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11. 发明授权

US06461228B2 Grinding and polishing machines 有权
标题翻译：研磨抛光机
公开(公告)号：US06461228B2
公开(公告)日：2002-10-08
申请号：US09729384
申请日：2000-12-04
申请人： Mark Andrew Stocker , Dermot Robert Falkner , Paul Martin Howard Morantz , Michael George Pierse
发明人： Mark Andrew Stocker , Dermot Robert Falkner , Paul Martin Howard Morantz , Michael George Pierse
IPC分类号： B24B906
CPC分类号： B24B53/07 , B23Q3/186 , B23Q17/24 , B24B5/04 , B24B5/06 , B24B5/065 , B24B9/065 , B24B17/04 , B24B17/06 , B24B41/02 , B24B41/04 , B24B49/02 , B24B49/12 , H01L21/02013 , H01L21/02021 , H01L21/67242 , H01L22/12 , H01L2924/0002 , H01L2924/00
摘要： A method of grinding the edge of a disc uses a grinding machine having mounted thereon a grooved grinding wheel, in which the groove is formed in situ using a forming wheel also mounted on the grinding machine. After a workpiece has been ground or after a succession of workpieces have been ground, re-engaging the grinding wheel and the forming wheel with the grinding wheel remaining in situ, to re-form the groove in the grinding wheel to correct for wear. A grinding machine comprises a grinding wheel, drive means therefor, a workhead and workpiece spindle and drive means therefor, a forming wheel and drive means therefor, means for moving the grinding wheel so as to plunge grind the edge of the grinding wheel to form a groove therein of precise cross-section and means for effecting relative movement between the grinding wheel and the forming wheel to enable the grinding wheel to engage with the edge of a circular workpiece component mounted on the workpiece spindle to edge grind the component and wherein the forming wheel is also mounted on the workpiece spindle for rotation therewith, and the grinding wheel is a resin bonded wheel.
摘要翻译：一种研磨圆盘边缘的方法是使用已经安装有凹槽的研磨轮的研磨机，其中使用也安装在研磨机上的成型轮在原地形成凹槽。在工件被研磨或在一连串的工件已被磨削之后，再次磨削砂轮和成型轮，砂轮保留在原位，以重新形成砂轮中的凹槽以校正磨损。研磨机包括砂轮，其驱动装置，工作头和工件主轴及其驱动装置，成形轮及其驱动装置，用于移动砂轮的装置，以便磨削研磨轮的边缘以形成在其中具有精确横截面的凹槽和用于实现砂轮和成型轮之间的相对运动的装置，以使得砂轮能够与安装在工件主轴上的圆形工件部件的边缘接合，从而边缘磨削部件，并且其中成形轮也安装在工件主轴上以与其一起旋转，并且砂轮是树脂粘合轮。

12. 发明申请

US20110162786A1 METHODS AND APPARATUS FOR FORMING A SLURRY POLISHING PAD 失效
标题翻译：用于形成浆料抛光垫的方法和装置
公开(公告)号：US20110162786A1
公开(公告)日：2011-07-07
申请号：US13048399
申请日：2011-03-15
申请人： Raymond Charles Cady , Michael John Moore , Mark Alex Shalkey , Mark Andrew Stocker
发明人： Raymond Charles Cady , Michael John Moore , Mark Alex Shalkey , Mark Andrew Stocker
IPC分类号： B29C51/14
CPC分类号： B24B37/26 , B24B13/02 , B24B37/20 , B24D18/0009 , Y10T29/53796 , Y10T156/1028 , Y10T156/1031
摘要： Methods and apparatus for forming a semi-spherical polishing pad for polishing semiconductor surfaces, provide for: placing a polishing pad pre-form on a dome-shaped forming surface, the polishing pad pre-form including a circular body having a center and an outer peripheral edge, and a plurality of slots extending from the outer peripheral edge towards the center; disposing a bladder opposite to the dome-shaped forming surface and the polishing pad pre-form; inflating the bladder with a fluid such that the dome-shaped forming surface of the bonnet form presses against the polishing pad pre-form from one side and the bladder presses against the polishing pad pre-form from an opposite side; and maintaining the pressing step for a predetermined period of time to achieve the semi-spherical polishing pad.
摘要翻译：用于形成用于抛光半导体表面的半球形抛光垫的方法和装置提供：将抛光垫预成型放置在圆顶形成形表面上，所述抛光垫预成型件包括具有中心和外部的圆形主体周缘，以及从外周缘向中心延伸的多个槽; 设置与圆顶形状表面相对的囊和抛光垫预成型件; 用流体使气囊膨胀，使得发动机罩形状的圆顶形成表面从一侧挤压抛光垫预成型件，并且气囊从相对侧压靠抛光垫预成型件; 并且保持按压步骤达预定时间以实现半球形抛光垫。

