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11. 外观设计

USD580376S1 Lead frame for a four-pin light-emitting diode device 有权
标题翻译：四针发光二极管装置的引线框架
公开(公告)号：USD580376S1
公开(公告)日：2008-11-11
申请号：US29249576
申请日：2006-10-12
申请人： Jui-Kang Yen , Yung-Wei Chen
设计人： Jui-Kang Yen , Yung-Wei Chen

12. 外观设计

USD580375S1 Lead frame for a two-pin light emitting diode device 有权
标题翻译：双引脚发光二极管器件的引线框架
公开(公告)号：USD580375S1
公开(公告)日：2008-11-11
申请号：US29249575
申请日：2006-10-12
申请人： Jui-Kang Yen , Yung-Wei Chen
设计人： Jui-Kang Yen , Yung-Wei Chen

13. 发明申请

US20080171141A1 LED ARRAY 有权
标题翻译： LED阵列
公开(公告)号：US20080171141A1
公开(公告)日：2008-07-17
申请号：US11622150
申请日：2007-01-11
申请人： WEN-HUANG LIU , Jui-Kang Yen
发明人： WEN-HUANG LIU , Jui-Kang Yen
IPC分类号： B05D1/00 , C25D7/12 , G01R31/28 , C25D11/02
CPC分类号： H01L25/0753 , G01R31/2635 , H01L33/62 , H01L2224/45144 , H01L2224/48137 , Y10T29/49004 , Y10T29/53022 , H01L2924/00
摘要： Methods for fabricating light-emitting diode (LED) array structures comprising multiple vertical LED stacks coupled to a single metal substrate is provided. The LED array structure may comprise two, three, four, or more LED stacks arranged in any configuration. Each of the LED stacks may have an individual external connection to make a common anode array since the p-doped regions of the LED stacks are all coupled to the metal substrate, or some to all of the n-doped regions of the LED stacks may be electrically connected to create a parallel LED array. Such LED arrays may offer better heat conduction and improved matching of LED characteristics (e.g., forward voltage and emission wavelength) between the individual LED stacks compared to conventional LED arrays.
摘要翻译：提供了包括耦合到单个金属基板的多个垂直LED叠层的制造发光二极管（LED）阵列结构的方法。 LED阵列结构可以包括以任何配置布置的两个，三个，四个或更多个LED堆叠。每个LED堆叠可以具有单独的外部连接以形成公共阳极阵列，因为LED堆叠的p掺杂区域全部耦合到金属衬底，或者LED堆叠的一些至所有n掺杂区域电连接以产生并联LED阵列。与常规LED阵列相比，这样的LED阵列可以提供更好的热传导和改进的LED特征（例如，正向电压和发射波长）的匹配。

14. 外观设计

USD555114S1 Light emitting diode 有权
公开(公告)号：USD555114S1
公开(公告)日：2007-11-13
申请号：US29246446
申请日：2006-04-12
申请人： Jui-Kang Yen
设计人： Jui-Kang Yen

15. 外观设计

USD555113S1 Opto-electronic device 有权
标题翻译：光电器件
公开(公告)号：USD555113S1
公开(公告)日：2007-11-13
申请号：US29246445
申请日：2006-04-12
申请人： Jui-Kang Yen
设计人： Jui-Kang Yen

