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11. 发明申请

US20100258712A1 OPTICAL SENSORS THAT REDUCE SPECTRAL REFLECTIONS 有权
标题翻译：减少光谱反射的光学传感器
公开(公告)号：US20100258712A1
公开(公告)日：2010-10-14
申请号：US12499723
申请日：2009-07-08
申请人： Lynn K. Wiese , Nikhil Kelkar , Viraj Patwardhan
发明人： Lynn K. Wiese , Nikhil Kelkar , Viraj Patwardhan
IPC分类号： H01L31/0232 , H01L33/00 , H01L21/00
CPC分类号： H01L25/167 , H01L33/58 , H01L2224/49171
摘要： An optical sensor device comprises a light source, a light detector, and an opaque light barrier including a first portion to block light from being transmitted directly from the source to the detector. A second portion of the light barrier extends from the first portion in a direction towards the light source, such that a portion of the second portion covers at least a portion of light emitting element(s) of the source, to reduce an amount of specular reflections, if a light transmissive cover plate were placed over the sensor. Additionally, a third portion of the barrier can extend from the first portion, in a direction towards to the detector, such that a portion of the third portion covers at least a portion of light detecting element(s) of the detector, to reduce an amount of specular reflections that would be detected by the detecting element(s) of the detector, if a light transmissive cover plate were placed over the sensor. Additionally, an off-centered lens can cover a portion of the light source.
摘要翻译：光学传感器装置包括光源，光检测器和不透明光栅，其包括第一部分，以阻止光从源直接传输到检测器。光栅的第二部分从第一部分朝向光源的方向延伸，使得第二部分的一部分覆盖源的发光元件的至少一部分，以减少镜面的量如果将透光盖板放置在传感器上方，则会产生反射。此外，屏障的第三部分可以从朝向检测器的方向从第一部分延伸，使得第三部分的一部分覆盖检测器的光检测元件的至少一部分，以减少如果将透光盖板放置在传感器上方，则由检测器的检测元件检测到的镜面反射量。此外，偏心透镜可以覆盖光源的一部分。

12. 发明授权

US07413927B1 Apparatus for forming a pre-applied underfill adhesive layer for semiconductor wafer level chip-scale packages 有权
标题翻译：用于形成用于半导体晶片级芯片级封装的预先施加的底部填充粘合剂层的装置
公开(公告)号：US07413927B1
公开(公告)日：2008-08-19
申请号：US11264604
申请日：2005-10-31
申请人： Viraj A. Patwardhan , Hau T. Nguyen , Nikhil Kelkar
发明人： Viraj A. Patwardhan , Hau T. Nguyen , Nikhil Kelkar
IPC分类号： H01L21/50 , H01L21/48 , H01L21/44
CPC分类号： H01L23/3185 , H01L21/561 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/11849 , H01L2224/16225 , H01L2224/16227 , H01L2224/26145 , H01L2224/2732 , H01L2224/27416 , H01L2224/27515 , H01L2224/2919 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/743 , H01L2224/81191 , H01L2224/81815 , H01L2224/83051 , H01L2224/83191 , H01L2224/83855 , H01L2224/83856 , H01L2224/83951 , H01L2224/9211 , H01L2224/94 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01027 , H01L2924/01033 , H01L2924/01075 , H01L2924/10156 , H01L2924/10157 , H01L2924/14 , H01L2224/11 , H01L2224/27 , H01L2924/00014 , H01L2224/81 , H01L2224/83 , H01L2224/13099 , H01L2224/05099 , H01L2924/00 , H01L2224/13599 , H01L2224/05599 , H01L2224/29099 , H01L2224/29599
摘要： An apparatus and method for enhancing the formation of fillets around the periphery of assembled wafer-level chip scale packages when mounted onto substrates. The method includes fabricating a plurality of integrated circuit die on a first surface of a semiconductor wafer, each of the integrated circuit die being separated by scribe lines on the wafer. Once the circuitry has been fabricated, grooves are formed along the scribe lines on the first surface of the semiconductor wafer. The first surface of the semiconductor wafer is then covered with a layer of underfill material, including within the grooves formed along the scribe lines on the first surface of the semiconductor wafer. After the wafer is singulated, the resulting die includes a first top surface and a second bottom surface and four side surfaces. Integrated circuitry is formed on the first surface of the die. Recess regions created by cutting the grooves are formed on all four side surfaces of the die and filled with the underfill material. When the die is mounted to a substrate, the additional underfill material in the recess regions helps form more robust fillets than otherwise possible.
摘要翻译：一种用于在安装到基板上时增强组装的晶片级芯片级封装周围的圆角形成的装置和方法。该方法包括在半导体晶片的第一表面上制造多个集成电路管芯，每个集成电路管芯由晶片上的划线分开。一旦电路被制造，沿着半导体晶片的第一表面上的划线形成凹槽。然后，半导体晶片的第一表面被一层底层填充材料覆盖，包括在沿着半导体晶片的第一表面上的划线形成的凹槽内。在晶片被切割之后，所得模具包括第一顶表面和第二底表面以及四个侧表面。集成电路形成在模具的第一表面上。通过切割凹槽产生的凹陷区域形成在模具的所有四个侧表面上并填充有底部填充材料。当模具安装到基板上时，凹槽区域中的额外的底部填充材料有助于形成比其他可能的更坚固的圆角。

