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1. 发明授权

US08232541B2 Optical sensors that reduce specular reflections 有权
标题翻译：减少镜面反射的光学传感器
公开(公告)号：US08232541B2
公开(公告)日：2012-07-31
申请号：US12499723
申请日：2009-07-08
申请人： Lynn K. Wiese , Nikhil Kelkar , Viraj Patwardhan
发明人： Lynn K. Wiese , Nikhil Kelkar , Viraj Patwardhan
IPC分类号： G02B27/00 , H01J40/14
CPC分类号： H01L25/167 , H01L33/58 , H01L2224/49171
摘要： An optical sensor device comprises a light source, a light detector, and an opaque light barrier including a first portion to block light from being transmitted directly from the source to the detector. A second portion of the light barrier extends from the first portion in a direction towards the light source, such that a portion of the second portion covers at least a portion of light emitting element(s) of the source, to reduce an amount of specular reflections, if a light transmissive cover plate were placed over the sensor. Additionally, a third portion of the barrier can extend from the first portion, in a direction towards to the detector, such that a portion of the third portion covers at least a portion of light detecting element(s) of the detector, to reduce an amount of specular reflections that would be detected by the detecting element(s) of the detector, if a light transmissive cover plate were placed over the sensor. Additionally, an off-centered lens can cover a portion of the light source.
摘要翻译：光学传感器装置包括光源，光检测器和不透明光栅，其包括第一部分，以阻止光从源直接传输到检测器。光栅的第二部分从第一部分朝向光源的方向延伸，使得第二部分的一部分覆盖源的发光元件的至少一部分，以减少镜面的量如果将透光盖板放置在传感器上方，则会产生反射。此外，屏障的第三部分可以从朝向检测器的方向从第一部分延伸，使得第三部分的一部分覆盖检测器的光检测元件的至少一部分，以减少如果将透光盖板放置在传感器上方，则由检测器的检测元件检测到的镜面反射量。此外，偏心透镜可以覆盖光源的一部分。

2. 发明申请

US20100258710A1 OPTICAL SENSORS THAT REDUCE SPECTRAL REFLECTIONS 有权
标题翻译：减少光谱反射的光学传感器
公开(公告)号：US20100258710A1
公开(公告)日：2010-10-14
申请号：US12643831
申请日：2009-12-21
申请人： Lynn K. Wiese , Nikhil Kelkar , Viraj Patwardhan
发明人： Lynn K. Wiese , Nikhil Kelkar , Viraj Patwardhan
IPC分类号： H01L31/12 , H01L27/14 , H01L31/0232 , H01L21/50 , H01L31/18
CPC分类号： H01L25/167 , H01L31/02325 , H01L2224/49171 , H01L2924/3011 , H01L2924/00
摘要： An optical sensor device, according to an embodiment of the present invention, includes a light source and a light detector. The light source includes one or more light emitting elements, and the light detector includes one or more light detecting elements. A first opaque light barrier portion, between the light source and the light detector, is configured to block light from being transmitted directly from the light source to the light detector. A second opaque light barrier portion, extending from the first opaque light barrier portion in a direction towards the light source, is configured to reduce an amount of specular reflections that would occur if a light transmissive cover plate were placed over the optical sensor device. A third opaque light barrier portion, extending from the first light barrier portion in a direction towards to the light detector, is configured to reduce an amount of specular reflections that would be detected by the light detector, if a light transmissive cover plate were placed over the optical sensor device.
摘要翻译：根据本发明的实施例的光学传感器装置包括光源和光检测器。光源包括一个或多个发光元件，并且光检测器包括一个或多个光检测元件。在光源和光检测器之间的第一不透明光阻挡部分被配置为阻止光直接从光源传输到光检测器。第二不透明光阻挡部分从第一不透明光阻挡部分朝向光源的方向延伸，被配置为减少如果透光盖板放置在光学传感器装置上方将会发生的镜面反射量。第三不透明光阻挡部分从第一光阻挡部分朝向光检测器的方向延伸，被配置为减少光检测器将检测到的镜面反射量，如果透光盖板放置在光学传感器装置。