13. 发明授权

US07927092B2 Apparatus for forming a slurry polishing pad 有权
标题翻译：用于形成浆料抛光垫的方法和设备
公开(公告)号：US07927092B2
公开(公告)日：2011-04-19
申请号：US11967818
申请日：2007-12-31
申请人： Raymond Charles Cady , Michael John Moore , Mark Alex Shalkey , Mark Andrew Stocker
发明人： Raymond Charles Cady , Michael John Moore , Mark Alex Shalkey , Mark Andrew Stocker
IPC分类号： B29C43/36
CPC分类号： B24B37/26 , B24B13/02 , B24B37/20 , B24D18/0009 , Y10T29/53796 , Y10T156/1028 , Y10T156/1031
摘要： Methods and apparatus for forming a semi-spherical polishing pad for polishing semiconductor surfaces, provide for: placing a polishing pad pre-form on a dome-shaped forming surface, the polishing pad pre-form including a circular body having a center and an outer peripheral edge, and a plurality of slots extending from the outer peripheral edge towards the center; disposing a bladder opposite to the dome-shaped forming surface and the polishing pad pre-form; inflating the bladder with a fluid such that the dome-shaped forming surface of the bonnet form presses against the polishing pad pre-form from one side and the bladder presses against the polishing pad pre-form from an opposite side; and maintaining the pressing step for a predetermined period of time to achieve the semi-spherical polishing pad.
摘要翻译：用于形成用于抛光半导体表面的半球形抛光垫的方法和装置提供：将抛光垫预成型放置在圆顶形成形表面上，所述抛光垫预成型件包括具有中心和外部的圆形主体周缘，以及从外周缘向中心延伸的多个槽; 设置与圆顶形状表面相对的囊和抛光垫预成型件; 用流体使气囊膨胀，使得发动机罩形状的圆顶形成表面从一侧挤压抛光垫预成型件，并且气囊从相对侧压靠抛光垫预成型件; 并且保持按压步骤达预定时间以实现半球形抛光垫。

14. 发明授权

US06267647B1 Grinding machines and polishing machines 有权
标题翻译：研磨机和抛光机
公开(公告)号：US06267647B1
公开(公告)日：2001-07-31
申请号：US09273057
申请日：1999-03-19
申请人： Mark Andrew Stocker , Dermot Robert Falkner , Paul Martin Howard Morantz , Michael George Pierse
发明人： Mark Andrew Stocker , Dermot Robert Falkner , Paul Martin Howard Morantz , Michael George Pierse
IPC分类号： B24B906
CPC分类号： B24B53/07 , B23Q3/186 , B23Q17/24 , B24B5/04 , B24B5/06 , B24B5/065 , B24B9/065 , B24B17/04 , B24B17/06 , B24B41/02 , B24B41/04 , B24B49/02 , B24B49/12 , H01L21/02013 , H01L21/02021 , H01L21/67242 , H01L22/12 , H01L2924/0002 , H01L2924/00
摘要： A method of grinding the edge of a disc uses a grinding machine having mounted thereon a grooved grinding wheel, in which the groove is formed in situ using a forming wheel also mounted on the grinding machine. After a workpiece has been ground or after a succession of workpieces have been ground, re-engaging the grinding wheel and the forming wheel with the grinding wheel remaining in situ, to re-form the groove in the grinding wheel to correct for wear. A grinding machine comprises a grinding wheel, drive means therefor, a workhead and workpiece spindle and drive means therefor, a forming wheel and drive means therefor, means for moving the grinding wheel so as to plunge grind the edge of the grinding wheel to form a groove therein of precise cross-section and means for effecting relative movement between the grinding wheel and the forming wheel to enable the grinding wheel to engage with the edge of a circular workpiece component mounted on the workpiece spindle to edge grind the component and wherein the forming wheel is also mounted on the workpiece spindle for rotation therewith, and the grinding wheel is a resin bonded wheel.
摘要翻译：一种研磨圆盘边缘的方法是使用已经安装有凹槽的研磨轮的研磨机，其中使用也安装在研磨机上的成型轮在原地形成凹槽。在工件被研磨或在一连串的工件已被磨削之后，再次磨削砂轮和成型轮，砂轮保留在原位，以重新形成砂轮中的凹槽以校正磨损。研磨机包括砂轮，其驱动装置，工作头和工件主轴及其驱动装置，成形轮及其驱动装置，用于移动砂轮的装置，以便磨削研磨轮的边缘以形成在其中具有精确横截面的凹槽和用于实现砂轮和成型轮之间的相对运动的装置，以使得砂轮能够与安装在工件主轴上的圆形工件部件的边缘接合，从而边缘磨削部件，并且其中成形轮也安装在工件主轴上以与其一起旋转，并且砂轮是树脂粘合轮。

