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1. 发明授权

US6110858A Olefin polymerization catalysts and process for producing olefin polymers 失效
标题翻译：烯烃聚合催化剂和烯烃聚合物的制备方法
公开(公告)号：US6110858A
公开(公告)日：2000-08-29
申请号：US991658
申请日：1997-12-16
申请人： Toshiyuki Kaneko , Akihiro Yano
发明人： Toshiyuki Kaneko , Akihiro Yano
IPC分类号： C08F4/02 , C08F4/602 , C08F4/619 , C08F4/6192 , C08F4/642 , C08F10/00 , C08F110/06 , C08F210/16 , C08F210/18 , B01J29/00
CPC分类号： C08F10/00 , C08F110/06 , C08F210/16 , C08F210/18 , C08F4/61912 , C08F4/61916 , C08F4/61922
摘要： Catalysts for olefin polymerization which consist essentially of a transition metal compound, a modified clay compound and an organic aluminum compound, wherein the modified clay compound comprises a reaction product of a clay mineral and a proton acid salt of a specific amine compound, as well as a method of polymerizing olefins using such catalysts. It is possible thereby to obtain olefin polymers with high productivity and low ash content.
摘要翻译：用于烯烃聚合的催化剂，其基本上由过渡金属化合物，改性粘土化合物和有机铝化合物组成，其中改性粘土化合物包括粘土矿物和特定胺化合物的质子酸盐的反应产物，以及使用这种催化剂聚合烯烃的方法。从而可以获得具有高生产率和低灰分含量的烯烃聚合物。

2. 发明授权

US06316558B1 Transition metal compound, olefin polymerization catalyst comprising the compound, and process for production of olefin polymer 失效
标题翻译：过渡金属化合物，包含该化合物的烯烃聚合催化剂和烯烃聚合物的制备方法
公开(公告)号：US06316558B1
公开(公告)日：2001-11-13
申请号：US09039495
申请日：1998-03-16
申请人： Toshiyuki Kaneko , Ryuji Ikeda , Akihiro Yano , Morihiko Sato
发明人： Toshiyuki Kaneko , Ryuji Ikeda , Akihiro Yano , Morihiko Sato
IPC分类号： C08F452
CPC分类号： C07F17/00 , C08F4/63908 , C08F4/63912 , C08F4/63927 , C08F4/65916 , C08F10/00 , Y10S526/943
摘要： A polyolefin of a high molecular weight is produced by using a catalyst comprising a transition metal compound represented by General Formula (1):
摘要翻译：通过使用包含由通式（1）表示的过渡金属化合物的催化剂制备高分子量的聚烯烃：

3. 发明授权

US06313240B1 Process for producing ethylene/&agr;-olefin copolymer 失效
标题翻译：生产乙烯/α-烯烃共聚物的方法
公开(公告)号：US06313240B1
公开(公告)日：2001-11-06
申请号：US08198579
申请日：1994-02-18
申请人： Saiki Hasegawa , Makoto Sone , Hisami Yasuda , Akihiro Yano
发明人： Saiki Hasegawa , Makoto Sone , Hisami Yasuda , Akihiro Yano
IPC分类号： C08F452
CPC分类号： C08F210/16 , C08F4/65908 , C08F4/65912 , C08F4/65922 , Y10S526/943 , C08F210/14 , C08F2500/03 , C08F2500/12
摘要： A process for producing an ethylene/&agr;-olefin copolymer is provided in which ethylene is copolymerized with an &agr;-olefin having three or more carbons by use of an olefin polymerization catalyst at a polymerization temperature of not lower than 120° C. The olefin polymerization catalyst comprises, as constitutional components, a) a metallocene compound comprising hafnium, b) an ionizing ionic compound, and c) an organoaluminum compound, the ionizing ionic compound (b) being a compound which is capable of changing the metallocene compound (a) into a cationic form and does not further react the cationic form of the metallocene compound.
摘要翻译：提供了一种生产乙烯/α-烯烃共聚物的方法，其中乙烯与聚合温度不低于120℃的烯烃聚合催化剂与具有三个或更多个碳的α-烯烃共聚。烯烃聚合催化剂包含作为构成成分的a）包含铪的茂金属化合物，b）电离离子化合物和c）有机铝化合物，电离化离子化合物（b）是能够改变茂金属化合物（a）的化合物，成为阳离子形式，不会使阳离子形式的茂金属化合物进一步反应。