13. 发明授权

US08324602B2 Optical sensors that reduce specular reflections 有权
标题翻译：减少镜面反射的光学传感器
公开(公告)号：US08324602B2
公开(公告)日：2012-12-04
申请号：US12643831
申请日：2009-12-21
申请人： Lynn K. Wiese , Nikhil Kelkar , Viraj Patwardhan
发明人： Lynn K. Wiese , Nikhil Kelkar , Viraj Patwardhan
IPC分类号： G02B27/00 , H01J40/14
CPC分类号： H01L25/167 , H01L31/02325 , H01L2224/49171 , H01L2924/3011 , H01L2924/00
摘要： An optical sensor device, according to an embodiment of the present invention, includes a light source and a light detector. The light source includes one or more light emitting elements, and the light detector includes one or more light detecting elements. A first opaque light barrier portion, between the light source and the light detector, is configured to block light from being transmitted directly from the light source to the light detector. A second opaque light barrier portion, extending from the first opaque light barrier portion in a direction towards the light source, is configured to reduce an amount of specular reflections that would occur if a light transmissive cover plate were placed over the optical sensor device. A third opaque light barrier portion, extending from the first light barrier portion in a direction towards to the light detector, is configured to reduce an amount of specular reflections that would be detected by the light detector, if a light transmissive cover plate were placed over the optical sensor device.
摘要翻译：根据本发明的实施例的光学传感器装置包括光源和光检测器。光源包括一个或多个发光元件，并且光检测器包括一个或多个光检测元件。在光源和光检测器之间的第一不透明光阻挡部分被配置为阻止光直接从光源传输到光检测器。第二不透明光阻挡部分从第一不透明光阻挡部分朝向光源的方向延伸，被配置为减少如果透光盖板放置在光学传感器装置上方将会发生的镜面反射量。第三不透明光阻挡部分从第一光阻挡部分朝向光检测器的方向延伸，被配置为减少光检测器将检测到的镜面反射量，如果透光盖板放置在光学传感器装置。