15. 发明授权

US06224459B1 Workpiece inspection and handling 失效
标题翻译：工件检查和处理
公开(公告)号：US06224459B1
公开(公告)日：2001-05-01
申请号：US09202752
申请日：1998-12-15
申请人： Mark Andrew Stocker , Dermot Robert Falkner , Paul Martin Howard Morantz , Michael George Pierse
发明人： Mark Andrew Stocker , Dermot Robert Falkner , Paul Martin Howard Morantz , Michael George Pierse
IPC分类号： B24B4900
CPC分类号： B24B53/07 , B23Q3/186 , B23Q17/24 , B24B5/04 , B24B5/06 , B24B5/065 , B24B9/065 , B24B17/04 , B24B17/06 , B24B41/02 , B24B41/04 , B24B49/02 , B24B49/12 , H01L21/02013 , H01L21/02021 , H01L21/67242 , H01L22/12 , H01L2924/0002 , H01L2924/00
摘要： A workpiece alignment and shifting system for moving circular workpieces from a first inspection station to a second machining station, comprises workpiece holding means for attachment to the face of a disc workpiece to move the latter from one position to another. Robotic means controls the position of the workpiece holding means and is adapted to move in a least two orthogonal directions, both of which are parallel to the plane of the disc when it occupies the first station. The disc is rotated in the inspection station and in the machining station and inspection means determines the position of the geometric center of the disc as it is rotated. Computing means calculates from data delivered by the inspection means the two shifts required along the orthogonal directions of movement of the robotic means, to move the geometric center of the disc to a second desired position whose coordinates are known. The computing means includes memory means for storing the said coordinates. The coordinates are those of the center of rotation of the workpiece holder or chuck in the said second station. The workpiece holding means is vacuum operated. A three axis robot is employed to pick and place disc-like wafers of semi-conductor material for edge grinding, and movement along two of the robot axes, X and Z, is used to control the centering of the wafer on a vacuum chuck in the second grinding station.
摘要翻译：用于将圆形工件从第一检查站移动到第二加工站的工件对准和移位系统包括用于附接到盘工件的表面的工件保持装置，以将其从一个位置移动到另一个位置。机器人装置控制工件保持装置的位置，并且适于在至少两个正交方向上移动，当它们占据第一站时，它们都平行于盘的平面。光盘在检查站和加工站中旋转，检查装置确定盘旋转时几何中心的位置。计算装置根据由检查装置传送的数据，根据机器人装置的正交运动方向所需的两次移动，将盘的几何中心移动到其坐标已知的第二所需位置。计算装置包括用于存储所述坐标的存储装置。坐标是在所述第二站中的工件保持器或卡盘的旋转中心的坐标。工件保持装置被真空操作。采用三轴机器人来拾取和放置用于边缘磨削的半导体材料的盘状晶片，并且使用两个机器人轴X和Z的运动来控制晶片在真空卡盘上的定心第二磨台。

