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    • 13. 发明授权
    • Surface modified colloidal abrasives, including stable bimetallic surface coated silica sols for chemical mechanical planarization
    • 表面改性胶体研磨剂,包括用于化学机械平面化的稳定的双金属表面涂层硅溶胶
    • US07429338B2
    • 2008-09-30
    • US11487443
    • 2006-07-17
    • Junaid Ahmed Siddiqui
    • Junaid Ahmed Siddiqui
    • B44C1/22
    • B24B37/044C09G1/02C09K3/1409C09K3/1463C23F3/04H01L21/3212
    • A composition and an associated method for chemical mechanical planarization (or other polishing) are described. The composition includes a surface-modified abrasive modified with at least one stabilizer and at least one catalyst differing from the at least one stabilizer. The composition can further include a medium containing the abrasive and an oxidizing agent (e.g., hydrogen peroxide), wherein the at least one catalyst is adapted to catalyze oxidation of a substrate by the oxidizing agent. Preferably, the abrasive is alumina, titania, zirconia, germania, silica, ceria and/or mixtures thereof, the stabilizer is B, W and/or Al, and the catalyst is Cu, Fe, Mn, Ti, W and/or V. Both the stabilizer and the catalyst are immobilized on the abrasive surface. The method includes applying the composition to a substrate to be polished, such as substrates containing W, Cu and/or dielectrics.
    • 描述了用于化学机械平面化(或其它抛光)的组合物和相关方法。 该组合物包括用至少一种稳定剂和至少一种不同于至少一种稳定剂的催化剂改性的表面改性磨料。 组合物还可以包括含有研磨剂和氧化剂(例如过氧化氢)的介质,其中所述至少一种催化剂适于催化由氧化剂氧化底物。 优选地,研磨剂是氧化铝,二氧化钛,氧化锆,氧化锗,二氧化硅,二氧化铈和/或其混合物,稳定剂是B,W和/或Al,催化剂是Cu,Fe,Mn,Ti,W和/或V 稳定剂和催化剂都固定在磨料表面上。 该方法包括将组合物施加到待抛光的基底,例如含有W,Cu和/或电介质的基底。