3. 发明申请

US20100259766A1 OPTICAL SENSORS AND METHODS FOR PROVIDING OPTICAL SENSORS 审中-公开
标题翻译：光传感器及其提供光传感器的方法
公开(公告)号：US20100259766A1
公开(公告)日：2010-10-14
申请号：US12499693
申请日：2009-07-08
申请人： Lynn K. Wiese , Nikhil Kelkar , Viraj Patwardhan
发明人： Lynn K. Wiese , Nikhil Kelkar , Viraj Patwardhan
IPC分类号： G01B11/14 , B23K26/38
CPC分类号： H01L25/167 , H01L33/58 , H01L2224/49171
摘要： Provided herein are optical sensor devices, methods for making the same, and systems including the same. An optical sensor device, according to an embodiment, includes a light detector die and a light source die attached to the same or different die attachment substrates so that there is a space between the light source die and the light detector die. A light transmissive material covers the light detector die, the light source die and at least a portion of the space between the light detector die and the light source die. A groove is formed (e.g., saw, blade or laser cut, or cast) in the light transmissive material between the light detector die and the light source die, and an opaque material is put within the groove to provide a light barrier between the light detector die and the light source die.
摘要翻译：本文提供了光学传感器装置及其制造方法，以及包括该传感器装置的系统。根据实施例的光学传感器装置包括光检测器管芯和附接到相同或不同的管芯附接衬底的光源管芯，使得在光源管芯和光检测器管芯之间存在空间。透光材料覆盖光检测器管芯，光源管芯和光检测器管芯与光源管芯之间的至少一部分空间。在光检测器管芯和光源管芯之间的透光材料中形成凹槽（例如，锯，刀片或激光切割或铸造），并且将不透明材料放置在凹槽内以在光线之间提供光屏障检测器管芯和光源管芯。

4. 发明授权

US08324602B2 Optical sensors that reduce specular reflections 有权
标题翻译：减少镜面反射的光学传感器
公开(公告)号：US08324602B2
公开(公告)日：2012-12-04
申请号：US12643831
申请日：2009-12-21
申请人： Lynn K. Wiese , Nikhil Kelkar , Viraj Patwardhan
发明人： Lynn K. Wiese , Nikhil Kelkar , Viraj Patwardhan
IPC分类号： G02B27/00 , H01J40/14
CPC分类号： H01L25/167 , H01L31/02325 , H01L2224/49171 , H01L2924/3011 , H01L2924/00
摘要： An optical sensor device, according to an embodiment of the present invention, includes a light source and a light detector. The light source includes one or more light emitting elements, and the light detector includes one or more light detecting elements. A first opaque light barrier portion, between the light source and the light detector, is configured to block light from being transmitted directly from the light source to the light detector. A second opaque light barrier portion, extending from the first opaque light barrier portion in a direction towards the light source, is configured to reduce an amount of specular reflections that would occur if a light transmissive cover plate were placed over the optical sensor device. A third opaque light barrier portion, extending from the first light barrier portion in a direction towards to the light detector, is configured to reduce an amount of specular reflections that would be detected by the light detector, if a light transmissive cover plate were placed over the optical sensor device.
摘要翻译：根据本发明的实施例的光学传感器装置包括光源和光检测器。光源包括一个或多个发光元件，并且光检测器包括一个或多个光检测元件。在光源和光检测器之间的第一不透明光阻挡部分被配置为阻止光直接从光源传输到光检测器。第二不透明光阻挡部分从第一不透明光阻挡部分朝向光源的方向延伸，被配置为减少如果透光盖板放置在光学传感器装置上方将会发生的镜面反射量。第三不透明光阻挡部分从第一光阻挡部分朝向光检测器的方向延伸，被配置为减少光检测器将检测到的镜面反射量，如果透光盖板放置在光学传感器装置。

