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11. 发明授权

US06634095B2 Apparatus for mounting a land grid array module 失效
标题翻译：用于安装焊盘阵列模块的装置
公开(公告)号：US06634095B2
公开(公告)日：2003-10-21
申请号：US09892967
申请日：2001-06-27
申请人： John L. Colbert , John S. Corbin, Jr. , Roger D. Hamilton , Danny E. Massey , Arvind K. Sinha , Charles C. Stratton
发明人： John L. Colbert , John S. Corbin, Jr. , Roger D. Hamilton , Danny E. Massey , Arvind K. Sinha , Charles C. Stratton
IPC分类号： B23P1900
CPC分类号： H05K7/1061 , Y10S269/903 , Y10T29/49126 , Y10T29/4913 , Y10T29/49133 , Y10T29/49137 , Y10T29/49139 , Y10T29/53174 , Y10T29/53178 , Y10T29/53239 , Y10T29/53265
摘要： An installation apparatus of installing a land grid array (LGA) multi-chip module assembly to a printed wiring board is provided. A module holding member is attached to the printed wiring board. The module assembly is inserted into the module holding member. The module assembly is retained to the module holding member, which facilitates mechanical actuation of the LGA compression hardware. The module assembly is electrically grounded to the printed wiring board while the module assembly is retained to the module holding member.
摘要翻译：提供了一种将印刷电路板安装在地面阵列（LGA）多芯片模块组件上的安装装置。模块保持构件附接到印刷线路板。模块组件插入模块保持构件。模块组件被保持在模块保持构件上，这有助于LGA压缩硬件的机械致动。模块组件在模块组件被保持到模块保持构件的同时电接地到印刷线路板。

12. 发明授权

US06475011B1 Land grid array socket actuation hardware for MCM applications 有权
标题翻译：用于MCM应用的Land Grid阵列插座致动硬件
公开(公告)号：US06475011B1
公开(公告)日：2002-11-05
申请号：US09948195
申请日：2001-09-07
申请人： Arvind K. Sinha , Roger D. Hamilton , John L. Colbert , John S. Corbin, Jr. , Danny E. Massey
发明人： Arvind K. Sinha , Roger D. Hamilton , John L. Colbert , John S. Corbin, Jr. , Danny E. Massey
IPC分类号： H01R1362
CPC分类号： H05K3/325 , H01R43/205
摘要： An apparatus for applying force to a multi-chip module, a printed wiring board and an interposer to facilitate electrical contact there-between, includes a plurality of load posts, a load transfer plate, a spring member, a backside stiffener plate and a spring actuator. The load posts are affixed to the multi-chip module and pass through the printed wiring board. The load transfer plate has a first stiffness. The spring member is disposed adjacent the load transfer plate and has a second stiffness that is less than the first stiffness. The a backside stiffener plate is disposed between the spring member and the printed wiring board and has a third stiffness that is greater than the second stiffness. The spring actuator engages the spring member to apply force to the backside stiffener plate, causing the substrate, the interposer and the printed wiring board to be held in contact.
摘要翻译：一种用于向多芯片模块施加力的装置，印刷线路板和插入件，以便于其间的电接触，包括多个负载柱，负载传递板，弹簧构件，后侧加强板和弹簧执行器。负载柱固定在多芯片模块上并通过印刷电路板。载荷传递板具有第一刚度。弹簧构件设置在负载传递板附近并且具有小于第一刚度的第二刚度。背面加强板设置在弹簧构件和印刷线路板之间，并且具有大于第二刚度的第三刚度。弹簧致动器接合弹簧构件以向后侧加强板施加力，使得基板，插入器和印刷线路板保持接触。

