专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

11. 发明授权

US06900394B1 Electroless copper plating machine, and multi-layer printed wiring board 失效
标题翻译：无电镀铜机，多层印刷线路板
公开(公告)号：US06900394B1
公开(公告)日：2005-05-31
申请号：US09678800
申请日：2000-10-04
申请人： Takeyuki Itabashi , Haruo Akahoshi , Tadashi Iida , Yoshinori Ueda , Eiji Takai , Naoki Nishimura
发明人： Takeyuki Itabashi , Haruo Akahoshi , Tadashi Iida , Yoshinori Ueda , Eiji Takai , Naoki Nishimura
IPC分类号： H05K3/46 , C23C18/16 , C23C18/31 , C23C18/40 , H05K3/18 , H01R12/04 , H05K1/11
CPC分类号： C23C18/1617 , C23C18/40 , H05K3/187
摘要： A method is provided for removing plating blocking ions, such as anions, in pairs with copper ions and oxidant ions of a copper ion reducing agent from an electroless copper plating solution and keeping a constant salt concentration in the electroless copper plating solution during plating. The electroless copper plating method uses a plating solution containing copper sulfate as copper ion sources, and a copper ion complexing agent as copper ion sources, glyoxylic acid as a copper ion reducing agent, and a pH conditioner. The method is characterized by precipitating and removing sulfuric and oxalic ions in said electroless copper plating solution and keeping an optimum concentration of at least one of sulfuric and oxalic ions in said electroless copper plating solution during plating.
摘要翻译：提供了一种从电化学镀铜溶液中去除铜离子还原剂的铜离子和氧化剂离子的电镀阻挡离子（例如阴离子）的方法，并且在镀覆期间在化学镀铜溶液中保持恒定的盐浓度。无电镀铜方法使用含有硫酸铜作为铜离子源的镀液，铜离子源铜离子络合剂，作为铜离子还原剂的乙醛酸和pH调节剂。该方法的特征在于在所述化学镀铜溶液中析出和除去硫酸和草酸离子，并且在镀覆期间保持所述无电镀铜溶液中的硫酸和草酸离子中的至少一种的最佳浓度。

12. 发明授权

US06894365B2 Semiconductor device having an integral resistance element 失效
标题翻译：具有积分电阻元件的半导体器件
公开(公告)号：US06894365B2
公开(公告)日：2005-05-17
申请号：US09431593
申请日：1999-11-01
申请人： Yoshinori Ueda
发明人： Yoshinori Ueda
IPC分类号： H01L27/04 , H01L21/336 , H01L21/822 , H01L21/8234 , H01L27/06 , H01L27/08 , H01L29/78 , H01L29/00
CPC分类号： H01L27/0802
摘要： A resistance element of a semiconductor device includes a first resistance pattern and a second resistance pattern formed adjacent to the first resistance pattern at a lower level, wherein the second resistance pattern is defined by the first resistance pattern in a self-aligned relationship and connected to the first resistance pattern in series.
摘要翻译：半导体器件的电阻元件包括在较低电平下与第一电阻图形相邻形成的第一电阻图案和第二电阻图案，其中第二电阻图案由第一电阻图案以自对准关系定义并连接到第一个电阻模式串联。

13. 发明申请

US20130116271A1 TACROLIMUS-CONTAINING OIL-IN-WATER TYPE CREAMY COMPOSITION 审中-公开
标题翻译：含水包油水型乳品组合物
公开(公告)号：US20130116271A1
公开(公告)日：2013-05-09
申请号：US13810460
申请日：2011-07-22
申请人： Mikito Ihara , Yoshinori Ueda
发明人： Mikito Ihara , Yoshinori Ueda
IPC分类号： A61K31/439
CPC分类号： A61K31/439 , A61K9/0014 , A61K9/107 , A61K31/436 , A61K47/02 , A61K47/14 , A61K47/32 , A61K47/34 , A61K47/38
摘要： The purpose is to provide a tacrolimus-containing pharmaceutical composition which is a creamy preparation for external application having good feeling upon use and has high stability of a main ingredient contained therein (high main ingredient residual ratio), and allows easy control of skin concentration of the main ingredient.The present invention relates to an oil-in-water type creamy composition comprising (A) tacrolimus, a pharmaceutically acceptable salt thereof, or a pharmaceutically acceptable solvate thereof, (B) an oil prepared by mixing (a) a medium-chain fatty acid triglyceride with (b) ethylene glycol salicylate and/or diisopropyl sebacate, (C) an emulsifying agent having a HLB value of 12 or more, and (D) a hydrophilic polymer, and having a pH value of 4 to 7.
摘要翻译：其目的在于提供含有他克莫司的药物组合物，该组合物是外用的乳状制剂，具有良好的使用感，并且其中含有的主要成分具有高稳定性（高主成分残留率），并且容易控制皮肤浓度主要成分。本发明涉及一种水包油型乳脂组合物，其包含（A）他克莫司，其药学上可接受的盐或其药学上可接受的溶剂合物，（B）通过将（a）中链脂肪酸甘油三酸酯与（b）乙二醇水杨酸酯和/或二异丙基癸二酸酯，（C）HLB值为12以上的乳化剂，（D）亲水性聚合物，pH值为4〜7。