5. 发明申请

US20100258712A1 OPTICAL SENSORS THAT REDUCE SPECTRAL REFLECTIONS 有权
标题翻译：减少光谱反射的光学传感器
公开(公告)号：US20100258712A1
公开(公告)日：2010-10-14
申请号：US12499723
申请日：2009-07-08
申请人： Lynn K. Wiese , Nikhil Kelkar , Viraj Patwardhan
发明人： Lynn K. Wiese , Nikhil Kelkar , Viraj Patwardhan
IPC分类号： H01L31/0232 , H01L33/00 , H01L21/00
CPC分类号： H01L25/167 , H01L33/58 , H01L2224/49171
摘要： An optical sensor device comprises a light source, a light detector, and an opaque light barrier including a first portion to block light from being transmitted directly from the source to the detector. A second portion of the light barrier extends from the first portion in a direction towards the light source, such that a portion of the second portion covers at least a portion of light emitting element(s) of the source, to reduce an amount of specular reflections, if a light transmissive cover plate were placed over the sensor. Additionally, a third portion of the barrier can extend from the first portion, in a direction towards to the detector, such that a portion of the third portion covers at least a portion of light detecting element(s) of the detector, to reduce an amount of specular reflections that would be detected by the detecting element(s) of the detector, if a light transmissive cover plate were placed over the sensor. Additionally, an off-centered lens can cover a portion of the light source.
摘要翻译：光学传感器装置包括光源，光检测器和不透明光栅，其包括第一部分，以阻止光从源直接传输到检测器。光栅的第二部分从第一部分朝向光源的方向延伸，使得第二部分的一部分覆盖源的发光元件的至少一部分，以减少镜面的量如果将透光盖板放置在传感器上方，则会产生反射。此外，屏障的第三部分可以从朝向检测器的方向从第一部分延伸，使得第三部分的一部分覆盖检测器的光检测元件的至少一部分，以减少如果将透光盖板放置在传感器上方，则由检测器的检测元件检测到的镜面反射量。此外，偏心透镜可以覆盖光源的一部分。

6. 发明申请

US20090057897A1 High strength solder joint formation method for wafer level packages and flip applications 有权
公开(公告)号：US20090057897A1
公开(公告)日：2009-03-05
申请号：US11897971
申请日：2007-08-30
申请人： Viraj Patwardhan , Hau Nguyen
发明人： Viraj Patwardhan , Hau Nguyen
IPC分类号： H01L23/488 , B23K31/02 , H01L21/60
CPC分类号： B23K1/0016 , B23K2101/40 , H01L24/11 , H01L24/13 , H01L2224/13099 , H01L2224/13561 , H01L2224/13575 , H01L2224/16 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H05K3/3436 , H05K2201/0212 , H05K2201/0221 , Y02P70/613
摘要： A Micro SMDxt package is provided that configured for mounting to a circuit board. The SMDxt package includes a silicon-based IC having an array of contact pads on one side of thereof, and a die electrically attached to the silicon-based IC. A plurality of solder balls is included, each of which has a polymeric core surrounded by a metallic shell that in turn is surrounded by a layer of solder material. Further, each solder ball is positioned in contact with a corresponding contact pad of the package. An intertwined intermetallic fusion layer is formed through the fusion between material components of the contact pads and the solder material, via heat treatment. The intermetallic fusion extends between and from an outer surface of the metallic shell of each solder to an outer surface of a corresponding contact pad to form a high strength intermetallic solder joint therebetween.

