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    • 11. 发明授权
    • Method of forming non-volatile memory having floating trap type device
    • 形成具有浮动陷阱型装置的非易失性存储器的方法
    • US06677200B2
    • 2004-01-13
    • US10194182
    • 2002-07-12
    • Chang-Hyun LeeJung-Dal ChoiSung-Hoi Hur
    • Chang-Hyun LeeJung-Dal ChoiSung-Hoi Hur
    • H01L213366
    • H01L29/792H01L21/28282H01L29/66833Y10S438/954
    • A method of forming a non-volatile memory having a floating trap-type device is disclosed in the present invention. In the method, a relatively thick thermal oxide layer is formed at a semiconductor substrate and patterned to leave a thick thermal oxide pattern at a high-voltage region (a high-voltage region defining step). An oxide-nitride-oxide (ONO) layer is formed over substantially the entire surface (the substantial surface) of the semiconductor substrate and patterned to leave an ONO pattern at a cell memory region (a cell memory region defining step). After the high-voltage region defining step and the cell memory region defining step, a thermal oxidizing process is performed with respect to the semiconductor substrate where a low-voltage region is exposed, thereby forming a relatively thin gate insulation layer for a low-voltage type device (a low-voltage region defining region).
    • 在本发明中公开了形成具有浮动陷阱型装置的非易失性存储器的方法。 在该方法中,在半导体衬底上形成相对较厚的热氧化物层,并将其图案化以在高电压区域(高电压区域限定步骤)处留下厚的热氧化物图案。 在半导体衬底的基本上整个表面(基本表面)上形成氧化物 - 氧化物(ONO)层,并将其图案化以在单元存储区(单元存储区定义步骤)处留下ONO图案。 在高电压区域定义步骤和电池存储区域限定步骤之后,对于暴露低电压区域的半导体衬底进行热氧化处理,从而形成用于低电压的较薄的栅极绝缘层 (低电压区域限定区域)。
    • 12. 发明授权
    • Non-volatile memory devices having trenches
    • 具有沟槽的非易失性存储器件
    • US07259421B2
    • 2007-08-21
    • US11020920
    • 2004-12-23
    • Sung-Hoi HurJung-Dal Choi
    • Sung-Hoi HurJung-Dal Choi
    • H01L29/788
    • H01L27/115H01L27/11519H01L27/11521H01L27/11524H01L27/11526H01L27/11529
    • A semiconductor memory device includes a semiconductor substrate having a trench therein. First and second gate patterns are formed on a surface of the substrate adjacent the trench, a respective one of which is on a respective opposing side of the trench. A split source/drain region is formed in the substrate between the first gate pattern and the second gate pattern such that the split source/drain region is divided by the trench. The split source/drain region includes a first source/drain subregion between the first gate pattern and the trench and a second source/drain subregion between the second gate pattern and the trench and spaced apart from the first source/drain subregion. A connecting region is formed in the substrate that extends around the trench from the first source/drain subregion to the second source/drain subregion. Related methods are also discussed.
    • 半导体存储器件包括其中具有沟槽的半导体衬底。 第一和第二栅极图案形成在与沟槽相邻的衬底的表面上,其相应的一个位于沟槽的相应的相对侧上。 在第一栅极图案和第二栅极图案之间的衬底中形成分离源极/漏极区域,使得分离源极/漏极区域被沟槽分开。 分离源极/漏极区域包括在第一栅极图案和沟槽之间的第一源极/漏极子区域和在第二栅极图案和沟槽之间并与第一源极/漏极子区域间隔开的第二源极/漏极子区域。 在从第一源/漏区域到第二源极/漏极子区域的沟槽周围延伸的衬底中形成连接区域。 还讨论了相关方法。
    • 13. 发明申请
    • Non-volatile memory devices having trenches and methods of forming the same
    • 具有沟槽的非易失性存储器件及其形成方法
    • US20060027855A1
    • 2006-02-09
    • US11020920
    • 2004-12-23
    • Sung-Hoi HurJung-Dal Choi
    • Sung-Hoi HurJung-Dal Choi
    • H01L29/788
    • H01L27/115H01L27/11519H01L27/11521H01L27/11524H01L27/11526H01L27/11529
    • A semiconductor memory device includes a semiconductor substrate having a trench therein. First and second gate patterns are formed on a surface of the substrate adjacent the trench, a respective one of which is on a respective opposing side of the trench. A split source/drain region is formed in the substrate between the first gate pattern and the second gate pattern such that the split source/drain region is divided by the trench. The split source/drain region includes a first source/drain subregion between the first gate pattern and the trench and a second source/drain subregion between the second gate pattern and the trench and spaced apart from the first source/drain subregion. A connecting region is formed in the substrate that extends around the trench from the first source/drain subregion to the second source/drain subregion. Related methods are also discussed.