14. 发明授权

US08212282B2 Semiconductor device used in step-up DC-DC converter, and step-up DC-DC converter 失效
标题翻译：用于升压型DC-DC转换器的升压型DC-DC转换器
公开(公告)号：US08212282B2
公开(公告)日：2012-07-03
申请号：US12889695
申请日：2010-09-24
申请人： Masaya Ohtsuka , Yoshinori Ueda
发明人： Masaya Ohtsuka , Yoshinori Ueda
IPC分类号： H01L29/66
CPC分类号： H01L29/7816 , H01L27/0629 , H01L27/0922 , H01L29/0692 , H01L29/0696 , H01L29/0878 , H01L29/42368 , H01L29/66681 , H01L29/8611 , H02M3/155
摘要： A power supply device is disclosed that is able to satisfy the power requirements of a device in service and has high efficiency. The power supply device includes a first power supply; a voltage step-up unit that steps up an output voltage of the first power supply; a voltage step-down unit that steps down an output voltage of the voltage step-up unit; and a load that is driven to operate by an output voltage of the voltage step-down unit. The voltage step-up unit steps up the output voltage of the first power supply to a lower limit of an operating voltage of the voltage step-down unit.
摘要翻译：公开了能够满足正在使用的设备的功率要求并具有高效率的电源装置。电源装置包括第一电源; 升压单元，其升高第一电源的输出电压; 降压单元的输出电压的降压单元; 以及被驱动以通过降压单元的输出电压进行工作的负载。升压单元将第一电源的输出电压升压到降压单元的工作电压的下限。

15. 发明申请

US20110020603A1 CAPACITOR AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：电容器及其制造方法
公开(公告)号：US20110020603A1
公开(公告)日：2011-01-27
申请号：US12897161
申请日：2010-10-04
申请人： Tatsuo KUNISHI , Junichi Saito , Daisuke Megumi , Yoshinori Ueda , Yasuaki Kainuma , Mikiya Kobayashi , Shinji Otani
发明人： Tatsuo KUNISHI , Junichi Saito , Daisuke Megumi , Yoshinori Ueda , Yasuaki Kainuma , Mikiya Kobayashi , Shinji Otani
IPC分类号： H01G9/042 , H01G4/008 , B32B3/26 , B32B3/30 , B05D5/12 , C23C28/00 , C25D5/10
CPC分类号： H01G9/0032 , H01G9/012 , H01G9/048 , H01G9/055 , H01G9/07 , H01G9/15 , Y10T428/24355 , Y10T428/26
摘要： Disclosed is a capacitor which has a high capacitance and a low equivalent series resistance. The capacitor includes a conductive base material composed of a plating film having a specific surface area of 100 mm2/mm3 or more, a dielectric film on a surface of the conductive base material, and an opposed conductor formed so as to be opposed to the conductive base material with the dielectric film interposed therebetween. The plating film constituting the conductive base material is formed by electrolytic plating or electroless plating, and may have a porous form, wire-like form or broccoli-like form.
摘要翻译：公开了具有高电容和低等效串联电阻的电容器。电容器包括由比表面积为100mm 2 / mm 3以上的镀膜构成的导电性基材，导电性基材的表面上的电介质膜和形成为与导电性基体材料相对的相对导体其间插入有电介质膜的基材。构成导电性基材的镀膜通过电解电镀或无电镀形成，可以是多孔形状，线状或花椰菜状。