7. 发明授权

US07674702B1 Solder bump formation in electronics packaging 有权
标题翻译：电子封装中的焊点形成
公开(公告)号：US07674702B1
公开(公告)日：2010-03-09
申请号：US12104362
申请日：2008-04-16
申请人： Viraj Patwardhan , Nikhil V. Kelkar
发明人： Viraj Patwardhan , Nikhil V. Kelkar
IPC分类号： H01L21/44
CPC分类号： H01L24/13 , H01L24/11 , H01L24/16 , H01L2224/0554 , H01L2224/05572 , H01L2224/05573 , H01L2224/056 , H01L2224/11011 , H01L2224/1132 , H01L2224/11334 , H01L2224/11472 , H01L2224/11901 , H01L2224/13099 , H01L2224/131 , H01L2924/0001 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01033 , H01L2924/014 , H01L2924/14 , H01L2224/29099 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A polymer stencil is applied to the active surface of a wafer. The stencil has openings that at least partially overlay associated metallization pads on the wafer and divider strips positioned between adjacent openings. The divider strips are arranged to overlay portions of associated metallization pads so that at least two adjacent openings overlay portions of each metallization pad. After the stencil has been positioned, a solder paste is applied to the stencil openings. The solder paste may then be reflowed with the polymer stencil remaining in place. The solder naturally creeps under the stencil so that unitary solder bumps are formed on each metallization pad. The described methods and arrangements can be used to create low profile solder bumps that are not attainable using conventional solder bump formation techniques.
摘要翻译：将聚合物模板施加到晶片的有效表面。模板具有至少部分地覆盖晶片上相关联的金属化焊盘并且位于相邻开口之间的分隔条的开口。分隔带布置成覆盖相关联的金属化焊盘的部分，使得至少两个相邻的开口覆盖每个金属化焊盘的部分。在模板定位之后，将焊膏施加到模版孔。然后可以将聚合物模板保留在适当位置来回流焊膏。焊料自然地在模板下爬行，使得在每个金属化焊盘上形成单一的焊料凸块。所描述的方法和布置可以用于产生使用常规的焊料凸块形成技术不可获得的低轮廓焊料凸块。

8. 发明授权

US07629246B2 High strength solder joint formation method for wafer level packages and flip applications 有权
标题翻译：用于晶片级封装和翻转应用的高强度焊点形成方法
公开(公告)号：US07629246B2
公开(公告)日：2009-12-08
申请号：US11897971
申请日：2007-08-30
申请人： Viraj Patwardhan , Hau Nguyen
发明人： Viraj Patwardhan , Hau Nguyen
IPC分类号： H01L21/44
CPC分类号： B23K1/0016 , B23K2101/40 , H01L24/11 , H01L24/13 , H01L2224/13099 , H01L2224/13561 , H01L2224/13575 , H01L2224/16 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H05K3/3436 , H05K2201/0212 , H05K2201/0221 , Y02P70/613
摘要： A Micro SMDxt package is provided that configured for mounting to a circuit board. The SMDxt package includes a silicon-based IC having an array of contact pads on one side of thereof, and a die electrically attached to the silicon-based IC. A plurality of solder balls is included, each of which has a polymeric core surrounded by a metallic shell that in turn is surrounded by a layer of solder material. Further, each solder ball is positioned in contact with a corresponding contact pad of the package. An intertwined intermetallic fusion layer is formed through the fusion between material components of the contact pads and the solder material, via heat treatment. The intermetallic fusion extends between and from an outer surface of the metallic shell of each solder to an outer surface of a corresponding contact pad to form a high strength intermetallic solder joint therebetween.
摘要翻译：提供了一个Micro SMDxt封装，用于安装到电路板上。 SMDxt封装包括其一侧具有接触焊盘阵列的硅基IC，以及电连接到硅基IC的管芯。包括多个焊球，每个焊球具有由金属壳包围的聚合物芯，该金属壳又由一层焊料材料包围。此外，每个焊球定位成与封装的对应接触焊盘接触。通过热处理，通过接触焊盘的材料部件和焊料材料之间的熔合形成交织的金属间熔融层。金属间熔融物在每个焊料的金属壳的外表面之间和从相应的接触焊盘的外表面延伸，以在它们之间形成高强度的金属间焊料接头。