13. 发明授权

US07701720B2 Electronic assembly and techniques for installing a heatsink in an electronic assembly 有权
标题翻译：用于在散热器中安装电子组件的电子装配和技术
公开(公告)号：US07701720B2
公开(公告)日：2010-04-20
申请号：US11862848
申请日：2007-09-27
申请人： John L. Colbert , John S. Corbin, Jr. , Jason R. Eagle , Arvind K. Sinha , Christopher L. Tuma
发明人： John L. Colbert , John S. Corbin, Jr. , Jason R. Eagle , Arvind K. Sinha , Christopher L. Tuma
IPC分类号： H05K7/20
CPC分类号： H01L23/4006 , H01L2924/0002 , Y10T29/53113 , H01L2924/00
摘要： A technique for installing a heatsink in an electronic assembly includes simultaneously applying force to multiple fastener assemblies that each retain a respective fastener in a body of the heatsink. The heatsink is then attached to the electronic assembly by actuating the fasteners while the force is simultaneously applied to the multiple fastener assemblies.
摘要翻译：用于在电子组件中安装散热器的技术包括同时向多个紧固件组件施加力，每个紧固件组件将相应的紧固件保持在散热器的主体中。然后通过致动紧固件将散热器附接到电子组件，同时力同时施加到多个紧固件组件。

14. 发明申请

US20090083972A1 Electronic Assembly and Techniques for Installing a Heatsink in an Electronic Assembly 有权
标题翻译：电子组装中安装散热器的电子组装和技术
公开(公告)号：US20090083972A1
公开(公告)日：2009-04-02
申请号：US11862848
申请日：2007-09-27
申请人： John L. Colbert , John S. Corbin, JR. , Jason R. Eagle , Arvind K. Sinha , Christopher L. Tuma
发明人： John L. Colbert , John S. Corbin, JR. , Jason R. Eagle , Arvind K. Sinha , Christopher L. Tuma
IPC分类号： B23P15/26 , H05K7/20
CPC分类号： H01L23/4006 , H01L2924/0002 , Y10T29/53113 , H01L2924/00
摘要： A technique for installing a heatsink in an electronic assembly includes simultaneously applying force to multiple fastener assemblies that each retain a respective fastener in a body of the heatsink. The heatsink is then attached to the electronic assembly by actuating the fasteners while the force is simultaneously applied to the multiple fastener assemblies.
摘要翻译：用于在电子组件中安装散热器的技术包括同时向多个紧固件组件施加力，每个紧固件组件将相应的紧固件保持在散热器的主体中。然后通过致动紧固件将散热器附接到电子组件，同时力同时施加到多个紧固件组件。

15. 发明授权

US07903411B2 Cold plate stability 失效
标题翻译：冷板稳定
公开(公告)号：US07903411B2
公开(公告)日：2011-03-08
申请号：US12185141
申请日：2008-08-04
申请人： Levi A. Campbell , John L. Colbert , Michael J. Ellsworth, Jr. , Arvind K. Sinha
发明人： Levi A. Campbell , John L. Colbert , Michael J. Ellsworth, Jr. , Arvind K. Sinha
IPC分类号： H05K7/20
CPC分类号： H05K7/1053 , G06F1/20 , G06F2200/201 , H01L23/4093 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A cold plate assembly includes a cold plate with at least two plumbing ports. The cold plate assembly further includes a spring plate assembly, which applies an actuation load to the cold plate. The spring plate assembly includes a spring plate and a spring pin moveable in a slot of the spring plate assembly to maintain the actuation load. The actuation load is configured to mechanically actuate the cold plate to a module.
摘要翻译：冷板组件包括具有至少两个管道端口的冷板。冷板组件还包括向冷板施加致动负载的弹簧板组件。弹簧板组件包括弹簧板和可在弹簧板组件的槽中移动的弹簧销，以保持致动负载。致动负载被配置为将冷板机械地致动到模块。

16. 发明申请

US20080308260A1 COLD PLATE STABILITY 失效
标题翻译：冷板稳定性
公开(公告)号：US20080308260A1
公开(公告)日：2008-12-18
申请号：US12185141
申请日：2008-08-04
申请人： Levi A. Campbell , John L. Colbert , Michael J. Ellsworth, JR. , Arvind K. Sinha
发明人： Levi A. Campbell , John L. Colbert , Michael J. Ellsworth, JR. , Arvind K. Sinha
IPC分类号： F28D15/00
CPC分类号： H05K7/1053 , G06F1/20 , G06F2200/201 , H01L23/4093 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A cold plate assembly includes a cold plate with at least two plumbing ports. The cold plate assembly further includes a spring plate assembly, which applies an actuation load to the cold plate. The spring plate assembly includes a spring plate and a spring pin moveable in a slot of the spring plate assembly to maintain the actuation load. The actuation load is configured to mechanically actuate the cold plate to a module.
摘要翻译：冷板组件包括具有至少两个管道端口的冷板。冷板组件还包括向冷板施加致动负载的弹簧板组件。弹簧板组件包括弹簧板和可在弹簧板组件的槽中移动的弹簧销，以保持致动负载。致动负载被配置为将冷板机械地致动到模块。