4. 发明授权

US6137215A Field emission cathode supporting structure 失效
标题翻译：场发射阴极支撑结构
公开(公告)号：US6137215A
公开(公告)日：2000-10-24
申请号：US974995
申请日：1997-11-20
申请人： Yuji Kondo , Akihiro Yano
发明人： Yuji Kondo , Akihiro Yano
IPC分类号： H01J1/304 , H01J29/04 , H01J29/48 , H01J1/30 , H01J19/24
CPC分类号： H01J29/04 , H01J1/304
摘要： A ceramic substrate for mounting a field emission cathode is secured on the lower surface of a metal flange for assembly of an electron lens of a cathode ray tube, and the mounting position of the field emission cathode on the ceramic substrate is determined with reference to the metal flange.
摘要翻译：用于安装场致发射阴极的陶瓷基板固定在用于组装阴极射线管的电子透镜的金属法兰的下表面上，并且场致发射阴极在陶瓷基板上的安装位置参考金属法兰。

5. 发明授权

US5804908A Enhancement in bonding strength in field emission electron source 失效
公开(公告)号：US5804908A
公开(公告)日：1998-09-08
申请号：US804400
申请日：1997-02-21
申请人： Akihiro Yano
发明人： Akihiro Yano
IPC分类号： H01J9/02 , H01J1/304 , H01J5/52 , H01J9/36 , H01J29/92 , H01J1/02
CPC分类号： H01J5/52 , H01J29/92 , H01J9/36 , H01J2201/304 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/4823 , H01L2224/73265 , H01L2924/01019 , H01L2924/01322 , H01L2924/19107
摘要： There is provided a field emission electron source including (a) a substrate at least a surface of which is electrically conductive, (b) at least one conically shaped, electrically conductive emitter, the emitter being formed on the substrate, (c) an electrically insulating layer formed on the substrate for electrically insulating the substrate from a gate electrode, (d) a gate electrode formed on the electrically insulating layer, the gate electrode and the electrically insulating layer being formed with an opening in which the emitter is disposed, (e) a bonding pad formed on the electrically insulating layer and in electrical communication with the gate electrode, (f) a first metal layer formed on the bonding pad, and (g) a second metal layer formed on the first metal layer, the second metal layer having a higher melting point than that of the first metal layer. For instance, the first metal layer is made of Au--Sn alloy, and the second metal layer is made of Au--Si alloy, Au--Ge alloy, Au--K alloy, Al--Si alloy, Au or Al. In accordance with the above mentioned field emission electron source, a bonding pad has a metal surface including Au or Al as a principal component. Hence, even if Al wire or Au wire is used for wire-bonding, there can be obtained sufficiently high bonding strength between a bonding pad and a wire.

6. 发明授权

US5407882A Olefin polymerization catalyst and olefin polymerization process 失效
标题翻译：烯烃聚合催化剂和烯烃聚合方法
公开(公告)号：US5407882A
公开(公告)日：1995-04-18
申请号：US100174
申请日：1993-08-02
申请人： Satoru Yamada , Akihiro Yano
发明人： Satoru Yamada , Akihiro Yano
IPC分类号： C08F4/646 , C08F4/659 , C08F4/6592 , C08F10/00 , B01J31/14
CPC分类号： C08F10/00 , C08F4/65908 , C08F4/65912 , C08F4/65922
摘要： A catalyst for polymerization of olefin is provided which comprises (A) a metallocene compound, (B) an organoaluminum compound, and (C) a metal borate or a metal aluminate. The metallocene compound (A) is represented by the general formula (1) below: ##STR1## where Cp.sup.1 and Cp.sup.2 are cyclopentadienyl group; R.sup.1 is an alkylene, arylalkylene, dialkylsilylene, dialkylgermanylene, alkylphosphinediyl, or alkylimino group, R.sup.1 crosslinking Cp.sup.1 and Cp.sup.2 together; m is 0 or 1; M is titanium, zirconium, or hafnium; and R.sup.2 and R.sup.3 are independently hydrogen, halogen, or a hydrocarbon group, an alkoxy group, or an aryloxy group having 1 to 12 carbons, the organic aluminum compound (B) is represented by the general formula (2) below:AlR.sup.4.sub.3 (2)where each R.sup.4 is independently hydrogen, alkyl, alkoxy, or an aryl group, at least one R.sup.4 being an alkyl group, and the metal borate or the metal aluminate (C) being represented by the general formula (3):(C(L).sub.n).sub.b (A).sub.d (3)where C is an alkali metal cation or an alkaline earth metal cation; L is a Lewis base; A is an art ion having elemental boron or elemental aluminum; n is an integer of from 0 to 6; b and d are respectively an integer selected to balance the electric charge.
摘要翻译：提供了一种用于烯烃聚合的催化剂，其包含（A）茂金属化合物，（B）有机铝化合物和（C）金属硼酸盐或金属铝酸盐。金属茂化合物（A）由下述通式（1）表示：二烯基; R1是亚烷基，芳基亚烷基，二烷基亚甲硅烷基，二烷基炔丙基，烷基亚膦酰基或烷基亚氨基，R1交联Cp1和Cp2; m为0或1; M是钛，锆或铪; R2和R3独立地为氢，卤素或烃基，烷氧基或碳数为1〜12的芳氧基，有机铝化合物（B）由下述通式（2）表示：AlR43（2 ）其中每个R 4独立地是氢，烷基，烷氧基或芳基，至少一个R 4是烷基，并且金属硼酸盐或金属铝酸盐（C）由通式（3）表示：（C（ L）n）b（A）d（3）其中C是碱金属阳离子或碱土金属阳离子; L是路易斯碱; A是具有元素硼或元素铝的艺术离子; n为0〜6的整数。 b和d分别是选择用于平衡电荷的整数。

