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    • 15. 发明授权
    • Friction stir welding method and friction stir welded housing
    • 摩擦搅拌焊接方法和摩擦搅拌焊接外壳
    • US08220694B2
    • 2012-07-17
    • US12729407
    • 2010-03-23
    • Koichi NakagawaQing LiuIsao ShiozawaTakeo Nakagawa
    • Koichi NakagawaQing LiuIsao ShiozawaTakeo Nakagawa
    • B23K20/12
    • B23K20/1265B23K20/1255B23K2103/10
    • A friction stir welding method utilizes a joining tool comprising a friction surface; a first workpiece comprising a first treating layer, a second workpiece comprising a second treating layer, and a joining member with a melting point lower than that of the first workpiece and the second workpiece. The joining member is arranged at the joining portion of the first workpiece and the second workpiece, and abutting the first workpiece and the second workpiece. The friction surface of the joining tool is positioned to resist at least one of the first treating layer and the second treating layer. The joining tool is rotated and moved to agitate at least one of the first workpiece and the second workpiece, until at least part of the first workpiece and the second workpiece are plasticized and joined together.
    • 摩擦搅拌焊接方法利用包括摩擦面的接合工具; 包括第一处理层的第一工件,包括第二处理层的第二工件和熔点低于第一工件和第二工件的熔点的接合部件。 接合构件布置在第一工件和第二工件的接合部分处,并且邻接第一工件和第二工件。 接合工具的摩擦表面定位成抵抗第一处理层和第二处理层中的至少一个。 连接工具被旋转移动以搅动第一工件和第二工件中的至少一个,直到第一工件和第二工件的至少一部分被塑化并连接在一起。
    • 16. 发明申请
    • WIRELESS TERMINAL DEVICE
    • 无线终端设备
    • US20120176750A1
    • 2012-07-12
    • US13422281
    • 2012-03-16
    • Yanping XIEQing LiuPing LeiYao LanShuhui Sun
    • Yanping XIEQing LiuPing LeiYao LanShuhui Sun
    • H05K7/02
    • H05K1/14H05K1/0215H05K2201/0311
    • A wireless terminal device includes: a conduction and connection module, and a first Printed Circuit Board, PCB, connected to the conduction and connection module, and the wireless terminal device further includes a first conductor, where one of the conduction and connection module and the first PCB is connected to one end of the first conductor through a first capacitance coupling module, and the other one of the conduction and connection module and the first PCB is connected to the other end of the first conductor. Through the foregoing processing, capacitance coupling and grounding between the conduction and connection module and the PCB can be implemented through the first capacitance coupling module.
    • 一种无线终端设备包括:导电和连接模块以及连接到导电和连接模块的第一印刷电路板PCB,而无线终端设备还包括第一导体,其中导电和连接模块之一和 第一PCB通过第一电容耦合模块连接到第一导体的一端,并且导电和连接模块和第一PCB中的另一个连接到第一导体的另一端。 通过上述处理,可以通过第一电容耦合模块实现导通和连接模块与PCB之间的电容耦合和接地。