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11. 发明授权

US08362992B2 Dual view display system using a transparent display 有权
标题翻译：双视图显示系统采用透明显示
公开(公告)号：US08362992B2
公开(公告)日：2013-01-29
申请号：US12840576
申请日：2010-07-21
申请人： Frederick F. Kuhlman , Andres P. Harbach , Richard D. Parker , Dwadasi H. R. Sarma
发明人： Frederick F. Kuhlman , Andres P. Harbach , Richard D. Parker , Dwadasi H. R. Sarma
IPC分类号： G09G3/36
CPC分类号： G02F1/1347 , G02F1/13306 , G02F1/13338 , G02F2001/133342 , G09G3/003 , G09G3/348 , G09G3/36 , G09G3/38 , G09G2300/023
摘要： A dual view display system to display two different images in substantially opposite direction using a single transparent display to time-multiplex the images and shutter devices to alternately block each side from being viewed according to the image being displayed.
摘要翻译：一种双视图显示系统，使用单个透明显示器以基本上相反的方向显示两个不同的图像，以对图像和快门设备进行时间多路复用，以根据正在显示的图像交替地阻止每一侧的观看。

12. 发明授权

US5341119A Measurement circuit utilizing a low TCR thick film sense resistor 失效
标题翻译：采用低TCR厚膜检测电阻的测量电路
公开(公告)号：US5341119A
公开(公告)日：1994-08-23
申请号：US972334
申请日：1992-11-06
申请人： Carl W. Berlin , Dwadasi H. R. Sarma
发明人： Carl W. Berlin , Dwadasi H. R. Sarma
IPC分类号： C03C8/10 , C03C8/18 , H01C7/00 , H01C17/065 , H01C8/00
CPC分类号： H01C17/0658 , C03C8/10 , C03C8/18 , H01C17/06526 , H01C7/003
摘要： A measurement circuit utilizing a thick film sense resistor containing palladium and silver in a weight ratio of about 56/44 to about 60/40 and a specific glass frit composition so that the sense resistor achieves low resistivity and controlled TCR.
摘要翻译：使用重量比为约56/44至约60/40的含钯和银的厚膜检测电阻器和特定的玻璃料组合物的测量电路，使得检测电阻器实现低电阻率和受控的TCR。

13. 发明授权

US5464570A THFA/PDP thermoset thick films for printed circuits 失效
标题翻译： THFA / PDP热固性厚膜印刷电路
公开(公告)号：US5464570A
公开(公告)日：1995-11-07
申请号：US140958
申请日：1993-10-25
申请人： Frans P. Lautzenhiser , Bradley H. Carter , Donald A. Ozogar , Dwadasi H. R. Sarma
发明人： Frans P. Lautzenhiser , Bradley H. Carter , Donald A. Ozogar , Dwadasi H. R. Sarma
IPC分类号： H01B1/22 , H05K1/09 , H01B1/00
CPC分类号： H01B1/22 , H05K1/095
摘要： The invention includes the discovery that the addition of a thermosetting polymer to a thick-film conductor formulation including a thermoplastic polymer will substantially retard the spreading of the thick-film conductor ink upon firing of the printed conductor. The thermosetting polymer may be from the family of allylic esters, for example poly(diallyl phthalate). The invention also includes the discovery that the thermosetting resin can be dissolved with an organic solvent to form an additive so as to uniformly distribute the thermosetting polymer within the thick-film conductor formulation including the thermoplastic polymers. Preferred organic solvents include alcohols with a weight ratio of thermoset-to-organic solvent ranging from about 1:1.5 to about 1:3.
摘要翻译：本发明包括以下发现：在包含热塑性聚合物的厚膜导体制剂中添加热固性聚合物将基本上延迟在印刷导体烧制时厚膜导体油墨的铺展。热固性聚合物可以来自烯丙基酯类，例如聚（邻苯二甲酸二烯丙酯）。本发明还包括以下发现：热固性树脂可以用有机溶剂溶解以形成添加剂，以便将热固性聚合物均匀分布在包括热塑性聚合物的厚膜导体制剂中。优选的有机溶剂包括重量比为约1:1.5至约1:3的热固性有机溶剂的醇。

