会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 13. 发明授权
    • Front-end device of set-top box for two-way communication
    • 机顶盒前端设备进行双向通信
    • US07757263B2
    • 2010-07-13
    • US11374743
    • 2006-03-14
    • Akihiro TatsutaYutaka YamadaTomonori Shiomi
    • Akihiro TatsutaYutaka YamadaTomonori Shiomi
    • H04N7/16
    • H04N21/6168H04N7/102H04N21/42607H04N21/42676H04N21/6118
    • The device includes a cable interface module having a diplexer that outputs a first signal input from a first connector part connected to a cable television network to a third connector part and outputs a second signal input from a second connector part to a first connector part; a video tuner module having a distributor that branches a first signal input from a fourth connector part having a shape capable of connecting to the cable television network and connected to a third connector part and outputs to a fifth connector part, and inputs the other branched signal into a video tuner; and a communication tuner that selects another channel of the signal output from a fifth connector part.
    • 所述装置包括具有双工器的电缆接口模块,所述双工器将从连接到有线电视网络的第一连接器部分输入的第一信号输出到第三连接器部分,并将从第二连接器部分输入的第二信号输出到第一连接器部分; 一个视频调谐器模块,具有一个分配器,该分配器将从具有连接到有线电视网络的形状的第四连接器部分输入的第一信号分支并连接到第三连接器部分并输出到第五连接器部分,并输入另一分支信号 进入视频调谐器; 以及通信调谐器,其选择从第五连接器部分输出的信号的另一信道。
    • 14. 发明授权
    • Method of manufacturing semiconductor device
    • 制造半导体器件的方法
    • US07655569B2
    • 2010-02-02
    • US12020761
    • 2008-01-28
    • Yuichi InabaYutaka YamadaShigehiro Morikawa
    • Yuichi InabaYutaka YamadaShigehiro Morikawa
    • H01L21/311
    • H01L27/115H01L29/42324H01L29/66825H01L29/7881
    • The invention prevents a wiring layer in a memory region from being exposed to prevent a change in wire resistance and degradation of reliability. A SiO2 film as an etching stopper film which transmits ultraviolet light is formed on pad electrodes and an interlayer insulation film. Then, the SiO2 film on the pad electrodes is etched selectively and the SiO2 film in an EPROM region is left. A silicon nitride film and a polyimide film are then formed on the SiO2 film and on the pad electrodes where the SiO2 film is removed, as a protection film which does not transmit ultraviolet light. The silicon nitride film and the polyimide film on the pad electrodes and in the EPROM region are then selectively removed by etching. Since the SiO2 film functions as an etching stopper at this time, the interlayer insulation film under the SiO2 film is prevented from being etched and a control gate line metal layer is prevented from being exposed.
    • 本发明防止存储区域中的布线层暴露,以防止电线电阻的变化和可靠性的劣化。 在焊盘电极和层间绝缘膜上形成作为透射紫外光的蚀刻停止膜的SiO 2膜。 然后,选择性地蚀刻焊盘电极上的SiO 2膜,并且留下EPROM区域中的SiO 2膜。 然后在SiO 2膜上除去SiO 2膜的焊盘电极上形成氮化硅膜和聚酰亚胺膜作为不透射紫外线的保护膜。 然后通过蚀刻选择性地去除焊盘电极和EPROM区域中的氮化硅膜和聚酰亚胺膜。 由于SiO 2膜此时用作蚀刻阻挡层,因此可以防止SiO 2膜下的层间绝缘膜被蚀刻,防止控制栅线金属层露出。
    • 20. 发明申请
    • Method for fabricating a semiconductor device
    • 半导体器件的制造方法
    • US20060033054A1
    • 2006-02-16
    • US11253558
    • 2005-10-20
    • Yutaka Yamada
    • Yutaka Yamada
    • G01J3/10
    • H01L21/6835H01L21/6836H01L21/78H01L2221/68327H01L2221/68354Y10S438/977Y10T29/41Y10T29/5102Y10T29/5193
    • A method of fabricating a semiconductor device includes the steps of, after sawing a semiconductor substrate into individual semiconductor chips in a state that the semiconductor substrate is covered by an adhesive tape, applying a dry gas to the adhesive tape in a state that the adhesive tape carries thereon the semiconductor chips, applying an infrared radiation to the adhesive tape in a state that the adhesive tape carries thereon the semiconductor chips, and curing the adhesive layer on the adhesive tape in a state that the adhesive tape carries thereon the semiconductor chips, by irradiating a ultraviolet radiation to the adhesive tape, wherein the step of applying the dry gas, the step of applying the infrared radiation and the said step of curing the adhesive layer are conducted substantially simultaneously.
    • 一种制造半导体器件的方法包括以下步骤:在半导体衬底被粘合带覆盖的状态下将半导体衬底切割成单独的半导体芯片之后,在粘合带的状态下将干燥气体施加到粘合带上 在其上承载半导体芯片,在粘合带上携带有半导体芯片的状态下将红外线辐射施加到粘合带上,并且在粘合带上携带有半导体芯片的状态下固化胶带上的粘合剂层,通过 将紫外线辐射照射到胶带上,其中施加干燥气体的步骤,施加红外辐射的步骤和固化粘合剂层的所述步骤基本上同时进行。