7. 发明授权

US06777621B2 Flat panel display module and method of manufacturing the same 有权
标题翻译：平板显示模块及其制造方法
公开(公告)号：US06777621B2
公开(公告)日：2004-08-17
申请号：US09927498
申请日：2001-08-13
申请人： Takashi Ishikawa , Yuji Kondo , Akihiro Yano
发明人： Takashi Ishikawa , Yuji Kondo , Akihiro Yano
IPC分类号： H05K116
CPC分类号： H05B33/04 , G09F9/30 , H01L27/3241 , H05K1/189 , H05K2201/053 , H05K2201/056 , H05K2201/10106 , H05K2201/10128 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49169
摘要： A flat panel display module includes a transparent substrate, a light emitting section, a sealing cap, a flexible printed circuit board and a semiconductor device. The transparent substrate with a wiring line terminal section is formed on one of surfaces of the transparent substrate in at least one of opposing ends of the transparent substrate. The light emitting section is provided in a display region in a center section on the surface on which the wiring line terminal section of the transparent substrate is formed. The sealing cap is provided for a sealing region to cover the light emitting section such that ends of the sealing cap does not reach the ends of the transparent substrate or the wiring line terminal section of the transparent substrate. The flexible printed circuit board is connected to the wiring line terminal section and extending along the sealing cap of the transparent substrate. The semiconductor device is mounted on the flexible printed circuit board for the light emitting section.
摘要翻译：平板显示模块包括透明基板，发光部分，密封盖，柔性印刷电路板和半导体器件。具有布线端子部分的透明基板在透明基板的至少一个相对端部中的一个表面上形成。发光部设置在形成透明基板的布线端子部的表面的中央部的显示区域中。密封盖被设置用于密封区域以覆盖发光部分，使得密封帽的端部不到达透明基板的端部或透明基板的布线端子部分。柔性印刷电路板连接到布线端子部分并且沿着透明基板的密封盖延伸。半导体器件安装在用于发光部分的柔性印刷电路板上。

8. 发明授权

US06639030B2 Process for production of olefin polymer 失效
标题翻译：生产烯烃聚合物的方法
公开(公告)号：US06639030B2
公开(公告)日：2003-10-28
申请号：US08545254
申请日：1995-10-19
申请人： Makoto Sone , Saiki Hasegawa , Satoru Yamada , Akihiro Yano
发明人： Makoto Sone , Saiki Hasegawa , Satoru Yamada , Akihiro Yano
IPC分类号： C08F4642
CPC分类号： C08F10/00 , C08F4/65908 , C08F4/65912 , C08F4/65927
摘要： A process for production of an olefin polymer is provided which comprises polymerization of ethylene and/or &agr;-olefin of three of more carbons at a polymerization temperature of not lower than 120° C. with a catalyst comprising a specific metallocene compound having a substituted fluorenyl group, and a compound which reacts with the metallocene compound to form a cationic metallocene compound. The olefin polymer or copolymer produced by the process has narrow composition distribution, narrow molecular weight distribution, and a high molecular weight.
摘要翻译：提供一种生产烯烃聚合物的方法，其包括在不低于120℃的聚合温度下聚合具有三个以上碳原子的乙烯和/或α-烯烃与包含具有取代的芴基的特定茂金属化合物的催化剂和与金属茂化合物反应形成阳离子金属茂化合物的化合物。通过该方法制备的烯烃聚合物或共聚物具有窄的组成分布，窄的分子量分布和高分子量。