14. 发明申请

US20100276701A1 LOW THERMAL RESISTANCE AND ROBUST CHIP-SCALE-PACKAGE (CSP), STRUCTURE AND METHOD 审中-公开
标题翻译：低耐热性和稳定的芯片尺寸封装（CSP），结构和方法
公开(公告)号：US20100276701A1
公开(公告)日：2010-11-04
申请号：US12612616
申请日：2009-11-04
申请人： François Hébert , Nikhil Kelkar
发明人： François Hébert , Nikhil Kelkar
IPC分类号： H01L29/26 , H01L21/00
CPC分类号： H01L23/3114 , H01L23/3732 , H01L29/0657 , H01L2224/0554 , H01L2224/05568 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/056 , H01L2224/16 , H01L2924/00014 , H01L2924/0102 , H01L2924/10158 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A chip scale package (CSP) semiconductor device can include a semiconductor layer, circuitry on an active surface of the semiconductor layer, and a diamond layer on a back side of the semiconductor layer. The diamond layer can provide an efficient heat sink for the semiconductor layer, with a thermal conductivity which can be more than three times greater than the thermal conductivity of copper. Further, a hardness of the diamond layer (up to about 10 times stronger than silicon) can provide effective protection against damage to the exposed semiconductor layer, for example during manufacturing, handling, and use of the CSP device. Thus a thin protective diamond layer can be used, which can result in a very thin CSP package design.
摘要翻译：芯片级封装（CSP）半导体器件可以包括半导体层，半导体层的有源表面上的电路和半导体层的背面上的金刚石层。金刚石层可以为半导体层提供有效的散热器，其热导率可以比铜的热导率大三倍以上。此外，例如在CSP器件的制造，处理和使用过程中，金刚石层的硬度（比硅高达约10倍）可以提供有效的保护，以免损坏暴露的半导体层。因此，可以使用薄的保护性金刚石层，这可以导致非常薄的CSP封装设计。

15. 发明授权

US06803648B1 Integrated circuit packages with interconnects on top and bottom surfaces 有权
标题翻译：集成电路封装，在顶部和底部表面具有互连
公开(公告)号：US06803648B1
公开(公告)日：2004-10-12
申请号：US10341328
申请日：2003-01-10
申请人： Nikhil Kelkar , Neeraj Anil Pendse
发明人： Nikhil Kelkar , Neeraj Anil Pendse
IPC分类号： H01L23495
CPC分类号： H01L23/3107 , H01L23/49551 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/05624 , H01L2224/45099 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73207 , H01L2224/8547 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： Semiconductor device packages having top and bottom interconnecting surfaces that can be connected to external electrical systems are described. These packages include internal contact leads that are bent such that they extend from a top surface to a bottom surface of the package and thereby form the corresponding interconnecting surfaces. In some embodiments, a solder ball is formed on either the top or bottom portion of the contact leads so that the solder balls form one of the contact surfaces of the package.
摘要翻译：描述具有可连接到外部电气系统的顶部和底部互连表面的半导体器件封装。这些包装包括弯曲的内部接触引线，使得它们从包装的顶表面延伸到底表面，从而形成相应的互连表面。在一些实施例中，焊接球形成在接触引线的顶部或底部上，使得焊球形成封装的接触表面之一。

16. 发明授权

US06566762B1 Front side coating for bump devices 有权
公开(公告)号：US06566762B1
公开(公告)日：2003-05-20
申请号：US10235058
申请日：2002-09-04
申请人： Mark Harrison Baker , Nikhil Kelkar
发明人： Mark Harrison Baker , Nikhil Kelkar
IPC分类号： H01L2940
CPC分类号： H01L24/11 , H01L24/02 , H01L2224/0401 , H01L2224/05571 , H01L2224/131 , H01L2224/13144 , H01L2224/16 , H01L2924/00013 , H01L2924/0002 , H01L2924/01013 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/15311 , H01L2924/351 , H01L2924/00014 , H01L2224/13099 , H01L2224/05552 , H01L2924/00
摘要： Flip chips with improved solder bump strength are provided. A solder mask layer is placed and patterned on a front side of a wafer of semiconductor chips with semiconductor devices and bond pads. The solder mask is patterned to expose the bond pads. Solder bumps are electrically connected to the bond pads. The solder mask is thick enough to extend up to at least a quarter of the solder bumps and is in contact with the solder bumps. The wafer is then cut into individual chips. The chips may be sold to customers, who may mount the chip on a substrate without underfill.

