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    • 13. 发明授权
    • Substrate developing method and apparatus
    • 基板显影方法及装置
    • US6000862A
    • 1999-12-14
    • US725846
    • 1996-10-04
    • Seiichiro OkudaKenji Sugimoto
    • Seiichiro OkudaKenji Sugimoto
    • H01L21/027B05C11/08G03F7/30G03D7/00G03D5/00
    • B05C11/08G03F7/3021
    • A substrate developing method and apparatus for improving uniformity of a developing process by adjusting a temperature gradient of a developer spread over the surface of a substrate. The developer is delivered to a central region of the substrate surface and spread over the surface. The developer in this state has activity diminishing, and thereby lowering the developing rate, gradually from center to edge of the substrate. With a gas flowing down around the edge of the substrate during the developing process, the developer vaporizes from peripheral regions of the substrate at an increased rate, thereby lowering the developer temperature in the peripheral regions. This increases the developing rate gradually from edge to center of the substrate. The uniformity of the developing process is improved by balancing the gradient of developing rate due to the temperature variation of the developer against the gradient of developing rate due to the lowering of developer activity.
    • 一种用于通过调节在衬底表面上展开的显影剂的温度梯度来改善显影过程的均匀性的衬底显影方法和装置。 显影剂被输送到基底表面的中心区域并且在表面上分布。 在这种状态下的显影剂的活性逐渐降低,从而降低了显影速率,从衬底的中心到边缘逐渐降低。 在显影过程中,气体沿着衬底的边缘向下流动,显影剂以增加的速率从衬底的周边区域蒸发,从而降低了周边区域中的显影剂温度。 这从基板的边缘到中心逐渐增加显影速率。 通过平衡由于显影剂活性降低引起的显影剂的温度变化与显影速率梯度的显影速率梯度的改善,改善了显影过程的均匀性。
    • 16. 发明授权
    • Method and apparatus for drying a substrate having a resist film with a
miniaturized pattern
    • 干燥具有小型化图案的抗蚀剂膜的基板的方法和装置
    • US5678116A
    • 1997-10-14
    • US417133
    • 1995-04-04
    • Kenji SugimotoHiroaki SugimotoMasaru Kitagawa
    • Kenji SugimotoHiroaki SugimotoMasaru Kitagawa
    • G03F7/30G03F7/40H01L21/00G03D3/02G03D5/00
    • H01L21/67051G03F7/3021G03F7/40
    • A method of processing a substrate includes the steps of developing a substrate having a photo-sensitive resin film formed on its surface; washing the substrate by supplying washing liquid to the surface of the substrate, and rotating the substrate on a perpendicular axis in a horizontal plane and thereby drying the surface of the substrate, and atmosphere in which the substrate is placed is adjusted to be at a pressure lower than the atmospheric pressure in the step of drying the surface of the substrate. Instead of or in addition to this, washing liquid in which prescribed gas is dissolved may be used in the step of washing the substrate. In this case, in the step of drying the surface of the substrate, washing liquid supplied to the surface of the substrate is preferably supersaturated with gas. A substrate processing apparatus including a controller for implementing such a method is also disclosed.
    • 一种处理衬底的方法包括以下步骤:在其表面上形成具有光敏树脂膜的衬底; 通过向基板的表面供给洗涤液来洗涤基板,并使基板在水平面上的垂直轴上旋转,从而干燥基板的表面,并且将其中放置基板的气氛调节到压力 低于在干燥基材表面的步骤中的大气压。 代替或除此之外,在洗涤基底的步骤中可以使用其中溶解有规定气体的洗涤液。 在这种情况下,在干燥基板的表面的步骤中,供给到基板表面的洗涤液优选用气体过饱和。 还公开了一种包括用于实现这种方法的控制器的衬底处理设备。
    • 17. 发明授权
    • Compound lathe
    • 复合车床
    • US4087890A
    • 1978-05-09
    • US592967
    • 1975-07-03
    • Shinichi IshizukaKenji Sugimoto
    • Shinichi IshizukaKenji Sugimoto
    • B23B3/16B23B7/06B23B13/12B23B29/32B23B31/20B23B11/00B23B13/02
    • B23B29/323B23B13/126B23B3/16B23B31/205B23B7/06Y10T29/5114Y10T29/5126Y10T29/5155Y10T408/37Y10T82/2593
    • A compound lathe in which a headstock is horizontally movable along a spindle axis to provide longitudinal feeding of a workpiece mounted for rotation with the spindle and a saddle carrying a turret is vertically movable to provide transverse feeding. The saddle is slidably disposed on vertical guideways which is formed on a column mounted on a bed at the back of the headstock rearwardly of cutting areas of the workpiece and which vertically extends in a plane parallel to the axis of the spindle. The turret supports tools for turning, milling, drilling and other operations. Numerically controlled servo motors preferably position the headstock and saddle. A secondary workpiece gripping means is provided to grip the end of the workpiece opposite the headstock and is releasably connected to the headstock for movement therewith. The gripping means allows accurate secondary machining of the cut-off portion of a parted workpiece by the tools on the turret.