16. 发明授权

US06217420B1 Grinding machine spindle flexibly attached to platform 有权
标题翻译：磨床主轴灵活地连接到平台上
公开(公告)号：US06217420B1
公开(公告)日：2001-04-17
申请号：US09194706
申请日：1998-12-15
申请人： Mark Andrew Stocker , Dermot Robert Falkner , Paul Martin Howard Morantz , Michael George Pierse
发明人： Mark Andrew Stocker , Dermot Robert Falkner , Paul Martin Howard Morantz , Michael George Pierse
IPC分类号： B24B906
CPC分类号： B24B53/07 , B23Q3/186 , B23Q17/24 , B24B5/04 , B24B5/06 , B24B5/065 , B24B9/065 , B24B17/04 , B24B17/06 , B24B41/02 , B24B41/04 , B24B49/02 , B24B49/12 , H01L21/02013 , H01L21/02021 , H01L21/67242 , H01L22/12 , H01L2924/0002 , H01L2924/00
摘要： A grinding or polishing machine comprises a rigid platform on which a workhead spindle and a grinding wheel spindle are located. The grinding wheel spindle is mounted on a sub-assembly which is attached to the platform by means of flexures which permit limited movement of the sub-assembly in a direction generally parallel to the direction in which the wheel has to advance to achieve grinding or polishing of a workpiece mounted on the workhead spindle. The flexures generally inhibit movement of the sub-assembly in all other directions. Two grinding wheels are mounted on the platform, one on each of two sub-assemblies, and each sub-assembly is attached to the platform by flexures as aforesaid. The flexure mounting points are located generally centrally of the machine and are located on either side of and close to the machine centre line. In a grinding or polishing machine having workpiece spindle means, tool spindle means mounted on sub-assemblies which permit limited relative movement in one direction to effect tool and workpiece engagement cam drive means is provided whereby each sub-assembly is movable to advance or retract each tool spindle towards and away from the workhead spindle.
摘要翻译：研磨或抛光机器包括刚性平台，工作头主轴和砂轮主轴位于该刚性平台上。砂轮主轴安装在通过挠性件附接到平台的子组件上，所述挠性件允许子组件在大致平行于车轮必须前进的方向的方向上有限地移动以实现研磨或抛光安装在工件主轴上的工件。挠曲通常抑制子组件在所有其他方向上的移动。两个砂轮安装在平台上，一个在两个子组件中的每一个上，并且每个子组件通过如上所述的弯曲附接到平台。弯曲安装点通常位于机器的中心，并位于机器中心线的任一侧并靠近机器中心线。在具有工件主轴装置的研磨或抛光机器中，安装在子组件上的工具主轴装置允许在一个方向上有限的相对运动以实现工具和工件接合凸轮驱动装置，由此每个子组件可移动以推进或缩回每个工具主轴朝向和远离工作头主轴。

17. 发明授权

US6095897A Grinding and polishing machines 失效
标题翻译：研磨抛光机
公开(公告)号：US6095897A
公开(公告)日：2000-08-01
申请号：US273060
申请日：1999-03-19
申请人： Mark Andrew Stocker , Dermot Robert Falkner , Paul Martin Howard Morantz , Michael George Pierse
发明人： Mark Andrew Stocker , Dermot Robert Falkner , Paul Martin Howard Morantz , Michael George Pierse
IPC分类号： B24B41/06 , B23Q1/36 , B23Q3/18 , B23Q17/24 , B24B1/00 , B24B5/04 , B24B5/06 , B24B9/00 , B24B9/06 , B24B17/04 , B24B17/06 , B24B19/02 , B24B41/00 , B24B41/02 , B24B41/04 , B24B47/12 , B24B49/00 , B24B49/02 , B24B49/12 , B24B53/00 , B24B53/07 , B24B55/02 , H01L21/00 , H01L21/304 , H01L21/306 , H01L21/66
CPC分类号： B24B53/07 , B23Q17/24 , B23Q3/186 , B24B17/04 , B24B17/06 , B24B41/02 , B24B41/04 , B24B49/02 , B24B49/12 , B24B5/04 , B24B5/06 , B24B5/065 , B24B9/065 , H01L21/02013 , H01L21/02021 , H01L21/67242 , H01L22/12 , H01L2924/0002
摘要： A grinding machine for grinding the edge of a disc or wafer comprises a grooved grinding wheel 308, means for transporting the wafers before or after grinding, and a housing 332 in which wafers 340 are parked on a vacuum chuck 336 awaiting inspection. A jet 338 protrudes into the housing and directs water or air towards the face and edge of the wafer on the chuck. The transport means then transfers wafers to an inspection station.
摘要翻译：用于研磨盘或晶片的边缘的研磨机包括带槽的砂轮308，用于在研磨之前或之后输送晶片的装置，以及壳体332，其中晶片340停放在真空吸盘336上等待检查。喷射器338突出到壳体中并且引导水或空气朝向卡盘上的晶片的表面和边缘。运输工具然后将晶片转移到检查站。

