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    • 11. 发明申请
    • SEMICONDUCTOR LIGHT EMITTING DEVICE
    • 半导体发光器件
    • US20120138889A1
    • 2012-06-07
    • US13198105
    • 2011-08-04
    • Koichi TACHIBANAHajime NagoToshiki HikosakaShigeya KimuraShinya Nunoue
    • Koichi TACHIBANAHajime NagoToshiki HikosakaShigeya KimuraShinya Nunoue
    • H01L33/04
    • H01L33/325H01L33/02H01L33/06H01L33/32H01L33/40H01S5/32341
    • According to one embodiment, a semiconductor light emitting device includes an n-type semiconductor layer, a p-type semiconductor layer, a light emitting part, and a p-side electrode. The light emitting part is provided between the n-type and the p-type semiconductor layers, and includes a plurality of barrier layers and a plurality of well layers. The p-side electrode contacts the p-type semiconductor layer. The p-type semiconductor layer includes first, second, third, and fourth p-type layers. The first p-type layer contacts the p-side electrode. The second p-type layer contacts the light emitting part. The third p-type layer is provided between the first p-type layer and the second p-type layer. The fourth p-type layer is provided between the second p-type layer and the third p-type layer. The second p-type layer contains Al and contains a p-type impurity in a lower concentration lower than that in the first concentration.
    • 根据一个实施例,半导体发光器件包括n型半导体层,p型半导体层,发光部分和p侧电极。 发光部分设置在n型和p型半导体层之间,并且包括多个势垒层和多个阱层。 p侧电极与p型半导体层接触。 p型半导体层包括第一,第二,第三和第四p型层。 第一p型层与p侧电极接触。 第二p型层与发光部接触。 第三p型层设置在第一p型层和第二p型层之间。 第四p型层设置在第二p型层和第三p型层之间。 第二p型层含有Al并含有比第一浓度低的浓度的p型杂质。
    • 12. 发明申请
    • SEMICONDUCTOR LIGHT EMITTING DEVICE
    • 半导体发光器件
    • US20110198561A1
    • 2011-08-18
    • US12874510
    • 2010-09-02
    • Koichi TACHIBANAHajime NagoToshiki HikosakaShigeya KimuraShinya Nunoue
    • Koichi TACHIBANAHajime NagoToshiki HikosakaShigeya KimuraShinya Nunoue
    • H01L33/32
    • H01L33/145B82Y20/00H01L33/06H01L33/32H01S5/34333
    • According to one embodiment, a semiconductor light emitting device includes an n-type semiconductor layer, a p-type semiconductor layer, a light emitting portion, a first layer, a second layer, and an intermediate layer. The semiconductor layers include nitride semiconductor. The light emitting portion is provided between the n-type semiconductor layer and the p-type semiconductor layer and includes a quantum well layer. The first layer is provided between the light emitting portion and the p-type semiconductor layer and includes AlX1Ga1-x1N having first Al composition ratio x1. The second layer is provided between the first layer and the p-type semiconductor layer and includes Alx2Ga1-x2N having second Al composition ratio x2 higher than the first Al composition ratio x1. The intermediate layer is provided between the first layer and the light emitting portion and has a thickness not smaller than 3 nanometers and not larger than 8 nanometers and includes Inz1Ga1-z1N (0≦z1
    • 根据一个实施例,半导体发光器件包括n型半导体层,p型半导体层,发光部分,第一层,第二层和中间层。 半导体层包括氮化物半导体。 发光部分设置在n型半导体层和p型半导体层之间,并且包括量子阱层。 第一层设置在发光部和p型半导体层之间,并且包括具有第一Al组成比x1的AlX1Ga1-x1N。 第二层设置在第一层和p型半导体层之间,并且包括具有比第一Al组成比x1高的第二Al组成比x2的Al x2 Ga1-x2N。 中间层设置在第一层和发光部之间,并且具有不小于3纳米且不大于8纳米的厚度,并且包括Inz1Ga1-z1N(0&nlE; z1 <1)。
    • 13. 发明授权
    • Semiconductor light emitting device
    • 半导体发光器件
    • US08643044B2
    • 2014-02-04
    • US13222912
    • 2011-08-31
    • Koichi TachibanaShigeya KimuraToshiki HikosakaTaisuke SatoToshiyuki OkaShinya Nunoue
    • Koichi TachibanaShigeya KimuraToshiki HikosakaTaisuke SatoToshiyuki OkaShinya Nunoue
    • H01L33/00
    • H01L33/42
    • According to one embodiment, a semiconductor light emitting device includes: a stacked structure body, first and second electrodes, and a pad layer. The body includes first semiconductor layer of a first conductivity type, a light emitting layer, and a second semiconductor layer of second conductivity type. The first semiconductor layer has first and second portions. The light emitting layer is provided on the second portion. The second semiconductor layer is provided on the light emitting layer. The first electrode is provided on the first portion. The second electrode is provided on the second semiconductor layer and is transmittable to light emitted from the light emitting layer. The pad layer is connected to the second electrode. A transmittance of the pad layer is lower than that of the second electrode. A sheet resistance of the second electrode increases continuously along a direction from the pad layer toward the first electrode.
    • 根据一个实施例,半导体发光器件包括:堆叠结构体,第一和第二电极以及衬垫层。 主体包括第一导电类型的第一半导体层,发光层和第二导电类型的第二半导体层。 第一半导体层具有第一和第二部分。 发光层设置在第二部分上。 第二半导体层设置在发光层上。 第一电极设置在第一部分上。 第二电极设置在第二半导体层上,并且可透射到从发光层发射的光。 焊盘层连接到第二电极。 焊盘层的透射率低于第二电极的透射率。 第二电极的薄层电阻沿着从衬垫层向第一电极的方向连续地增加。
    • 18. 发明授权
    • Semiconductor light emitting device
    • 半导体发光器件
    • US08895956B2
    • 2014-11-25
    • US13218827
    • 2011-08-26
    • Shigeya KimuraKoichi TachibanaHajime NagoShinya Nunoue
    • Shigeya KimuraKoichi TachibanaHajime NagoShinya Nunoue
    • H01L33/04H01L33/32H01L33/06
    • H01L33/06H01L33/32
    • According to one embodiment, a semiconductor light emitting device includes an n-type first semiconductor layer, a p-type second semiconductor layer and a light emitting layer. The light emitting layer is provided between the first and second semiconductor layers, and includes a plurality of barrier layers including a nitride semiconductor and a well layer provided between the barrier layers and including a nitride semiconductor containing In. The barrier layers and the well layer are stacked in a first direction from the second semiconductor layer toward the first semiconductor layer. The well layer has a p-side interface part and an n-side interface part. Each of the p-side and the n-side interface part include an interface with one of the barrier layers. A variation in a concentration of In in a surface perpendicular to the first direction of the p-side interface part is not more than that of the n-side interface part.
    • 根据一个实施例,半导体发光器件包括n型第一半导体层,p型第二半导体层和发光层。 发光层设置在第一和第二半导体层之间,并且包括多个阻挡层,包括氮化物半导体和设置在阻挡层之间的阱层,并且包括含有In的氮化物半导体。 阻挡层和阱层从第二半导体层向第一半导体层沿第一方向堆叠。 阱层具有p侧接口部和n侧接口部。 p侧和n侧接口部分中的每一个包括与阻挡层中的一个的界面。 在垂直于p侧接口部分的第一方向的表面中的In浓度的变化不大于n侧接口部分的浓度变化。