16. 发明申请

US20070001178A1 COATING PROCESS 有权
标题翻译：涂装工艺
公开(公告)号：US20070001178A1
公开(公告)日：2007-01-04
申请号：US11530128
申请日：2006-09-08
申请人： Chuong Tran , Trung Doan , Jui-Kang Yen , Yung-Wei Chen
发明人： Chuong Tran , Trung Doan , Jui-Kang Yen , Yung-Wei Chen
IPC分类号： H01L33/00
CPC分类号： H01L33/508 , H01L33/0079 , H01L33/22 , H01L33/44 , H01L33/641 , H01L2224/48091 , H01L2224/48463 , H01L2224/8592 , H01L2933/0041 , H01L2924/00014
摘要： A light emitting diode (LED) device having a substantially conformal wavelength-converting layer for producing uniform white light and a method of making said LED at both the wafer and individual die levels are provided. The LED device includes a metal substrate, a p-type semiconductor coupled to the metal substrate, an active region coupled to the p-type semiconductor, an n-type semiconductor coupled to the active region, and a wavelength converting layer coupled to the n-type semiconductor.
摘要翻译：提供了具有用于产生均匀的白光的基本上保形的波长转换层的发光二极管（LED）装置以及在晶片和各个晶片级上制造所述LED的方法。 LED装置包括金属基板，耦合到金属基板的p型半导体，耦合到p型半导体的有源区，耦合到有源区的n型半导体以及耦合到n型半导体的波长转换层型半导体。

17. 发明申请

US20140151630A1 PROTECTION FOR THE EPITAXIAL STRUCTURE OF METAL DEVICES 审中-公开
标题翻译：金属器件外延结构的保护
公开(公告)号：US20140151630A1
公开(公告)日：2014-06-05
申请号：US13693199
申请日：2012-12-04
申请人： Feng-Hsu Fan , Trung Tri Doan , Chuong Anh Tran , Chen-Fu Chu , Chao-Chen Cheng , Jiunn-Yi Chu , Wen-Huang Liu , Hao-Chun Cheng , Jui-Kang Yen
发明人： Feng-Hsu Fan , Trung Tri Doan , Chuong Anh Tran , Chen-Fu Chu , Chao-Chen Cheng , Jiunn-Yi Chu , Wen-Huang Liu , Hao-Chun Cheng , Jui-Kang Yen
IPC分类号： H01L33/04
CPC分类号： H01L33/0079 , B82Y20/00 , H01L33/44 , H01S5/0217 , H01S5/18375 , H01S5/34333
摘要： Techniques for fabricating metal devices, such as vertical light-emitting diode (VLED) devices, power devices, laser diodes, and vertical cavity surface emitting laser devices, are provided. Devices produced accordingly may benefit from greater yields and enhanced performance over conventional metal devices, such as higher brightness of the light-emitting diode and increased thermal conductivity. Moreover, the invention discloses techniques in the fabrication arts that are applicable to GaN-based electronic devices in cases where there is a high heat dissipation rate of the metal devices that have an original non-(or low) thermally conductive and/or non-(or low) electrically conductive carrier substrate that has been removed.
摘要翻译：提供了用于制造金属器件的技术，例如垂直发光二极管（VLED）器件，功率器件，激光二极管和垂直腔表面发射激光器件。相应地生产的器件可以比常规金属器件更高的产量和更高的性能受益，例如发光二极管的较高的亮度和增加的导热性。此外，本发明公开了在具有原始非导热和/或非导电性的金属器件的高散热率的情况下适用于GaN基电子器件的制造技术中的技术。（或低）导电载体衬底。

18. 发明授权

US08716848B2 LED device with conductive wings and tabs 失效
标题翻译： LED设备带导电翼和卡舌
公开(公告)号：US08716848B2
公开(公告)日：2014-05-06
申请号：US12053957
申请日：2008-03-24
申请人： Jui-Kang Yen , Yung-Wei Chen
发明人： Jui-Kang Yen , Yung-Wei Chen
IPC分类号： H01L23/495
CPC分类号： H01L33/62 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2924/00014 , H01L2924/00
摘要： Apparatus for increased heat dissipation from a light-emitting diode (LED) die are provided. The apparatus may include a metal member thermally and electrically coupled to the LED die and having one or more wings for heat transfer away from the LED die and/or increased mechanical strength of the metal member. The wings may be flat, sloped, or tiered. For some embodiments, the wings may have holes in them in an effort to increase the structural integrity when combined with a housing, which made be composed of plastic or resin.
摘要翻译：提供了用于增加从发光二极管（LED）裸片的散热的装置。该设备可以包括热和电耦合到LED管芯的金属构件，并具有一个或多个用于从LED管芯传热的翅片和/或增加金属构件的机械强度。机翼可能平坦，倾斜或分层。对于一些实施例，当机翼与由塑料或树脂组成的壳体组合时，机翼可以在其中具有孔，以努力增加结构完整性。