18. 发明申请

US20100330880A1 Machine Tools and Methods of Operation Thereof 有权
标题翻译：机床及其操作方法
公开(公告)号：US20100330880A1
公开(公告)日：2010-12-30
申请号：US12863786
申请日：2009-01-21
申请人： Mark Andrew Stocker
发明人： Mark Andrew Stocker
IPC分类号： B23Q1/48 , B24B1/00
CPC分类号： B24B47/22 , B23Q1/25 , B23Q1/4804 , B23Q1/5425 , B24B41/005 , B24B47/20 , B24B49/00
摘要： A machine tool is provided which comprises a machine base (10), a first support (20,100) mounted on a first rotational machine axis on the base, and a second support (22,102) mounted on a second rotational machine axis on the base. The second rotational axis is parallel to and spaced laterally from the first rotational axis and carries a mount (38,112) moveable relative to the second support along a first linear machine axis orthogonal to the second rotational axis. A control arrangement is operable to control the orientation of the first support on the first rotational axis, and the orientation of the mount relative to the second rotational axis and its location along the linear axis, so as to govern the position and orientation of the first support and the mount relative to each other. Existing machine tools often use long linear guide rails and stacked orthogonal axes which introduce alignment and offset errors. The present invention avoids the need for and/or reduces the number of these structures in machine tools.
摘要翻译：提供了一种机床，其包括机座（10），安装在基座上的第一旋转机器轴线上的第一支撑件（20,100）和安装在基座上的第二旋转机器轴线上的第二支撑件（22,102）。所述第二旋转轴线与所述第一旋转轴线平行并与所述第一旋转轴线横向间隔开并且承载相对于所述第二支撑件沿着与所述第二旋转轴线正交的第一线性机器轴线可移动的支架（38,112）。控制装置可操作以控制第一支撑件在第一旋转轴线上的取向以及安装件相对于第二旋转轴线的取向及其沿着线性轴线的位置，以便控制第一支撑件的位置和方位支撑和相对于彼此的安装。现有的机床通常使用长直线导轨和堆叠的正交轴，引入对准和偏移误差。本发明避免了对机床中这些结构的需求和/或减少的数量。

19. 发明授权

US07831327B2 Precision abrasive machining of work piece surfaces 失效
标题翻译：工件表面的精密磨削加工
公开(公告)号：US07831327B2
公开(公告)日：2010-11-09
申请号：US11998691
申请日：2007-11-30
申请人： Mark Andrew Stocker
发明人： Mark Andrew Stocker
IPC分类号： G06F19/00 , H01L21/461 , B24B49/00 , B24B5/00
CPC分类号： B24B49/16 , B24B7/228 , B24B13/01
摘要： The spacing between an abrasive type surface polishing tool and the surface of the work piece that is being polished is controlled dynamically so that variations in the area of the abrasive pad in contact with the surface of the work piece compensated, thereby eliminating size variations in this contact area and the accompanying variations in material removal that produce surface height fluctuations.
摘要翻译：研磨型表面抛光工具与正被抛光的工件表面之间的间距被动态地控制，使得与工件表面接触的磨料区域的变化被补偿，由此消除了这种尺寸变化接触面积以及产生表面高度波动的材料去除的伴随变化。

20. 发明授权

US07790565B2 Semiconductor on glass insulator made using improved thinning process 失效
标题翻译：使用改进的薄化工艺制成的玻璃绝缘体上的半导体
公开(公告)号：US07790565B2
公开(公告)日：2010-09-07
申请号：US11729895
申请日：2007-03-29
申请人： Kishor Purushottam Gadkaree , Michael John Moore , Mark Andrew Stocker , Jiangwei Feng , Joseph Frank Mach
发明人： Kishor Purushottam Gadkaree , Michael John Moore , Mark Andrew Stocker , Jiangwei Feng , Joseph Frank Mach
IPC分类号： H01L21/76
CPC分类号： H01L21/76254 , H01L21/30604 , H01L21/30608
摘要： Methods and apparatus for producing a semiconductor on glass (SiOG) structure include: subjecting an implantation surface of a donor semiconductor wafer to an ion implantation process to create an exfoliation layer in the donor semiconductor wafer; bonding the implantation surface of the exfoliation layer to a glass substrate using electrolysis; separating the exfoliation layer from the donor semiconductor wafer, thereby exposing at least one cleaved surface; and subjecting the at least one cleaved surface to a wet etching process.
摘要翻译：用于制造玻璃（SiOG）结构的半导体的方法和装置包括：使施主半导体晶片的注入表面进行离子注入工艺以在施主半导体晶片中产生剥离层; 使用电解将剥离层的注入表面粘合到玻璃基板上; 将剥离层与施主半导体晶片分离，从而暴露至少一个切割表面; 以及对所述至少一个切割表面进行湿式蚀刻工艺。

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