomer, is provided. The macromonomer is a vinyl-terminated ethylene polymer prepared by polymerizing ethylene and an optional olefin with ≧3 carbon atoms, and the macromonomer has (A) Mn≧5,000, and Mw/Mn=2-5. The polyethylene composition comprises (C) branched polyethylene prepared by copolymerizing ethylene, the macromonomer and an optional olefin with ≧3 carbon atoms, and the macromonomer. The polyethylene composition has (D) a density of 0.890-0.980 g/cm3, (E) Mw=30,000-10,000,000, (F) Mw/Mn=2-30, (G) a long chain branch frequency of 0.01-3 per 1,000 C atoms, and (H) a shrinking factor (g′ value) of 0.1-0.9 as measured by GPC/intrinsic-viscosity. The polyethylene composition can be finely divided particles having (P) a powder bulk density of 0.15-0.50 g/cm3.
摘要翻译：提供了通过在大分子单体的存在下聚合乙烯和具有≥3个碳原子的任选的烯烃制备的聚乙烯组合物。大分子单体是通过聚合乙烯和具有≥3个碳原子的任选烯烃制备的乙烯基封端的乙烯聚合物，并且大分子单体具有（A）Mn≥5000，Mw / Mn = 2-5。聚乙烯组合物包含（C）通过共聚乙烯，大分子单体和任选的具有≥3个碳原子的烯烃制备的支链聚乙烯和大分子单体。聚乙烯组合物具有（D）密度为0.890-0.980g / cm 3，（E）Mw = 30,000-10,000,000，（F）Mw / Mn = 2-30，（G）长链支化频率为0.01-3 1000个C原子，（H）通过GPC /固有粘度测定的收缩因子（g'值）为0.1-0.9。聚乙烯组合物可以是具有（P）粉末堆积密度为0.15-0.50g / cm 3的细碎颗粒。

18. 发明授权

US6034187A Catalyst for olefin polymerization and process for production of olefin polymer 失效
标题翻译：用于烯烃聚合的催化剂和用于生产烯烃聚合物的方法
公开(公告)号：US6034187A
公开(公告)日：2000-03-07
申请号：US81942
申请日：1998-05-21
申请人： Seiji Maehama , Akihiro Yano , Morihiko Sato
发明人： Seiji Maehama , Akihiro Yano , Morihiko Sato
IPC分类号： C08F4/642 , C08F2/00 , C08F4/648 , C08F4/659 , C08F4/6592 , C08F10/00 , C08F32/00
CPC分类号： C08F10/00 , C08F110/02 , C08F4/65912 , C08F4/65925
摘要： A novel catalyst for polymerization of olefin is provided which comprises a modified clay compound (a) having an average particle diameter of less than 10 .mu.m, a transition metal compound (b), and an organoaluminum compound (c). This catalyst exhibits improved initial polymerization behavior, and produces an olefin polymer of less ash content at a high productivity.
摘要翻译：提供了一种新型的烯烃聚合催化剂，它包括平均粒径小于10微米的改性粘土化合物（a），过渡金属化合物（b）和有机铝化合物（c）。该催化剂表现出改善的初始聚合行为，并且以高生产率产生灰分含量较低的烯烃聚合物。

19. 发明授权

US5471876A Semiconductor accelerometer 失效
标题翻译：半导体加速度计
公开(公告)号：US5471876A
公开(公告)日：1995-12-05
申请号：US964030
申请日：1992-10-21
申请人： Akihiro Yano
发明人： Akihiro Yano
IPC分类号： G01P15/12 , G01P21/00 , H01L29/84 , G01P15/08
CPC分类号： G01P21/00
摘要： A structure of a semiconductor accelerometer which includes a body having a mass, beams for supporting the mass and gauge resistors provided on the beams, upper and bottom covering members sandwiching the body so as to form apertures over and under the mass and at least one through hole provided in at least any one of said upper and bottom covering members. Preferably, the through hole is provided at a center portion of the upper covering member. A probe passes through the through hole and the mass is pressed down with the top of the probe by which a predetermined strain is caused at the beams having the gauge resistors. This permits a measurement of the characteristic of the output voltage to the variation of the mass in the vertical direction.
摘要翻译：一种半导体加速度计的结构，其包括具有质量的主体，用于支撑质量的梁和设置在梁上的测量电阻器，上部和底部覆盖部件夹着主体，以在质量块上方和下方形成孔孔设置在所述上盖部件和底部覆盖部件中的至少任意一个上。优选地，通孔设置在上覆盖构件的中心部分。探针通过通孔，并且质量被探针的顶部压下，由此在具有量规电阻器的光束处引起预定的应变。这允许测量输出电压的特性与质量在垂直方向上的变化。

20. 发明授权

US5374753A Organic transition metal complex 失效
标题翻译：有机过渡金属络合物
公开(公告)号：US5374753A
公开(公告)日：1994-12-20
申请号：US117288
申请日：1993-09-07
申请人： Satoru Yamada , Akihiro Yano
发明人： Satoru Yamada , Akihiro Yano
IPC分类号： C07F17/00 , C08F4/46 , C08F4/60 , C08F4/642 , C08F4/659 , C08F4/6592 , C08F10/00 , C07F7/28 , C08F4/44 , C08F110/02
CPC分类号： C07F17/00 , C08F10/00 , C08F4/65922
摘要： An organometal complex is provided which is represented by the general formula (1) below: ##STR1## wherein Cp.sup.1 and Cp.sup.2 are respectively a substituted or unsubstituted cyclopentadienyl group; R.sup.1 is a group selected from alkylene groups or arylalkylene groups having 1 to 20 carbons, dialkylsilylene groups, dialkylgermanylene groups, alkylphosphinediyl groups, or alkylimino groups and R.sup.1 crosslinking Cp.sup.1 and Cp.sup.2 together; m is 0 or 1; M is selected from titanium, zirconium, and hafnium; R.sup.2, R.sup.3, and R.sup.4 are independently hydrogen, a hydrocarbon group of 1 to 12 carbons, an alkoxyl group, or an aryloxy group; and MAO is a methylalumoxane group. This organometal complex is capable of producing selectively an olefin polymer without use of any other additional catalyst component.
摘要翻译：提供由以下通式（1）表示的有机金属络合物：取代或未取代的环戊二烯基; R1是选自亚烷基或碳原子数为1〜20的芳基亚烷基，二烷基亚甲硅烷基，二烷基亚甲基，烷基亚膦基或烷基亚氨基，R1交联Cp1和Cp2; m为0或1; M选自钛，锆和铪; R2，R3和R4独立地为氢，1〜12个碳的烃基，烷氧基或芳氧基; MAO是甲基铝氧烷基。该有机金属络合物能够选择性地生产烯烃聚合物而不使用任何其它另外的催化剂组分。

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