17. 发明授权

US09717146B2 Circuit module such as a high-density lead frame array (HDA) power module, and method of making same 有权
公开(公告)号：US09717146B2
公开(公告)日：2017-07-25
申请号：US13536827
申请日：2012-06-28
申请人： Jian Yin , Nikhil Kelkar , Loyde M. Carpenter, Jr. , Nattorn Pongratananukul , Patrick J. Selby , Steven R. Rivet , Michael W. Althar
发明人： Jian Yin , Nikhil Kelkar , Loyde M. Carpenter, Jr. , Nattorn Pongratananukul , Patrick J. Selby , Steven R. Rivet , Michael W. Althar
IPC分类号： H05K1/18 , H01L23/49 , H01L25/16 , H01L23/498 , H01L23/00
CPC分类号： H05K1/18 , H01L23/49861 , H01L24/48 , H01L24/49 , H01L24/85 , H01L25/16 , H01L2224/0603 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/49111 , H01L2224/49171 , H01L2224/85444 , H01L2924/00014 , H01L2924/13091 , H01L2924/181 , H01L2924/19105 , H01L2924/19107 , H01L2924/00 , H01L2224/45099 , H01L2924/00012
摘要： A circuit module includes a plurality of electronic components and a single-layer conductive package substrate. The single-layer conductive package substrate is adapted to physically support and electrically interconnect the electronic components. The substrate has a peripheral portion and an interior portion. The peripheral portion includes a plurality of peripheral contact pads coupled to corresponding electronic components. The interior portion includes a plurality of floating contact pads that are electrically isolated from the peripheral contact pads and are coupled to corresponding electronic components.

18. 发明授权

US08508052B2 Stacked power converter structure and method 有权
标题翻译：堆叠式电源转换器结构及方法
公开(公告)号：US08508052B2
公开(公告)日：2013-08-13
申请号：US13048165
申请日：2011-03-15
申请人： David B. Bell , Francois Hebert , Nikhil Kelkar
发明人： David B. Bell , Francois Hebert , Nikhil Kelkar
IPC分类号： H01L23/538 , H01L23/34 , H01L23/48 , H01L23/488
CPC分类号： H01L27/088 , H01L21/26513 , H01L21/823437 , H01L21/823487 , H01L23/535 , H01L23/62 , H01L29/0619 , H01L29/0692 , H01L29/0696 , H01L29/1083 , H01L29/1095 , H01L29/402 , H01L29/4175 , H01L29/41766 , H01L29/41775 , H01L29/456 , H01L29/66659 , H01L29/66681 , H01L29/66696 , H01L29/66712 , H01L29/66734 , H01L29/7802 , H01L29/7806 , H01L29/7811 , H01L29/7813 , H01L29/7816 , H01L29/7835 , H01L2224/48137 , H01L2224/48247 , H01L2224/49171 , H01L2924/12032 , H01L2924/1305 , H01L2924/13055 , H01L2924/13062 , H01L2924/13091 , H01L2924/1461 , H01L2924/30107 , H01L2924/3025 , H02M7/003 , H01L2924/00
摘要： A power converter can include an output circuit having a high-side device and a low-side device which can be formed on a single die (a “PowerDie”). The power converter can further include a controller integrated circuit (IC) formed on a different die which can be electrically coupled to, and co-packaged with, the PowerDie. The PowerDie can be attached to a die pad of a leadframe, and the controller IC die can be attached to an active surface of the first die such that the first die is interposed between the controller IC die and the die pad.
摘要翻译：功率转换器可以包括具有可形成在单个管芯（“PowerDie”）上的高侧器件和低侧器件的输出电路。功率转换器还可以包括形成在不同管芯上的控制器集成电路（IC），其可以与PowerDie电耦合并与其一体化。 PowerDie可以附接到引线框架的管芯焊盘，并且控制器IC管芯可以附接到第一管芯的有源表面，使得第一管芯插在控制器IC管芯和管芯焊盘之间。