    • 一种复合车床,其中主轴箱可沿着主轴轴线水平移动,以提供安装成与主轴一起旋转的工件的纵向进给,并且具有承载转台的鞍座可垂直移动以提供横向进给。 鞍座可滑动地设置在垂直导轨上,该垂直导轨形成在安装在主轴箱背面的床上的柱上,该床在工件的切割区域的后面,并且在平行于心轴的平面的垂直方向上垂直延伸。 转塔支持车削,铣削,钻孔和其他操作的工具。 数控伺服电机优选地定位头架和鞍座。 第二工件夹持装置被设置成夹紧工件的与主轴箱相对的端部,并且可释放地连接到主轴箱以与其一起运动。 夹持装置允许通过转台上的工具对分割工件的切割部分进行精确的二次加工。
    • 18. 发明授权
    • Substrate processing apparatus
    • 基板加工装置
    • US07364376B2
    • 2008-04-29
    • US10846874
    • 2004-05-13
    • Kenji SugimotoKenji Kamei
    • Kenji SugimotoKenji Kamei
    • G03D5/00
    • H01L21/67276H01L21/67253
    • After an exposure process in an exposure part, the exposure part transmits an exposure completion signal to a main controller. At time (t12) which is a predetermined time interval (T12) later than an exposure completion time (t11), the main controller transmits a substrate transport signal to a heating part, to cause the transport of a substrate from a temporary substrate rest part to a heating plate and the start of a heating process by the heating plate. This provides substantially the same length of the time interval between the completion of the exposure process and the start of the heating process in the heating part, if there are variations in the time at which each substrate is placed on the temporary substrate rest part of the heating part.
    • 在曝光部分中的曝光处理之后,曝光部分将曝光完成信号发送到主控制器。 在比曝光完成时间(t11)晚的预定时间间隔(T12)的时间(t12),主控制器将基板传送信号发送到加热部分,以使基板从临时基板固定部分 到加热板并通过加热板开始加热处理。 这提供了在完成曝光处理和加热部分中的加热处理开始之间的时间间隔的基本上相同的长度,如果每个基板被放置在基板的临时基板搁置部分上的时间有变化 加热部分。
    • 20. 发明申请
    • Substrate processing apparatus and substrate processing method
    • 基板加工装置及基板处理方法
    • US20060024446A1
    • 2006-02-02
    • US11144530
    • 2005-06-02
    • Kenji SugimotoYukihiko Inagaki
    • Kenji SugimotoYukihiko Inagaki
    • B05D3/02
    • H01L21/67178C03C17/002H01L21/67017H01L21/67253
    • A substrate processing apparatus comprises a plurality of second coating processing units responsible for coating, a gas supply mechanism for supplying clean air through a supply path, and a cell controller. Each of the second coating processing units is provided with a control plate and an exhaust fun unit. The opening of the supply path is controlled by adjusting the angle of rotation of the control plate. The cell controller adjusts the angle of rotation of each control plate based on a setting previously determined to independently control the amount of air supply to the second coating processing units. Thus the pressures within the second coating processing units are controlled such that the second coating processing units provide substantially the same processing result. As a result, the difference among the plurality of second coating processing units can be suppressed.
    • 基板处理装置包括负责涂布的多个第二涂布处理单元,用于通过供给路径供给清洁空气的气体供给机构和单元控制器。 每个第二涂布处理单元设置有控制板和排气功能单元。 通过调节控制板的旋转角来控制供给路径的开度。 电池控制器基于预先确定为独立地控制向第二涂覆处理单元供应的空气量的设定来调节每个控制板的旋转角度。 因此,控制第二涂覆处理单元内的压力,使得第二涂布处理单元提供基本上相同的处理结果。 结果,可以抑制多个第二涂覆处理单元之间的差异。