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11. 发明申请

US20120230808A1 SUBSTRATE TRANSPORT APPARATUS, SUBSTRATE TRANSPORT METHOD, AND RECORDING MEDIUM 有权
标题翻译：基板运输装置，基板运输方法和记录介质
公开(公告)号：US20120230808A1
公开(公告)日：2012-09-13
申请号：US13410447
申请日：2012-03-02
申请人： Katsuhiko Oyama , Yasushi Takeuchi
发明人： Katsuhiko Oyama , Yasushi Takeuchi
IPC分类号： B05C13/00 , C23C16/44
CPC分类号： H01L21/67742 , C23C16/4583 , H01L21/67303 , H01L21/67309 , H01L21/67757 , H01L21/67766 , H01L21/67781 , H01L21/68707
摘要： A substrate transport apparatus includes a first fork which is disposed to be movable in a forward/backward direction to a substrate holding part to transport a stacked member to or receive the stacked member from the substrate holding part. A second fork is arranged to be reversible and disposed above the first fork to be movable in a forward/backward direction to an accommodating part that accommodates substrates and spacer members to transport a substrate or a spacer member between the accommodating part and the first fork. A first grip module is disposed on a first surface of the second fork to hold and support the substrate from an upward direction. A second grip module is disposed on the first surface of the second fork on the same side as the first grip module to hold and support the spacer member from an upward direction.
摘要翻译：一种基板输送装置，包括：第一叉，其设置成能够向前/后方向移动到基板保持部，以将堆叠构件从基板保持部输送到或接收所述堆叠构件。第二叉被布置为可逆的并且设置在第一叉上方，以可向前/向后方向移动到容纳部分的容纳部分，以容纳衬底和间隔构件，以将基片或间隔构件输送在容纳部分和第一叉之间。第一夹持模块设置在第二叉的第一表面上，以从上方保持和支撑基板。第二夹持模块设置在与第一夹持模块相同侧的第二叉的第一表面上，以从上方保持并支撑间隔构件。

12. 发明申请

US20120230805A1 SUBSTRATE CONVEYING METHOD, RECORDING MEDIUM IN WHICH PROGRAM IS RECORDED FOR CAUSING SUBSTRATE CONVEYING METHOD TO BE EXECUTED, AND SUBSTRATE CONVEYOR 有权
标题翻译：基板输送方法，用于引导要执行的基板输送方法记录的程序的记录介质和基板输送器
公开(公告)号：US20120230805A1
公开(公告)日：2012-09-13
申请号：US13410368
申请日：2012-03-02
申请人： Daisuke YAMAGISHI , Katsuhiko Oyama , Masataka Sato , Yasushi Takeuchi
发明人： Daisuke YAMAGISHI , Katsuhiko Oyama , Masataka Sato , Yasushi Takeuchi
IPC分类号： H01L21/67 , B66C3/00
CPC分类号： H01L21/67757 , C23C16/4583 , H01L21/67109 , H01L21/67303 , H01L21/67309 , H01L21/67781 , H01L21/68707
摘要： A substrate conveying method conveying a layered body having first and second substrates stacked with a spacer member provided between their respective bottom surfaces facing each other includes receiving the first substrate by holding the first substrate from below its bottom surface using a first holding mechanism provided on a side of a first fork provided above a second fork, and turning the first fork upside down and placing the received first substrate on the second fork; receiving the spacer member held in a substrate holding part by holding the spacer member from above using a second holding mechanism provided on the same side of the first fork as the first holding mechanism, and placing the received spacer member on the first substrate; and holding the second substrate from above its top surface using the first holding mechanism, and placing the received second substrate on the spacer member.
摘要翻译：传送具有第一和第二基板的层叠体的基板输送方法，所述层叠体具有设置在彼此相对的彼此彼此相对的底表面之间的间隔件的堆叠，包括通过使用设置在第一基板上的第一保持机构从第一基板的下表面设置在第二叉子上方的第一叉子的侧面，并且将第一叉子倒置并将接收到的第一基板放置在第二叉子上; 通过使用设置在与所述第一保持机构相同的第一叉的同一侧上的第二保持机构从所述第一保持机构接收通过从上方保持所述间隔部件而保持在基板保持部中的所述间隔部件，并将所接收的间隔部件放置在所述第一基板上; 并且使用第一保持机构从其上表面上方保持第二基板，并将接收的第二基板放置在间隔件上。