    • 半导体存储器件包括其中具有沟槽的半导体衬底。 第一和第二栅极图案形成在与沟槽相邻的衬底的表面上,其相应的一个位于沟槽的相应的相对侧上。 在第一栅极图案和第二栅极图案之间的衬底中形成分离源极/漏极区域,使得分离源极/漏极区域被沟槽分开。 分离源极/漏极区域包括在第一栅极图案和沟槽之间的第一源极/漏极子区域和在第二栅极图案和沟槽之间并与第一源极/漏极子区域间隔开的第二源极/漏极子区域。 在从第一源/漏区域到第二源极/漏极子区域的沟槽周围延伸的衬底中形成连接区域。 还讨论了相关方法。
    • 14. 发明申请
    • METHODS OF FORMING NON-VOLATILE MEMORY DEVICES HAVING TRENCHES
    • 形成具有斜面的非易失性存储器件的方法
    • US20070066003A1
    • 2007-03-22
    • US11558634
    • 2006-11-10
    • Sung-Hoi HurJung-Dal Choi
    • Sung-Hoi HurJung-Dal Choi
    • H01L21/8238
    • H01L27/115H01L27/11519H01L27/11521H01L27/11524H01L27/11526H01L27/11529
    • A semiconductor memory device includes a semiconductor substrate having a trench therein. First and second gate patterns are formed on a surface of the substrate adjacent the trench, a respective one of which is on a respective opposing side of the trench. A split source/drain region is formed in the substrate between the first gate pattern and the second gate pattern such that the split source/drain region is divided by the trench. The split source/drain region includes a first source/drain subregion between the first gate pattern and the trench and a second source/drain subregion between the second gate pattern and the trench and spaced apart from the first source/drain subregion. A connecting region is formed in the substrate that extends around the trench from the first source/drain subregion to the second source/drain subregion. Related methods are also discussed.
    • 半导体存储器件包括其中具有沟槽的半导体衬底。 第一和第二栅极图案形成在与沟槽相邻的衬底的表面上,其相应的一个位于沟槽的相应的相对侧上。 在第一栅极图案和第二栅极图案之间的衬底中形成分离源极/漏极区域,使得分离源极/漏极区域被沟槽分开。 分离源极/漏极区域包括在第一栅极图案和沟槽之间的第一源极/漏极子区域和在第二栅极图案和沟槽之间并与第一源极/漏极子区域间隔开的第二源极/漏极子区域。 在从第一源/漏区域到第二源极/漏极子区域的沟槽周围延伸的衬底中形成连接区域。 还讨论了相关方法。
    • 15. 发明授权
    • Methods of forming non-volatile memory devices having trenches
    • 形成具有沟槽的非易失性存储器件的方法
    • US07501322B2
    • 2009-03-10
    • US11558634
    • 2006-11-10
    • Sung-Hoi HurJung-Dal Choi
    • Sung-Hoi HurJung-Dal Choi
    • H01L21/336
    • H01L27/115H01L27/11519H01L27/11521H01L27/11524H01L27/11526H01L27/11529
    • A semiconductor memory device includes a semiconductor substrate having a trench therein. First and second gate patterns are formed on a surface of the substrate adjacent the trench, a respective one of which is on a respective opposing side of the trench. A split source/drain region is formed in the substrate between the first gate pattern and the second gate pattern such that the split source/drain region is divided by the trench. The split source/drain region includes a first source/drain subregion between the first gate pattern and the trench and a second source/drain subregion between the second gate pattern and the trench and spaced apart from the first source/drain subregion. A connecting region is formed in the substrate that extends around the trench from the first source/drain subregion to the second source/drain subregion. Related methods are also discussed.