14. 发明授权

US5122929A Method of achieving selective inhibition and control of adhesion in thick-film conductors 失效
标题翻译：实现选择性抑制和控制厚膜导体粘附的方法
公开(公告)号：US5122929A
公开(公告)日：1992-06-16
申请号：US297201
申请日：1989-01-17
申请人： Ponnusamy Palanisamy , Dwadasi H. R. Sarma , John A. Hearn , Dwight L. Schwarz
发明人： Ponnusamy Palanisamy , Dwadasi H. R. Sarma , John A. Hearn , Dwight L. Schwarz
IPC分类号： H01L21/48 , H01L23/498 , H01L23/538 , H05K1/03 , H05K1/09 , H05K3/40
CPC分类号： H01L23/49838 , H01L21/481 , H01L21/4867 , H01L23/49894 , H01L23/538 , H05K3/4092 , H01L2224/16225 , H01L2224/81191 , H01L2924/10253 , H05K1/0306 , H05K1/092
摘要： A technique for providing controlled adhesion of a portion of a printed conductor to a circuit board employs an inhibitor layer between the circuit board and the portion of the printed conductor where such controlled adhesion is desired. The inhibitor layer is formed using a mixture of finely divided alumina powder and a glass frit, which are both suspended in an organic screening agent. An electrical module connected between controllably adherent conductor portions is thereby able to move to relative mechanical stresses.
摘要翻译：一种用于将印刷导体的一部分控制粘附到电路板的技术在电路板和印刷导体的部分之间采用抑制层，其中需要这种受控的粘合。抑制剂层使用细分的氧化铝粉末和玻璃料的混合物形成，两者都悬浮在有机筛选剂中。连接在可控制的粘附导体部分之间的电气模块因此能够移动到相对的机械应力。

15. 发明授权

US5121298A Controlled adhesion conductor 失效
标题翻译：受控粘合导体
公开(公告)号：US5121298A
公开(公告)日：1992-06-09
申请号：US552046
申请日：1990-07-13
申请人： Dwadasi H. R. Sarma , Ponnusamy Palanisamy , John A. Hearn , Dwight L. Schwarz
发明人： Dwadasi H. R. Sarma , Ponnusamy Palanisamy , John A. Hearn , Dwight L. Schwarz
IPC分类号： H01B1/16 , H01B1/22 , H05K1/09
CPC分类号： H05K1/092 , H01B1/16 , H01B1/22
摘要： Compositions useful for printing controllable adhesion conductive patterns on a printed circuit board include finely divided copper powder, a screening agent and a binder. The binder is designed to provide controllable adhesion of the copper layer formed after sintering to the substrate so that the layer can lift off the substrate in response to thermal stress. Additionally, the binder serves to promote good cohesion between the copper particles to provide good mechanical strength to the copper layer so that it can tolerate lift off without fracture.
摘要翻译：用于在印刷电路板上印刷可控制粘合导电图案的组合物包括细碎的铜粉，筛选剂和粘合剂。粘合剂被设计成提供在烧结之后形成的铜层对基材的可控的粘附性，使得该层可以响应于热应力而离开基底。此外，粘合剂用于促进铜颗粒之间的良好的内聚力，以向铜层提供良好的机械强度，使得其能够耐受脱落而不会断裂。

16. 发明授权

US5527627A Ink composition for an ultra-thick thick film for thermal management of a hybrid circuit 失效
标题翻译：用于混合电路热管理的超厚厚膜的油墨组合物
公开(公告)号：US5527627A
公开(公告)日：1996-06-18
申请号：US342966
申请日：1994-11-21
申请人： Frans P. Lautzenhiser , Dwadasi H. R. Sarma , Fred E. Richter , Carl W. Berlin
发明人： Frans P. Lautzenhiser , Dwadasi H. R. Sarma , Fred E. Richter , Carl W. Berlin
IPC分类号： H01L21/52 , H01L23/12 , H01L23/373 , H05K7/06 , H05K7/20 , B32B9/00
CPC分类号： H01L23/3735 , B32B15/04 , B32B15/20 , B32B7/12 , B32B9/005 , B32B9/041 , B32B2255/00 , B32B2264/105 , B32B2307/202 , B32B2307/302 , B32B2457/00 , H01L2224/32225 , H01L2224/45124 , H01L2224/48472 , H01L2224/73265 , H01L2224/8384 , H01L24/48 , H01L2924/00014 , H01L2924/01004 , H01L2924/01019 , H01L2924/01025 , H01L2924/01039 , H01L2924/01046 , H01L2924/01078 , H01L2924/14 , Y10S428/901 , Y10T428/12479 , Y10T428/12493 , Y10T428/12528 , Y10T428/12556 , Y10T428/12569 , Y10T428/12611 , Y10T428/12646 , Y10T428/12993 , Y10T428/24917
摘要： An ink composition is provided for forming an ultra-thick thick film which is suitable for conducting heat laterally from a heat generating device supported on a substrate. The ink composition is formulated to enable the ultra-thick thick film to be formed as a single layer, such that only a single print, dry and fire cycle is required to form the film. Advantageously, ultra-thick thick films having thicknesses of about 125 micrometers (about 0.005 inch) and greater can be formed by a single layer of the ink composition.
摘要翻译：提供了一种油墨组合物，用于形成适于从支撑在基底上的发热装置横向导热的超厚厚膜。将油墨组合物配制成能够将超厚厚膜形成为单层，使得仅需要单次打印，干燥和消火循环以形成膜。有利地，可以通过单层油墨组合物形成厚度为约125微米（约0.005英寸）或更大的超厚厚膜。