16. 发明授权

US07169216B2 Electroless copper plating solution, electroless copper plating process and production process of circuit board 失效
标题翻译：化学镀铜液，化学镀铜工艺及电路板生产工艺
公开(公告)号：US07169216B2
公开(公告)日：2007-01-30
申请号：US10898282
申请日：2004-07-26
申请人： Takeyuki Itabashi , Hiroshi Kanemoto , Haruo Akahoshi , Eiji Takai , Naoki Nishimura , Tadashi Iida , Yoshinori Ueda
发明人： Takeyuki Itabashi , Hiroshi Kanemoto , Haruo Akahoshi , Eiji Takai , Naoki Nishimura , Tadashi Iida , Yoshinori Ueda
IPC分类号： C23C18/40
CPC分类号： C23C18/1803 , C23C18/1653 , C23C18/40
摘要： An electroless copper plating solution using glyoxylic acid as a reducing agent, which is small in the reacting quantity of Cannizzaro reaction, does not largely cause precipitation of the salt accumulated in the electroless copper plating solution by the plating reaction and Cannizzaro reaction, and can be used stably over a long period of time. The electroless copper plating solution comprises copper ion, a complexing agent for copper ion, a reducing agent for copper ion and a pH adjusting agent, wherein the reducing agent for copper ion is glyoxylic acid or a salt thereof, the pH adjusting agent is potassium hydroxide and the electroless copper plating solution contains at least one member selected from metasilicic acid, metasilicic acid salt, germanium dioxide, germanic acid salt, phosphoric acid, phosphoric acid salt, vanadic acid, vanadic acid salt, stannic acid and stannic acid salt in an amount of 0.0001 mol/L or more.
摘要翻译：使用乙醛酸作为还原剂的化学镀铜溶液，其在Cannizzaro反应的反应量较小时，不会通过电镀反应和Cannizzaro反应极大地引起积存在无电镀铜溶液中的盐的沉淀，并且可以长时间稳定使用。无电镀铜液包括铜离子，铜离子络合剂，铜离子还原剂和pH调节剂，其中铜离子还原剂为乙醛酸或其盐，pH调节剂为氢氧化钾化学镀铜溶液含有选自硅酸，偏硅酸盐，二氧化锗，锗酸盐，磷酸，磷酸盐，钒酸，钒酸盐，锡酸和锡酸盐中的至少一种，为0.0001mol / L以上。

17. 发明申请

US20050145989A1 Semiconductor device having an integral resistance element 有权
公开(公告)号：US20050145989A1
公开(公告)日：2005-07-07
申请号：US11059818
申请日：2005-02-17
申请人： Yoshinori Ueda
发明人： Yoshinori Ueda
IPC分类号： H01L27/04 , H01L21/336 , H01L21/822 , H01L21/8234 , H01L27/06 , H01L27/08 , H01L29/78 , H01L29/00 , H01L21/31
CPC分类号： H01L27/0802
摘要： A resistance element of a semiconductor device includes a first resistance pattern and a second resistance pattern formed adjacent to the first resistance pattern at a lower level, wherein the second resistance pattern is defined by the first resistance pattern in a self-aligned relationship and connected to the first resistance pattern in series.

18. 发明申请

US20050040803A1 Circuit for generating a reference voltage having low temperature dependency 失效
公开(公告)号：US20050040803A1
公开(公告)日：2005-02-24
申请号：US10492418
申请日：2003-02-26
申请人： Yoshinori Ueda
发明人： Yoshinori Ueda
IPC分类号： G11C11/413 , G05F1/56 , G05F3/30 , H01L21/822 , H01L27/04 , H03F1/30 , G05F3/16
CPC分类号： G05F3/30 , Y10S323/907
摘要： A circuit for generating a reference voltage includes a bandgap reference circuit that exhibits low temperature dependency of the output reference voltage. Since temperature dependencies of resistances thereof are appropriately controlled so that the temperature dependency of a load current flowing through divisional resistances is eliminated, it is possible to prevent the linearity of temperature dependency of the forward direction voltages of diodes from degrading. Accordingly, the temperature dependency of output is reduced.