9. 发明授权

US07838991B1 Metallurgy for copper plated wafers 有权
标题翻译：镀铜晶圆的冶金
公开(公告)号：US07838991B1
公开(公告)日：2010-11-23
申请号：US11671422
申请日：2007-02-05
申请人： Shahram Mostafazadeh , Viraj Patwardhan
发明人： Shahram Mostafazadeh , Viraj Patwardhan
IPC分类号： H01L23/48
CPC分类号： H01L24/03 , H01L22/32 , H01L24/05 , H01L24/13 , H01L2224/03462 , H01L2224/0391 , H01L2224/0401 , H01L2224/05007 , H01L2224/05016 , H01L2224/05022 , H01L2224/05124 , H01L2224/05147 , H01L2224/05166 , H01L2224/05572 , H01L2224/05583 , H01L2224/05647 , H01L2224/131 , H01L2924/00013 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/014 , H01L2924/05042 , H01L2924/14 , H01L2924/181 , H01L2924/00014 , H01L2224/13099 , H01L2224/05099 , H01L2224/13599 , H01L2224/05599 , H01L2224/29099 , H01L2224/29599 , H01L2224/05552 , H01L2924/00
摘要： Improved protective metallization is described for bumped copper-top semiconductor chips. The semiconductor device includes a top wafer fabrication passivation layer with openings through which contact pads are exposed. A patterned copper layer is formed over the passivation layer and is electrically coupled to the contact pads through the openings. A metallic barrier layer is provided between the contact pads and the patterned copper layer. A titanium metallization layer overlies the patterned copper layer and cooperates with the barrier layer to envelop the copper layer in the regions of the contact pads. An aluminum metallization layer overlies the titanium metallization layer. An electrically insulating protective layer overlies the aluminum metallization and passivation layers. The protective layer includes openings in which underbump metallization stacks are formed. Each underbump metallization stack electrically connects to the aluminum metallization layer through an opening in the protective layer. Solder bumps adhere to the underbump metallization stacks.
摘要翻译：对于凸起的铜顶半导体芯片描述了改进的保护性金属化。半导体器件包括具有开口的顶部晶片制造钝化层，接触焊盘通过该开口露出。图案化的铜层形成在钝化层之上，并且通过开口电耦合到接触焊盘。金属阻挡层设置在接触焊盘和图案化铜层之间。钛金属化层覆盖在图案化的铜层上，并与阻挡层配合以包围接触焊盘区域中的铜层。铝金属化层覆盖在钛金属化层上。电绝缘保护层覆盖在铝金属化和钝化层上。保护层包括其中形成有下凸块金属化叠层的开口。每个底部浸渍金属化叠层通过保护层中的开口与铝金属化层电连接。焊接凸块粘附在底部金属叠层上。

10. 发明授权

US07375431B1 Solder bump formation in electronics packaging 有权
标题翻译：电子封装中的焊点形成
公开(公告)号：US07375431B1
公开(公告)日：2008-05-20
申请号：US11084447
申请日：2005-03-18
申请人： Viraj Patwardhan , Nikhil V. Kelkar
发明人： Viraj Patwardhan , Nikhil V. Kelkar
IPC分类号： H01L23/48
CPC分类号： H01L24/13 , H01L24/11 , H01L24/16 , H01L2224/0554 , H01L2224/05572 , H01L2224/05573 , H01L2224/056 , H01L2224/11011 , H01L2224/1132 , H01L2224/11334 , H01L2224/11472 , H01L2224/11901 , H01L2224/13099 , H01L2224/131 , H01L2924/0001 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01033 , H01L2924/014 , H01L2924/14 , H01L2224/29099 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A polymer stencil is applied to the active surface of a wafer. The stencil has openings that at least partially overlay associated metallization pads on the wafer and divider strips positioned between adjacent openings. The divider strips are arranged to overlay portions of associated metallization pads so that at least two adjacent openings overlay portions of each metallization pad. After the stencil has been positioned, a solder paste is applied to the stencil openings. The solder paste may then be reflowed with the polymer stencil remaining in place. The solder naturally creeps under the stencil so that unitary solder bumps are formed on each metallization pad. The described methods and arrangements can be used to create low profile solder bumps that are not attainable using conventional solder bump formation techniques.
摘要翻译：将聚合物模板施加到晶片的有效表面。模板具有至少部分地覆盖晶片上相关联的金属化焊盘并且位于相邻开口之间的分隔条的开口。分隔带布置成覆盖相关联的金属化焊盘的部分，使得至少两个相邻的开口覆盖每个金属化焊盘的部分。在模板定位之后，将焊膏施加到模版孔。然后可以将聚合物模板保留在适当位置来回流焊膏。焊料自然地在模板下爬行，使得在每个金属化焊盘上形成单一的焊料凸块。所描述的方法和布置可以用于产生使用常规的焊料凸块形成技术不可获得的低轮廓焊料凸块。

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