17. 发明授权

US5524490A Inductive proximity sensor 失效
标题翻译：感应式接近传感器
公开(公告)号：US5524490A
公开(公告)日：1996-06-11
申请号：US533022
申请日：1995-05-25
申请人： Frans P. Lautzenhiser , Dwadasi H. R. Sarma
发明人： Frans P. Lautzenhiser , Dwadasi H. R. Sarma
IPC分类号： G01D5/20 , G01P15/11 , G01P15/00 , G01P15/08
CPC分类号： G01P15/11 , G01D5/2013
摘要： An inductive sensing element for sensing displacement of a resilient flexible beam or diaphragm. The inductive sensing element comprises an open faced member and a closed faced member one of which is attachable to the flexible beam and the other of which is attachable to a stationary member. The parameters of both the open and closed faced members are selected so that the self-inductance of the open faced member is determined by the overall distance separating the members. Both the open and closed faced members have a magnetic coating and the open face member further comprises an electrically conductive coating arranged in a predetermined pattern on its magnetic coating. The self- inductance of the open faced member, in particular, the predetermined pattern, is dependent upon the magnetic coating on the open faced member and the magnetic contribution that the magnetic coating of the closed faced member makes to the magnetic coating of the open faced member which, in turn, is dependent upon the overall distance separating the open and closed faced members.
摘要翻译：用于感测弹性柔性梁或隔膜的位移的感应感应元件。感应感应元件包括敞开的构件和一个闭合的构件，其中一个可附接到柔性梁，另一个可附接到固定构件。选择打开和关闭的面部构件的参数，使得开口面部构件的自感由分离构件的总距离确定。开放和封闭的面部构件均具有磁性涂层，而开放面构件还包括在其磁性涂层上以预定图案布置的导电涂层。开放式构件的自感，特别是预定图案的自感取决于敞开的构件上的磁性涂层以及封闭面构件的磁性涂层对开放面的磁性涂层的磁性作用这又反过来取决于打开和关闭的面部构件的整体距离。

18. 发明授权

US4959751A Ceramic hybrid integrated circuit having surface mount device solder stress reduction 失效
标题翻译：陶瓷混合集成电路具有表面贴装器件焊料应力减少
公开(公告)号：US4959751A
公开(公告)日：1990-09-25
申请号：US297212
申请日：1989-01-17
申请人： John A. Hearn , Dwight L. Schwarz , Dwadasi H. R. Sarma , Ponnusamy Palanisamy
发明人： John A. Hearn , Dwight L. Schwarz , Dwadasi H. R. Sarma , Ponnusamy Palanisamy
IPC分类号： H01L21/48 , H01L23/498 , H01L23/538 , H05K1/03 , H05K1/09 , H05K3/40
CPC分类号： H05K3/4092 , H01L21/481 , H01L21/4867 , H01L23/49838 , H01L23/49894 , H01L23/538 , H01L2224/16 , H01L2224/81191 , H01L2924/01014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H05K1/0306 , H05K1/092
摘要： A printed circuit board assembly uses a conductive pattern that includes both firmly adherent conductors and controllably adherent conductors. The controllably adhering conductors are free to lift off the printed circuit board to relieve mechanical forces caused by thermal stresses at solder joints between the controllably adherent conductors and integrated circuit chips of the assembly.
摘要翻译：印刷电路板组件使用包括牢固粘附导体和可控地粘附导体的导电图案。可控制地粘附的导体可自由地剥离印刷电路板，以减轻由组件的可控制的导体和集成电路芯片之间的焊接点处的热应力引起的机械力。