13. 发明授权

US09368384B2 Substrate conveying method, recording medium in which program is recorded for causing substrate conveying method to be executed, and substrate conveyor 有权
标题翻译：基板输送方法，其中记录用于使基板输送方法执行的程序的记录介质和基板输送机
公开(公告)号：US09368384B2
公开(公告)日：2016-06-14
申请号：US13410368
申请日：2012-03-02
申请人： Daisuke Yamagishi , Katsuhiko Oyama , Masataka Sato , Yasushi Takeuchi
发明人： Daisuke Yamagishi , Katsuhiko Oyama , Masataka Sato , Yasushi Takeuchi
IPC分类号： B65H1/00 , H01L21/677 , H01L21/67 , H01L21/673 , H01L21/687 , C23C16/458
CPC分类号： H01L21/67757 , C23C16/4583 , H01L21/67109 , H01L21/67303 , H01L21/67309 , H01L21/67781 , H01L21/68707
摘要： A substrate conveying method conveying a layered body having first and second substrates stacked with a spacer member provided between their respective bottom surfaces facing each other includes receiving the first substrate by holding the first substrate from below its bottom surface using a first holding mechanism provided on a side of a first fork provided above a second fork, and turning the first fork upside down and placing the received first substrate on the second fork; receiving the spacer member held in a substrate holding part by holding the spacer member from above using a second holding mechanism provided on the same side of the first fork as the first holding mechanism, and placing the received spacer member on the first substrate; and holding the second substrate from above its top surface using the first holding mechanism, and placing the received second substrate on the spacer member.
摘要翻译：传送具有第一和第二基板的层叠体的基板输送方法，所述层叠体具有设置在彼此相对的彼此彼此相对的底表面之间的间隔件的堆叠，包括通过使用设置在第一基板上的第一保持机构从第一基板的下表面设置在第二叉子上方的第一叉子的侧面，并且将第一叉子倒置并将接收到的第一基板放置在第二叉子上; 通过使用设置在与所述第一保持机构相同的第一叉的同一侧上的第二保持机构从所述第一保持机构接收通过从上方保持所述间隔部件而保持在基板保持部中的所述间隔部件，并将所接收的间隔部件放置在所述第一基板上; 并且使用第一保持机构从其上表面上方保持第二基板，并将接收的第二基板放置在间隔件上。

14. 发明授权

US09048273B2 Substrate conveying container opening/closing device, lid opening/closing device and semiconductor manufacturing apparatus 有权
标题翻译：基板输送容器开闭装置，盖开闭装置及半导体制造装置
公开(公告)号：US09048273B2
公开(公告)日：2015-06-02
申请号：US13488713
申请日：2012-06-05
申请人： Katsuhiko Oyama , Katsuyuki Hishiya , Yasushi Takeuchi
发明人： Katsuhiko Oyama , Katsuyuki Hishiya , Yasushi Takeuchi
IPC分类号： H01L21/677
CPC分类号： H01L21/67772
摘要： A substrate conveying container opening/closing device includes an elevator carriage provided in a substrate transfer area and configured to be moved up and down by an elevator mechanism, a cover member for opening and closing an opening of a wall, a seal member for sealing a gap between the cover member and the periphery of the opening, a lid detaching/attaching mechanism provided in the cover member and configured to detach and attach the lid, a guide unit provided in the elevator carriage and configured to guide the cover member upward so that the cover member can advance from a retracting position toward the wall, a guideway provided in the wall to extend in a direction perpendicular to a seal surface of the opening, and a rotating body provided in the cover member and configured to roll downward along the guideway as the elevator carriage is moved downward.
摘要翻译：基板输送容器开闭装置具备：设置在基板输送区域中的升降台，其构造为通过升降机构上下移动，用于开闭壁部开口部的盖部件，密封部件盖构件和开口周边之间的间隙，设置在盖构件中并构造成拆卸和附接盖的盖拆卸/附接机构，设置在升降机托架中并构造成向上引导盖构件的引导单元，使得盖构件可以从缩回位置朝向壁前进，设置在壁中以沿着与开口的密封表面垂直的方向延伸的导轨以及设置在盖构件中并构造成沿着导轨向下滚动的旋转体当电梯托架向下移动时。