    • 半导体存储器件包括其中具有沟槽的半导体衬底。 第一和第二栅极图案形成在与沟槽相邻的衬底的表面上,其相应的一个位于沟槽的相应的相对侧上。 在第一栅极图案和第二栅极图案之间的衬底中形成分离源极/漏极区域,使得分离源极/漏极区域被沟槽分开。 分离源极/漏极区域包括在第一栅极图案和沟槽之间的第一源极/漏极子区域和在第二栅极图案和沟槽之间并与第一源极/漏极子区域间隔开的第二源极/漏极子区域。 在从第一源/漏区域到第二源极/漏极子区域的沟槽周围延伸的衬底中形成连接区域。 还讨论了相关方法。
    • 19. 发明申请
    • Electronic devices having partially elevated source/drain structures and related methods
    • 具有部分升高的源极/漏极结构和相关方法的电子器件
    • US20060033166A1
    • 2006-02-16
    • US11020311
    • 2004-12-22
    • Min-Cheol ParkSung-Hoi Hur
    • Min-Cheol ParkSung-Hoi Hur
    • H01L29/94
    • H01L21/76877H01L21/28525H01L29/66628H01L29/78
    • Methods of forming an electronic device may include forming a gate electrode on a semiconductor substrate, and forming first and second impurity doped regions of the semiconductor substrate on opposite sides of the gate electrode. An insulating layer may be formed on the semiconductor substrate including the first and second impurity doped regions, and first and second holes may be formed in the insulating layer, with the first and second holes respectively exposing portions of the first and second impurity doped regions. In addition, first and second epitaxial semiconductor layers may be formed in the respective first and second holes on the exposed portions of the first and second impurity doped regions of the semiconductor substrate. Related devices are also discussed.
    • 形成电子器件的方法可以包括在半导体衬底上形成栅电极,以及在栅电极的相对侧上形成半导体衬底的第一和第二杂质掺杂区。 可以在包括第一和第二杂质掺杂区域的半导体衬底上形成绝缘层,并且可以在绝缘层中形成第一和第二孔,其中第一和第二孔分别暴露第一和第二杂质掺杂区域的部分。 此外,可以在半导体衬底的第一和第二杂质掺杂区域的暴露部分上的相应的第一和第二孔中形成第一和第二外延半导体层。 还讨论了相关设备。
    • 20. 发明授权
    • Methods of forming electronic devices having partially elevated source/drain structures
    • 形成具有部分升高的源极/漏极结构的电子器件的方法
    • US07585710B2
    • 2009-09-08
    • US11638775
    • 2006-12-14
    • Min-Cheol ParkSung-Hoi Hur
    • Min-Cheol ParkSung-Hoi Hur
    • H01L29/72
    • H01L21/76877H01L21/28525H01L29/66628H01L29/78
    • Methods of forming an electronic device may include forming a gate electrode on a semiconductor substrate, and forming first and second impurity doped regions of the semiconductor substrate on opposite sides of the gate electrode. An insulating layer may be formed on the semiconductor substrate including the first and second impurity doped regions, and first and second holes may be formed in the insulating layer, with the first and second holes respectively exposing portions of the first and second impurity doped regions. In addition, first and second epitaxial semiconductor layers may be formed in the respective first and second holes on the exposed portions of the first and second impurity doped regions of the semiconductor substrate. Related devices are also discussed.
    • 形成电子器件的方法可以包括在半导体衬底上形成栅电极,以及在栅电极的相对侧上形成半导体衬底的第一和第二杂质掺杂区。 可以在包括第一和第二杂质掺杂区域的半导体衬底上形成绝缘层,并且可以在绝缘层中形成第一和第二孔,其中第一和第二孔分别暴露第一和第二杂质掺杂区域的部分。 此外,可以在半导体衬底的第一和第二杂质掺杂区域的暴露部分上的相应的第一和第二孔中形成第一和第二外延半导体层。 还讨论了相关设备。