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1. 发明申请

US20080218932A1 Embedded capacitor 审中-公开
标题翻译：嵌入式电容器
公开(公告)号：US20080218932A1
公开(公告)日：2008-09-11
申请号：US11715651
申请日：2007-03-08
申请人： Carl W. Berlin , Dwadasi H. R. Sarma , William J. Chappell , Eric E. Hoppenjans
发明人： Carl W. Berlin , Dwadasi H. R. Sarma , William J. Chappell , Eric E. Hoppenjans
IPC分类号： H01G7/04
CPC分类号： H05K1/162 , H05K1/0306 , H05K1/0313 , H05K3/429 , H05K3/4611 , H05K2201/0187 , H05K2201/0209 , H05K2201/09763 , Y10T29/435
摘要： An embedded capacitor method and system is provided for printed circuit boards. The capacitor structure is embedded within an insulator substrate, minimizes real-estate usage, provides a high capacitance, enhances capacitance density, and yet forms an advantageous planar surface topography. A cavity is defined within and contained by an insulator substrate layer, and a dielectric material at least partially fills the cavity. The dielectric material is connected to an electrical conductor, and vias are used for interconnections and traces. In an aspect, a plurality of stacked insulator substrate layers define a plurality of cavities filled with the dielectric material, providing even greater capacitance. In another aspect, an array of cavities is formed in the insulator substrate layer. The embedded capacitor can be employed within numerous systems that utilize capacitors including automotive electronics such as a pressure sensor, an engine control module, a transmission controller, and radio systems including satellite radio devices.
摘要翻译：为印刷电路板提供嵌入式电容器方法和系统。电容器结构嵌入在绝缘体基板内，最小化不动产使用，提供高电容，增强电容密度，并形成有利的平面表面形貌。空腔被限定在绝缘体衬底层内并由绝缘体衬底层包含，并且电介质材料至少部分地填充空腔。介电材料连接到电导体，通孔用于互连和迹线。在一个方面，多个堆叠的绝缘体衬底层限定了填充有电介质材料的多个空腔，提供了更大的电容。在另一方面，在绝缘体基底层中形成空腔阵列。嵌入式电容器可以用在许多使用诸如压力传感器，发动机控制模块，变速器控制器和包括卫星无线电设备的无线电系统的汽车电子产品的电容器的系统中。

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