15. 发明申请

US20070110548A1 Processing apparatus 审中-公开
标题翻译：处理装置
公开(公告)号：US20070110548A1
公开(公告)日：2007-05-17
申请号：US10561799
申请日：2004-06-29
申请人： Katsuhiko Oyama , Shinya Mochiduki , Yasushi Takeuchi
发明人： Katsuhiko Oyama , Shinya Mochiduki , Yasushi Takeuchi
IPC分类号： B65B69/00
CPC分类号： H01L21/67772
摘要： The present invention is a processing apparatus for an object to be processed, the processing apparatus including: a partition that defines an outside space area in which a container hermetically containing an object to be processed and having a lid is conveyed, and an inside space area in which the object to be processed taken out from the container is conveyed; an opening part provided in the partition, through which the two space areas are communicated with each other; a door mechanism that can close the opening part; a lid opening-and-closing mechanism provided at the door mechanism, and capable of opening and closing the lid of the container located at a predetermined position in the outside space area under a situation wherein the door mechanism closes the opening part; a driving unit that moves the lid opening-and-closing mechanism away from the container relatively to the door mechanism; a cover member that defines a driving-unit arrangement room, in which the driving unit is contained, in the door mechanism; and a gas-discharging mechanism that discharges a gas in the driving-unit arrangement room.
摘要翻译：本发明是一种处理对象物的处理装置，该处理装置包括：限定外部空间区域的分隔物，在该空间区域中密封有被处理物体的盖子的容器被输送，内部空间区域其中从容器中取出的待处理物体被传送; 设置在所述分区内的开口部，所述两个空间区域通过所述开口部彼此连通; 可以关闭开口部的门机构; 盖门打开和关闭机构，设置在门机构处，并且能够在门机构关闭开口部的情况下打开和关闭位于外部空间区域中的预定位置的容器的盖子; 驱动单元，其使盖开闭机构相对于门机构远离容器移动; 盖构件，其限定在所述门机构中容纳所述驱动单元的驱动单元布置室; 以及排出驱动单元配置室中的气体的气体排出机构。

16. 发明授权

US09136152B2 Substrate transport apparatus, substrate transport method, and recording medium 有权
标题翻译：基板输送装置，基板输送方法和记录介质
公开(公告)号：US09136152B2
公开(公告)日：2015-09-15
申请号：US13410447
申请日：2012-03-02
申请人： Katsuhiko Oyama , Yasushi Takeuchi
发明人： Katsuhiko Oyama , Yasushi Takeuchi
IPC分类号： H01L21/677 , C23C16/458 , H01L21/673 , H01L21/687
CPC分类号： H01L21/67742 , C23C16/4583 , H01L21/67303 , H01L21/67309 , H01L21/67757 , H01L21/67766 , H01L21/67781 , H01L21/68707
摘要： A substrate transport apparatus includes a first fork which is disposed to be movable in a forward/backward direction to a substrate holding part to transport a stacked member to or receive the stacked member from the substrate holding part. A second fork is arranged to be reversible and disposed above the first fork to be movable in a forward/backward direction to an accommodating part that accommodates substrates and spacer members to transport a substrate or a spacer member between the accommodating part and the first fork. A first grip module is disposed on a first surface of the second fork to hold and support the substrate from an upward direction. A second grip module is disposed on the first surface of the second fork on the same side as the first grip module to hold and support the spacer member from an upward direction.
摘要翻译：一种基板输送装置，包括：第一叉，其设置成能够向前/后方向移动到基板保持部，以将堆叠构件从基板保持部输送到或接收所述堆叠构件。第二叉被布置为可逆的并且设置在第一叉上方，以可向前/向后方向移动到容纳部分的容纳部分，以容纳衬底和间隔构件，以将基片或间隔构件输送在容纳部分和第一叉之间。第一夹持模块设置在第二叉的第一表面上，以从上方保持和支撑基板。第二夹持模块设置在与第一夹持模块相同侧的第二叉的第一表面上，以从上方保持并支撑间隔构件。

17. 发明授权

US07073999B2 Receiving container body for object to be processed 失效
标题翻译：接收被处理物体的容器体
公开(公告)号：US07073999B2
公开(公告)日：2006-07-11
申请号：US10516511
申请日：2003-05-26
申请人： Katsuhiko Oyama
发明人： Katsuhiko Oyama
IPC分类号： H01L21/677 , B65D85/30
CPC分类号： H01L21/67369 , H01L21/67373 , H01L21/67379 , Y10S414/14
摘要： The present invention includes: a box case having a size capable of containing an open type of cassette that can hold a plurality of first objects to be processed and capable of containing a plurality of second objects to be processed, the second objects to be processed being larger than the first objects to be processed; a supporting part provided at an inside wall surface of the box case, the supporting part being capable of supporting the second objects to be processed in a tier-like manner; an open-close lid provided at an opening part of the box case in a removable and attachable manner; and a positioning-engaging part provided at a bottom part of the box case in a removable and attachable manner. The open-close lid is capable of sealing the box case. The positioning-engaging part is capable of engaging with a positioning part provided at a lower surface of a bottom part of the cassette to position the cassette.
摘要翻译：本发明包括：具有能够容纳能够容纳待处理的多个第一待处理对象的能够容纳多个待处理对象的开放式盒的大小的箱体，第二待处理对象为大于第一个要处理的物体; 支撑部，其设置在所述盒壳体的内壁面上，所述支撑部能够以层状的方式支撑待处理的第二物体; 以可拆卸和可附接的方式设置在箱壳的开口部分处的开闭盖; 以及以可拆卸和可附接的方式设置在箱体的底部的定位接合部。打开的盖子能够密封箱体。定位接合部能够与设置在盒的底部的下表面处的定位部分接合以定位盒。