17. 发明授权

US06802733B2 Topside installation apparatus for land grid array modules 失效
标题翻译：地面栅格阵列模块的顶部安装装置
公开(公告)号：US06802733B2
公开(公告)日：2004-10-12
申请号：US09931299
申请日：2001-08-16
申请人： John L. Colbert , John S. Corbin, Jr. , Roger D. Hamilton , Danny E. Massey , Arvind K. Sinha
发明人： John L. Colbert , John S. Corbin, Jr. , Roger D. Hamilton , Danny E. Massey , Arvind K. Sinha
IPC分类号： H01R1362
CPC分类号： H05K3/325 , H05K7/1061
摘要： An installation apparatus and method for actuating the electrical connection of a land grid array module to a printed wiring board is provided. A backside stiffener with load posts is attached to a printed wiring board. A load plate, module, plurality of load columns, and springplate are operably connected to the load posts. An actuation screw operably connected to the springplate is rotated imparting an actuation force to the module. The backside stiffener includes a local stiffener, wherein the local stiffener causes a deflection in the printed wiring board complementary to the deflection of the module when the actuation force is applied.
摘要翻译：提供了一种用于致动陆地网格阵列模块到印刷线路板的电连接的安装装置和方法。具有负载柱的背面加强件连接到印刷线路板。负载板，模块，多个负载柱和弹簧板可操作地连接到负载柱。可操作地连接到弹簧板的致动螺钉被旋转，向模块施加致动力。背面加强件包括局部加强件，其中当施加致动力时，局部加强件引起印刷线路板中的挠曲与模块的偏转互补。

18. 发明授权

US06757965B2 Method of installing a land grid array multi-chip modules 失效
标题翻译：安装地面阵列多芯片模块的方法
公开(公告)号：US06757965B2
公开(公告)日：2004-07-06
申请号：US10455538
申请日：2003-06-05
申请人： John L. Colbert , John S. Corbin, Jr. , Roger D. Hamilton , Danny E. Massey , Arvind K. Sinha , Charles C. Stratton
发明人： John L. Colbert , John S. Corbin, Jr. , Roger D. Hamilton , Danny E. Massey , Arvind K. Sinha , Charles C. Stratton
IPC分类号： H05K330
CPC分类号： H05K7/1061 , Y10S269/903 , Y10T29/49126 , Y10T29/4913 , Y10T29/49133 , Y10T29/49137 , Y10T29/49139 , Y10T29/53174 , Y10T29/53178 , Y10T29/53239 , Y10T29/53265
摘要： A method of installing a land grid array (LGA) multi-chip module assembly to a printed wiring board is provided. A module holding member is attached to the printed wiring board. The module assembly is inserted into the module holding member. The module assembly is retained to the module holding member, which facilitates mechanical actuation of the LGA compression hardware. The module assembly is electrically grounded to the printed wiring board while the module assembly is retained to the module holding member.
摘要翻译：提供了一种将焊盘阵列（LGA）多芯片组件安装到印刷电路板的方法。模块保持构件附接到印刷线路板。模块组件插入模块保持构件。模块组件被保持在模块保持构件上，这有助于LGA压缩硬件的机械致动。模块组件在模块组件被保持到模块保持构件的同时电接地到印刷线路板。