19. 发明授权

US08232541B2 Optical sensors that reduce specular reflections 有权
标题翻译：减少镜面反射的光学传感器
公开(公告)号：US08232541B2
公开(公告)日：2012-07-31
申请号：US12499723
申请日：2009-07-08
申请人： Lynn K. Wiese , Nikhil Kelkar , Viraj Patwardhan
发明人： Lynn K. Wiese , Nikhil Kelkar , Viraj Patwardhan
IPC分类号： G02B27/00 , H01J40/14
CPC分类号： H01L25/167 , H01L33/58 , H01L2224/49171
摘要： An optical sensor device comprises a light source, a light detector, and an opaque light barrier including a first portion to block light from being transmitted directly from the source to the detector. A second portion of the light barrier extends from the first portion in a direction towards the light source, such that a portion of the second portion covers at least a portion of light emitting element(s) of the source, to reduce an amount of specular reflections, if a light transmissive cover plate were placed over the sensor. Additionally, a third portion of the barrier can extend from the first portion, in a direction towards to the detector, such that a portion of the third portion covers at least a portion of light detecting element(s) of the detector, to reduce an amount of specular reflections that would be detected by the detecting element(s) of the detector, if a light transmissive cover plate were placed over the sensor. Additionally, an off-centered lens can cover a portion of the light source.
摘要翻译：光学传感器装置包括光源，光检测器和不透明光栅，其包括第一部分，以阻止光从源直接传输到检测器。光栅的第二部分从第一部分朝向光源的方向延伸，使得第二部分的一部分覆盖源的发光元件的至少一部分，以减少镜面的量如果将透光盖板放置在传感器上方，则会产生反射。此外，屏障的第三部分可以从朝向检测器的方向从第一部分延伸，使得第三部分的一部分覆盖检测器的光检测元件的至少一部分，以减少如果将透光盖板放置在传感器上方，则由检测器的检测元件检测到的镜面反射量。此外，偏心透镜可以覆盖光源的一部分。

20. 发明申请

US20110163434A1 STACKED POWER CONVERTER STRUCTURE AND METHOD 有权
标题翻译：堆叠式电力转换器结构与方法
公开(公告)号：US20110163434A1
公开(公告)日：2011-07-07
申请号：US13048165
申请日：2011-03-15
申请人： David B. Bell , Francois Hebert , Nikhil Kelkar
发明人： David B. Bell , Francois Hebert , Nikhil Kelkar
IPC分类号： H01L23/495 , H01L23/52
CPC分类号： H01L27/088 , H01L21/26513 , H01L21/823437 , H01L21/823487 , H01L23/535 , H01L23/62 , H01L29/0619 , H01L29/0692 , H01L29/0696 , H01L29/1083 , H01L29/1095 , H01L29/402 , H01L29/4175 , H01L29/41766 , H01L29/41775 , H01L29/456 , H01L29/66659 , H01L29/66681 , H01L29/66696 , H01L29/66712 , H01L29/66734 , H01L29/7802 , H01L29/7806 , H01L29/7811 , H01L29/7813 , H01L29/7816 , H01L29/7835 , H01L2224/48137 , H01L2224/48247 , H01L2224/49171 , H01L2924/12032 , H01L2924/1305 , H01L2924/13055 , H01L2924/13062 , H01L2924/13091 , H01L2924/1461 , H01L2924/30107 , H01L2924/3025 , H02M7/003 , H01L2924/00
摘要： A power converter can include an output circuit having a high-side device and a low-side device which can be formed on a single die (a “PowerDie”). The power converter can further include a controller integrated circuit (IC) formed on a different die which can be electrically coupled to, and co-packaged with, the PowerDie. The PowerDie can be attached to a die pad of a leadframe, and the controller IC die can be attached to an active surface of the first die such that the first die is interposed between the controller IC die and the die pad.
摘要翻译：功率转换器可以包括具有可形成在单个管芯（“PowerDie”）上的高侧器件和低侧器件的输出电路。功率转换器还可以包括形成在不同管芯上的控制器集成电路（IC），其可以与PowerDie电耦合并与其一体化。 PowerDie可以附接到引线框架的管芯焊盘，并且控制器IC管芯可以附接到第一管芯的有源表面，使得第一管芯插在控制器IC管芯和管芯焊盘之间。

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