19. 发明申请

US20080218932A1 Embedded capacitor 审中-公开
标题翻译：嵌入式电容器
公开(公告)号：US20080218932A1
公开(公告)日：2008-09-11
申请号：US11715651
申请日：2007-03-08
申请人： Carl W. Berlin , Dwadasi H. R. Sarma , William J. Chappell , Eric E. Hoppenjans
发明人： Carl W. Berlin , Dwadasi H. R. Sarma , William J. Chappell , Eric E. Hoppenjans
IPC分类号： H01G7/04
CPC分类号： H05K1/162 , H05K1/0306 , H05K1/0313 , H05K3/429 , H05K3/4611 , H05K2201/0187 , H05K2201/0209 , H05K2201/09763 , Y10T29/435
摘要： An embedded capacitor method and system is provided for printed circuit boards. The capacitor structure is embedded within an insulator substrate, minimizes real-estate usage, provides a high capacitance, enhances capacitance density, and yet forms an advantageous planar surface topography. A cavity is defined within and contained by an insulator substrate layer, and a dielectric material at least partially fills the cavity. The dielectric material is connected to an electrical conductor, and vias are used for interconnections and traces. In an aspect, a plurality of stacked insulator substrate layers define a plurality of cavities filled with the dielectric material, providing even greater capacitance. In another aspect, an array of cavities is formed in the insulator substrate layer. The embedded capacitor can be employed within numerous systems that utilize capacitors including automotive electronics such as a pressure sensor, an engine control module, a transmission controller, and radio systems including satellite radio devices.
摘要翻译：为印刷电路板提供嵌入式电容器方法和系统。电容器结构嵌入在绝缘体基板内，最小化不动产使用，提供高电容，增强电容密度，并形成有利的平面表面形貌。空腔被限定在绝缘体衬底层内并由绝缘体衬底层包含，并且电介质材料至少部分地填充空腔。介电材料连接到电导体，通孔用于互连和迹线。在一个方面，多个堆叠的绝缘体衬底层限定了填充有电介质材料的多个空腔，提供了更大的电容。在另一方面，在绝缘体基底层中形成空腔阵列。嵌入式电容器可以用在许多使用诸如压力传感器，发动机控制模块，变速器控制器和包括卫星无线电设备的无线电系统的汽车电子产品的电容器的系统中。

20. 发明授权

US07205652B2 Electronic assembly including multiple substrates 有权
标题翻译：电子组件包括多个基板
公开(公告)号：US07205652B2
公开(公告)日：2007-04-17
申请号：US11088101
申请日：2005-03-23
申请人： M. Ray Fairchild , Dwadasi H. R. Sarma , Derek B. Workman , Daniel R. Harshbarger
发明人： M. Ray Fairchild , Dwadasi H. R. Sarma , Derek B. Workman , Daniel R. Harshbarger
IPC分类号： H01L23/10 , H01L23/12 , H01L23/053
CPC分类号： H01L23/142 , H01L21/563 , H01L23/5385 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/09701 , H01L2924/1305 , H01L2924/13055 , H01L2924/15311 , H01L2924/30107 , H05K1/0306 , H05K1/053 , H05K1/141 , H05K3/284 , H05K3/3436 , H05K2201/0212 , H05K2201/10977 , H01L2924/00 , H01L2224/0401
摘要： An electronic assembly includes a first substrate and a second substrate. The first substrate includes a first surface having a first plurality of conductive traces formed on an electrically non-conductive layer. The second substrate includes a first surface having a second plurality of conductive traces formed thereon and a second surface having a third plurality of conductive traces formed thereon. A first electronic component is electrically coupled to one or more of the plurality of conductive traces on the first surface of the second substrate. At least one of a plurality of conductive interconnects is incorporated within each solder joint that electrically couples one or more of the conductive traces formed on the second surface of the second substrate to one or more of the conductive traces formed on the first substrate.
摘要翻译：电子组件包括第一基板和第二基板。第一衬底包括具有形成在非导电层上的第一多个导电迹线的第一表面。第二基板包括具有形成在其上的第二多个导电迹线的第一表面和形成有第三多个导电迹线的第二表面。第一电子部件电耦合到第二基板的第一表面上的多个导电迹线中的一个或多个。多个导电互连件中的至少一个结合在每个焊接接头内，将形成在第二衬底的第二表面上的一个或多个导电迹线电耦合到形成在第一衬底上的一个或多个导电迹线。

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