18. 发明授权

US06861738B2 Laminated-chip semiconductor device 失效
标题翻译：层压半导体器件
公开(公告)号：US06861738B2
公开(公告)日：2005-03-01
申请号：US10156819
申请日：2002-05-30
申请人： Katsuhiko Oyama , Mitsuyoshi Endo , Chiaki Takubo , Takashi Yamazaki , Takashi Imoto
发明人： Katsuhiko Oyama , Mitsuyoshi Endo , Chiaki Takubo , Takashi Yamazaki , Takashi Imoto
IPC分类号： H01L25/18 , H01L23/50 , H01L23/538 , H01L25/065 , H01L25/07 , H01L25/10 , H01L23/02
CPC分类号： H01L23/5382 , H01L25/0657 , H01L25/105 , H01L2224/16
摘要： There is disclosed a laminated-chip semiconductor device which comprises two chip-mounting substrates on each of which at least one semiconductor chip having a plurality of terminals for signals is mounted, and a plurality of chip connecting wirings electrically connected to the terminals for signals of the each semiconductor chip which are mounted on the chip-mounting substrates are formed in a same pattern, and which are laminated along a thickness direction, and one intermediate substrate which is arranged between the two chip-mounting substrates, and in which a plurality of interlayer connecting wirings electrically connected to each of the plurality of chip connecting wirings of the adjacent chip-mounting substrate are formed in a predetermined wiring pattern.
摘要翻译：公开了一种层叠芯片半导体器件，其包括两个芯片安装基板，每个芯片安装基板上安装有至少一个具有多个用于信号的端子的半导体芯片，以及电连接到端子的多个芯片连接布线，安装在芯片安装基板上的每个半导体芯片以相同的图案形成，并且沿着厚度方向层叠，并且一个中间基板被布置在两个芯片安装基板之间，并且其中多个电连接到相邻芯片安装基板的多个芯片连接布线中的每一个的层间连接布线以预定布线图形形成。

19. 发明授权

US06429372B1 Semiconductor device of surface mounting type and method for fabricating the same 有权
标题翻译：表面安装型半导体器件及其制造方法
公开(公告)号：US06429372B1
公开(公告)日：2002-08-06
申请号：US09256220
申请日：1999-02-24
申请人： Hideo Taguchi , Junichi Asada , Jun Omori , Toshikazu Mino , Naohisa Okumura , Hiroshi Shimoe , Toshitsune Iijima , Katsuhiko Oyama
发明人： Hideo Taguchi , Junichi Asada , Jun Omori , Toshikazu Mino , Naohisa Okumura , Hiroshi Shimoe , Toshitsune Iijima , Katsuhiko Oyama
IPC分类号： H01L2328
CPC分类号： H01L24/85 , H01L23/3121 , H01L23/4985 , H01L23/49894 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/05554 , H01L2224/32225 , H01L2224/45015 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/48465 , H01L2224/73215 , H01L2224/78301 , H01L2224/85 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01029 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/18165 , H01L2924/20753 , H01L2924/351 , H01L2924/20752 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/85399 , H01L2224/05599
摘要： An IC chip and overhang portions are stuck to tape by an adhesive agent layer having elasticity. A plurality of solder balls are attached to the tape. By soldering the solder balls to a printed board, a semiconductor device is mounted. In the case where a temperature cycle has been caused, thermal stress occurs between the IC chip and the printed board or between the hangover portion and the printed board because of a difference in coefficient of thermal expansion between the IC chip or the hangover portion and the printed board. However, this thermal stress is absorbed by the elasticity of the adhesive agent layer. As a result, little thermal stress is applied to solder balls. Even if the above described temperature cycle is repeated, therefore, the solder balls are electrically connected to the printed board stably over a long period of time. In addition, the area of the tape is widened by the area of the hangover portions. Accordingly, a larger number of solder balls can be attached to the tape without reducing the size of each of the solder balls.
摘要翻译：通过具有弹性的粘合剂层将IC芯片和突出部分粘附到带上。多个焊球附着在带子上。通过将焊球焊接到印刷电路板上，安装半导体器件。在发生了温度循环的情况下，由于IC芯片或者宿醉部分之间的热膨胀系数不同，IC芯片和印刷电路板之间或者宿醉部分和印刷电路板之间产生热应力印刷板然而，这种热应力被粘合剂层的弹性所吸收。结果，焊球几乎没有热应力。因此，即使重复上述的温度循环，焊料球长期稳定地电连接到印刷电路板上。此外，带的面积由宿醉部分的面积加宽。因此，可以在不减小每个焊球的尺寸的情况下将更多数量的焊球附着到带上。

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