19. 发明授权

US08705050B2 Providing thermal compensation for topographic measurement at an elevated temperature using a non-contact vibration transducer 失效
标题翻译：使用非接触式振动传感器，在高温下提供对地形测量的热补偿
公开(公告)号：US08705050B2
公开(公告)日：2014-04-22
申请号：US12898783
申请日：2010-10-06
申请人： Arvind K. Sinha
发明人： Arvind K. Sinha
IPC分类号： G01B11/30
CPC分类号： G01B11/24
摘要： A mechanism for providing thermal compensation when measuring surface topography at an elevated temperature using a non-contact vibration transducer, such as a laser Doppler vibrometer (LDV). Thermal compensation is provided to a detector output signal to correct for thermal diffraction of a reflected portion of a beam of radiant energy directed at a surface of a test object. The thermal compensation is based on a calculated deviation between the detector output signal r2 at an elevated temperature and the detector output signal r1 at approximately room temperature. In one embodiment, the thermal compensation mechanism calculates a stationary signal r3(t) which represents the detector output signal without noise and corrected for thermal diffraction at the elevated temperature according to the following equation: r 3 ⁡ ( t ) = lim T → ∞ ⁢ 1 / T ⁢ ∫ - t / 2 + t / 2 ⁢ r 2 * ⁡ ( t ) * r 2 * ⁡ ( t + Δ ⁢ ⁢ t ) ⁢ ⁢ ⅆ t , wherein T represents the total number of spectrums measured at the elevated temperature at multiple times upon which the compensation is based, and wherein r2*=r2−r2(baseline).
摘要翻译：使用诸如激光多普勒振动计（LDV）的非接触式振动传感器在高温测量表面形貌时提供热补偿的机构。将热补偿提供给检测器输出信号，以校正指向测试对象表面的辐射能束的反射部分的热衍射。热补偿基于在升高的温度下的检测器输出信号r2与大约室温下的检测器输出信号r1之间的计算偏差。在一个实施例中，热补偿机构根据以下等式计算表示无噪声的检测器输出信号的稳定信号r3（t），并根据以下等式对升高的温度下的热衍射进行校正：r 3⁡（t）= lim T→∞ 1 /T∫-t / 2 + t / 2r 2 *⁡（t）* r 2 *⁡（t +＆Dgr;⁢t）⁢ⅆt，其中T表示测量的光谱总数在补偿所基于的多次的高温下，其中r2 * = r2-r2（基线）。

20. 发明授权

US08611090B2 Electronic module with laterally-conducting heat distributor layer 有权
标题翻译：具有横向导热分布层的电子模块
公开(公告)号：US08611090B2
公开(公告)日：2013-12-17
申请号：US12878710
申请日：2010-09-09
申请人： Arvind K. Sinha , Kory W. Weckman
发明人： Arvind K. Sinha , Kory W. Weckman
IPC分类号： H05K7/20
CPC分类号： H05K7/20509 , H01L21/563 , H01L23/36 , H01L23/433 , H01L24/32 , H01L25/0657 , H01L2224/16225 , H01L2224/16245 , H01L2224/32225 , H01L2224/73204 , H01L2225/06513 , H01L2225/06517 , H01L2225/06589 , H01L2924/01029 , H01L2924/14 , H05K3/32 , H05K7/205 , H05K13/00 , Y10T29/49117 , H01L2924/00
摘要： An electronic module is provided in which a chip is disposed over a substrate and electrically connected to the substrate by a plurality of electrical connect structures disposed between the chip and the substrate. A heat distributor, fabricated of a thermally conductive material, is disposed between the chip and the substrate and sized to extend beyond an edge of the chip to facilitate conduction of heat laterally out from between the chip and substrate. The heat distributor includes openings sized and positioned to allow the electrical connect structures to pass through the heat distributor without electrically contacting the heat distributor. The heat distributor is electrically isolated from the electrical connect structures, the chip and the substrate. In one implementation, the heat distributor physically contacts a thermally conductive enclosure of the electronic module to facilitate conduction of heat from between the chip and substrate to the enclosure.
摘要翻译：提供了一种电子模块，其中芯片设置在衬底上并且通过设置在芯片和衬底之间的多个电连接结构电连接到衬底。由导热材料制成的热分布器设置在芯片和基板之间，其尺寸设计成延伸超过芯片的边缘，以便于从芯片和基板之间横向导出热量。热分配器包括尺寸和定位的开口，以允许电连接结构通过热分布器而不与热分布器电接触。热分配器与电连接结构，芯片和基板电隔离。在一个实施方式中，热分配器物理地接触电子模块的导热外壳，以便将热量从芯片和衬底之间传导到外壳。

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