9. 发明授权

US6042442A Enhancement in bonding strength in field emission electron source 失效
标题翻译：增强场致发射电子源的接合强度
公开(公告)号：US6042442A
公开(公告)日：2000-03-28
申请号：US131924
申请日：1998-08-10
申请人： Akihiro Yano
发明人： Akihiro Yano
IPC分类号： H01J9/02 , H01J1/304 , H01J5/52 , H01J9/36 , H01J29/92
CPC分类号： H01J5/52 , H01J29/92 , H01J9/36 , H01J2201/304 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/4823 , H01L2224/73265 , H01L2924/01019 , H01L2924/01322 , H01L2924/19107
摘要： There is provided a field emission electron source including (a) a substrate at least a surface of which is electrically conductive, (b) at least one conically shaped, electrically conductive emitter, the emitter being formed on the substrate, (c) an electrically insulating layer formed on the substrate for electrically insulating the substrate from a gate electrode, (d) a gate electrode formed on the electrically insulating layer, the gate electrode and the electrically insulating layer being formed with an opening in which the emitter is disposed, (e) a bonding pad formed on the electrically insulating layer and in electrical communication with the gate electrode, (f) a first metal layer formed on the bonding pad, and (g) a second metal layer formed on the first metal layer, the second metal layer having a higher melting point than that of the first metal layer. For instance, the first metal layer is made of Au--Sn alloy, and the second metal layer is made of Au--Si alloy, Au--Ge alloy, Au--K alloy, Al--Si alloy, Au or Al. In accordance with the above mentioned field emission electron source, a bonding pad has a metal surface including Au or Al as a principal component. Hence, even if Al wire or Au wire is used for wire-bonding, there can be obtained sufficiently high bonding strength between a bonding pad and a wire.
摘要翻译：提供场致发射电子源，其包括（a）至少其表面导电的衬底，（b）至少一个锥形导电发射极，发射极形成在衬底上，（c）电形成在基板上的绝缘层，用于将基板与栅极电绝缘，（d）形成在电绝缘层上的栅电极，栅电极和电绝缘层形成有设置有发射极的开口（ e）形成在所述电绝缘层上并与所述栅极电连通的焊盘，（f）形成在所述焊盘上的第一金属层，和（g）形成在所述第一金属层上的第二金属层，所述第二金属层金属层的熔点高于第一金属层的熔点。例如，第一金属层由Au-Sn合金制成，第二金属层由Au-Si合金，Au-Ge合金，Au-K合金，Al-Si合金，Au或Al制成。根据上述场发射电子源，接合焊盘具有包括Au或Al作为主要成分的金属表面。因此，即使使用Al线或Au线进行引线接合，也可以获得足够高的接合焊盘和线之间的接合强度。

10. 发明授权

US5965946A Package having Au layer semiconductor device having Au layer 失效
标题翻译：具有Au层的Au层半导体器件的封装
公开(公告)号：US5965946A
公开(公告)日：1999-10-12
申请号：US824408
申请日：1997-03-26
申请人： Akihiro Yano , Yuji Kondo
发明人： Akihiro Yano , Yuji Kondo
IPC分类号： H01S5/00 , H01J1/304 , H01J29/04 , H01L21/60 , H01L23/482 , H01L23/48
CPC分类号： H01L23/4827 , H01L24/29 , H01L24/31 , H01L24/83 , H01L2224/29109 , H01L2224/29111 , H01L2224/8319 , H01L2224/83205 , H01L2224/83801 , H01L2224/83805 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01044 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/3025
摘要： A method of mounting a semiconductor device first forms a barrier layer on one surface of an semiconductor substrate made of Si. Then, a first Au layer is formed on the barrier layer. Accordingly, a semiconductor device is provided. The barrier layer is formed of metal for preventing mutual diffusion of Si in the Si semiconductor substrate with Au in the first Au layer at a high temperature of 600.degree. C. or higher. A step of acquiring a package substrate forms a metal coated layer on a base first and then forms a second Au layer on the surface of the metal coated layer. Then, the semiconductor device is placed on the package substrate with the first and second Au layers contacting with each other, and the semiconductor device and the package substrate are scrubbed against each other. Consequently, the first and second Au layers form Au--Au eutectic layer, thereby connect the semiconductor device to the package substrate.
摘要翻译：首先安装半导体器件的方法首先在由Si制成的半导体衬底的一个表面上形成阻挡层。然后，在阻挡层上形成第一Au层。因此，提供了半导体器件。阻挡层由金属形成，用于防止Si半导体衬底中的Si与第一Au层中的Au在600℃或更高的高温下相互扩散。获取封装衬底的步骤首先在基底上形成金属涂层，然后在金属涂层的表面上形成第二Au层。然后，将第一和第二Au层彼此接触地将半导体器件放置在封装衬底上，并且半导体器件和封装衬底相互擦洗。因此，第一和第二Au层形成Au-Au共晶层，从而将半导体器件连接到封装衬底。

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