19. 发明授权

US5269872A Identity tag attaching apparatus for wiring cable 失效
标题翻译：用于布线电缆的标识附件装置
公开(公告)号：US5269872A
公开(公告)日：1993-12-14
申请号：US5054
申请日：1993-01-15
申请人： Yoshinori Ueda
发明人： Yoshinori Ueda
IPC分类号： H01B7/36 , B65C3/02 , G09F3/20 , H01B13/34 , B32B31/00
CPC分类号： G09F3/205 , B65C3/02 , Y10T156/1054 , Y10T156/1064 , Y10T156/107 , Y10T156/1313
摘要： An apparatus prints the necessary attribute on an identity tag immediately before a cut wiring cable is inserted thereinto, and automatically attaching the printed identity tag to the wiring cable. An identity tag attaching apparatus attaches an identity tag which represents the attribute of a cable to the cable. The apparatus has a first feeder for feeding a first vinyl sheet having a small width and a continuous length in the longitudinal direction; a printer for printing the attribute of the cable to which the identify tag is to be attached on the first vinyl sheet; a second feeder for feeding a second vinyl sheet having a small width and a continuous length with the first vinyl tape sheet superimposed thereon; a punch for piercing the first vinyl sheet and the second vinyl tape sheet together in the shape of two straight lines having the same length along the longitudinal edges of the first and second vinyl sheets; a cable inserter for inserting the cable to which the identity tag is to be attached between the first and second vinyl sheets at the position at which the attribute has been printed; and a welding and cutting device for welding the first and second vinyl tape sheets along the respective lines which connect the respective opposing ends of the two parallel straight lines punched by the punch and for cutting the first and second vinyl tape sheets together along the outer peripheries of the welded portions.
摘要翻译：一种设备在将切割的布线电缆插入其中之前立即在身份标签上打印必要的属性，并将打印的身份标签自动附加到布线电缆。身份标签附着装置将表示电缆的属性的身份标签附加到电缆。该装置具有用于在长度方向上供给具有小宽度和连续长度的第一乙烯基片的第一馈送器; 打印机，用于在所述第一乙烯基板上打印所述识别标签所附着的所述电缆的属性; 用于将第一乙烯基薄片带叠加在其上的具有小宽度和连续长度的第二乙烯基片材的第二进料器; 用于将第一乙烯基片和第二乙烯基带片沿着沿着第一和第二乙烯基片的纵向边缘具有相同长度的两条直线形状的冲头; 电缆插入器，用于在已经印刷该属性的位置处插入要在第一和第二乙烯基片之间附着标识标签的电缆; 以及焊接和切割装置，用于沿着连接由冲头冲压的两条平行直线的相应相对端的相应线焊接第一和第二乙烯基带片，并且用于沿着外周将切割第一和第二乙烯基带片材在一起的焊接部分。

20. 发明授权

US08298305B2 Hydrogen production system and method of controlling flow rate of offgas in the system 有权
标题翻译：制氢系统及排气系统流量控制方法
公开(公告)号：US08298305B2
公开(公告)日：2012-10-30
申请号：US12300362
申请日：2007-05-07
申请人： Toshihiko Sumida , Masanori Miyake , Hidenori Minami , Yoshinori Ueda
发明人： Toshihiko Sumida , Masanori Miyake , Hidenori Minami , Yoshinori Ueda
IPC分类号： B01J7/00
CPC分类号： B01D53/047 , B01D2256/16 , B01D2257/108 , C01B3/32 , C01B3/323 , C01B3/56 , C01B2203/0233 , C01B2203/0244 , C01B2203/043 , C01B2203/0495 , C01B2203/0822 , C01B2203/0827 , C01B2203/0872 , C01B2203/0888 , C01B2203/1041 , C01B2203/1064 , C01B2203/107 , C01B2203/1076 , C01B2203/1223 , C01B2203/1288 , C01B2203/1695 , H01M8/0631 , H01M8/0662 , Y02P20/128 , Y10T137/0357
摘要： A hydrogen manufacturing system for performing offgas flow control includes: a vaporizer (1) for heating a material mixture containing a hydrocarbon material; a reforming reactor (2) for generating hydrogen-containing reformed gas by reforming reactions of the material; a PSA separator (5) for repeating a cycle of adsorption and desorption, where in the adsorption PSA separation is performed with an adsorption tower loaded with an adsorbent to adsorb unnecessary components in the reformed gas and extract hydrogen-enriched gas out of the tower, and in the desorption the offgas containing the unnecessary components from the adsorbent and remaining hydrogen is discharged from the tower; and a buffer tank (6) for holding the offgas before supplying to the vaporizer. The offgas flow supply from the tank (6) to the vaporizer is changed continuously over time when the cycle time is changed according to load change on the separator (5).
摘要翻译：用于进行废气流量控制的氢制造系统包括：用于加热含有烃材料的材料混合物的蒸发器（1）用于通过所述材料的重整反应产生含氢重整气体的重整反应器（2）; 用于重复吸附和解吸循环的PSA分离器（5），其中在吸附PSA分离中，用装有吸附剂的吸附塔进行吸附，以吸附重整气体中的不必要成分并将富氢气体从塔中提取出来，并且在解吸中，从吸附剂和剩余的氢气中含有不需要的成分的废气从塔中排出; 以及用于在蒸发器供应之前保持废气的缓冲罐（6）。当循环时间根据分离器（5）上的负荷变化而变化时，从罐（6）到蒸发器的废气流量随时间不断变化。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式