19. 发明授权

US08614449B1 Protection for the epitaxial structure of metal devices 有权
标题翻译：保护金属器件的外延结构
公开(公告)号：US08614449B1
公开(公告)日：2013-12-24
申请号：US11548620
申请日：2006-10-11
申请人： Feng-Hsu Fan , Trung Tri Doan , Chuong Anh Tran , Chen-Fu Chu , Chao-Chen Cheng , Jiunn-Yi Chu , Wen-Huang Liu , Hao-Chun Cheng , Jui-Kang Yen
发明人： Feng-Hsu Fan , Trung Tri Doan , Chuong Anh Tran , Chen-Fu Chu , Chao-Chen Cheng , Jiunn-Yi Chu , Wen-Huang Liu , Hao-Chun Cheng , Jui-Kang Yen
IPC分类号： H01L27/15
CPC分类号： H01L33/0079 , H01L33/0095 , H01L33/44 , H01L33/46 , H01S5/0201 , H01S5/0217 , H01S5/32341
摘要： Techniques for fabricating metal devices, such as vertical light-emitting diode (VLED) devices, power devices, laser diodes, and vertical cavity surface emitting laser devices, are provided. Devices produced accordingly may benefit from greater yields and enhanced performance over conventional metal devices, such as higher brightness of the light-emitting diode and increased thermal conductivity. Moreover, the invention discloses techniques in the fabrication arts that are applicable to GaN-based electronic devices in cases where there is a high heat dissipation rate of the metal devices that have an original non- (or low) thermally conductive and/or non- (or low) electrically conductive carrier substrate that has been removed.
摘要翻译：用于制造金属的装置，例如垂直发光二极管（VLED）器件，功率器件，激光二极管，及垂直腔表面发射激光器件的技术，提供了。相应地产生的器件可以受益于更高的收率和比常规的金属器件，如发光二极管的更高的亮度和增加的热导率增强的性能。此外，本发明公开了在具有原始非导热和/或非导电性的金属器件的高散热率的情况下适用于GaN基电子器件的制造技术中的技术。（或低）导电载体衬底。

20. 发明授权

US08373195B2 Light-emitting diode lamp with low thermal resistance 有权
标题翻译：具有低热阻的发光二极管灯
公开(公告)号：US08373195B2
公开(公告)日：2013-02-12
申请号：US13324859
申请日：2011-12-13
申请人： Jui-Kang Yen
发明人： Jui-Kang Yen
IPC分类号： H01L33/00
CPC分类号： H01L33/647 , H01L33/486 , H01L33/641 , H01L2224/32225 , H01L2224/32245 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2924/00
摘要： A light-emitting diode (LED) structure with an improved heat transfer path with a lower thermal resistance than conventional LED lamps is provided. For some embodiments, a surface-mountable light-emitting diode structure is provided having an active layer deposited on a substrate directly bonded to a metal plate that is substantially exposed for low thermal resistance by positioning the metal plate at the bottom of the light-emitting diode structure. This metal plate may then be soldered to a printed circuit board (PCB) that includes a heat sink. For some embodiments of the invention, the metal plate is thermally and electrically conductively coupled through several heat conduction layers to a large heat sink that may be included in the structure.
摘要翻译：提供了一种具有比传统LED灯具更低热传导路径的发光二极管（LED）结构。对于一些实施例，提供了一种可表面安装的发光二极管结构，其具有沉积在基板上的有源层，所述有源层直接接合到金属板上，所述金属板基本上暴露于低热阻，通过将金属板定位在发光的底部二极管结构。然后将该金属板焊接到包括散热器的印刷电路板（PCB）。对于本发明的一些实施例，金属板通过几个导热层被热和电传导耦合到可以包括在结构中的大散热器。

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