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1. 发明授权

US06757965B2 Method of installing a land grid array multi-chip modules 失效
标题翻译：安装地面阵列多芯片模块的方法
公开(公告)号：US06757965B2
公开(公告)日：2004-07-06
申请号：US10455538
申请日：2003-06-05
申请人： John L. Colbert , John S. Corbin, Jr. , Roger D. Hamilton , Danny E. Massey , Arvind K. Sinha , Charles C. Stratton
发明人： John L. Colbert , John S. Corbin, Jr. , Roger D. Hamilton , Danny E. Massey , Arvind K. Sinha , Charles C. Stratton
IPC分类号： H05K330
CPC分类号： H05K7/1061 , Y10S269/903 , Y10T29/49126 , Y10T29/4913 , Y10T29/49133 , Y10T29/49137 , Y10T29/49139 , Y10T29/53174 , Y10T29/53178 , Y10T29/53239 , Y10T29/53265
摘要： A method of installing a land grid array (LGA) multi-chip module assembly to a printed wiring board is provided. A module holding member is attached to the printed wiring board. The module assembly is inserted into the module holding member. The module assembly is retained to the module holding member, which facilitates mechanical actuation of the LGA compression hardware. The module assembly is electrically grounded to the printed wiring board while the module assembly is retained to the module holding member.
摘要翻译：提供了一种将焊盘阵列（LGA）多芯片组件安装到印刷电路板的方法。模块保持构件附接到印刷线路板。模块组件插入模块保持构件。模块组件被保持在模块保持构件上，这有助于LGA压缩硬件的机械致动。模块组件在模块组件被保持到模块保持构件的同时电接地到印刷线路板。

2. 发明授权

US06634095B2 Apparatus for mounting a land grid array module 失效
标题翻译：用于安装焊盘阵列模块的装置
公开(公告)号：US06634095B2
公开(公告)日：2003-10-21
申请号：US09892967
申请日：2001-06-27
申请人： John L. Colbert , John S. Corbin, Jr. , Roger D. Hamilton , Danny E. Massey , Arvind K. Sinha , Charles C. Stratton
发明人： John L. Colbert , John S. Corbin, Jr. , Roger D. Hamilton , Danny E. Massey , Arvind K. Sinha , Charles C. Stratton
IPC分类号： B23P1900
CPC分类号： H05K7/1061 , Y10S269/903 , Y10T29/49126 , Y10T29/4913 , Y10T29/49133 , Y10T29/49137 , Y10T29/49139 , Y10T29/53174 , Y10T29/53178 , Y10T29/53239 , Y10T29/53265
摘要： An installation apparatus of installing a land grid array (LGA) multi-chip module assembly to a printed wiring board is provided. A module holding member is attached to the printed wiring board. The module assembly is inserted into the module holding member. The module assembly is retained to the module holding member, which facilitates mechanical actuation of the LGA compression hardware. The module assembly is electrically grounded to the printed wiring board while the module assembly is retained to the module holding member.
摘要翻译：提供了一种将印刷电路板安装在地面阵列（LGA）多芯片模块组件上的安装装置。模块保持构件附接到印刷线路板。模块组件插入模块保持构件。模块组件被保持在模块保持构件上，这有助于LGA压缩硬件的机械致动。模块组件在模块组件被保持到模块保持构件的同时电接地到印刷线路板。

3. 发明授权

US06802733B2 Topside installation apparatus for land grid array modules 失效
标题翻译：地面栅格阵列模块的顶部安装装置
公开(公告)号：US06802733B2
公开(公告)日：2004-10-12
申请号：US09931299
申请日：2001-08-16
申请人： John L. Colbert , John S. Corbin, Jr. , Roger D. Hamilton , Danny E. Massey , Arvind K. Sinha
发明人： John L. Colbert , John S. Corbin, Jr. , Roger D. Hamilton , Danny E. Massey , Arvind K. Sinha
IPC分类号： H01R1362
CPC分类号： H05K3/325 , H05K7/1061
摘要： An installation apparatus and method for actuating the electrical connection of a land grid array module to a printed wiring board is provided. A backside stiffener with load posts is attached to a printed wiring board. A load plate, module, plurality of load columns, and springplate are operably connected to the load posts. An actuation screw operably connected to the springplate is rotated imparting an actuation force to the module. The backside stiffener includes a local stiffener, wherein the local stiffener causes a deflection in the printed wiring board complementary to the deflection of the module when the actuation force is applied.
摘要翻译：提供了一种用于致动陆地网格阵列模块到印刷线路板的电连接的安装装置和方法。具有负载柱的背面加强件连接到印刷线路板。负载板，模块，多个负载柱和弹簧板可操作地连接到负载柱。可操作地连接到弹簧板的致动螺钉被旋转，向模块施加致动力。背面加强件包括局部加强件，其中当施加致动力时，局部加强件引起印刷线路板中的挠曲与模块的偏转互补。

4. 发明授权

US06475011B1 Land grid array socket actuation hardware for MCM applications 有权
标题翻译：用于MCM应用的Land Grid阵列插座致动硬件
公开(公告)号：US06475011B1
公开(公告)日：2002-11-05
申请号：US09948195
申请日：2001-09-07
申请人： Arvind K. Sinha , Roger D. Hamilton , John L. Colbert , John S. Corbin, Jr. , Danny E. Massey
发明人： Arvind K. Sinha , Roger D. Hamilton , John L. Colbert , John S. Corbin, Jr. , Danny E. Massey
IPC分类号： H01R1362
CPC分类号： H05K3/325 , H01R43/205
摘要： An apparatus for applying force to a multi-chip module, a printed wiring board and an interposer to facilitate electrical contact there-between, includes a plurality of load posts, a load transfer plate, a spring member, a backside stiffener plate and a spring actuator. The load posts are affixed to the multi-chip module and pass through the printed wiring board. The load transfer plate has a first stiffness. The spring member is disposed adjacent the load transfer plate and has a second stiffness that is less than the first stiffness. The a backside stiffener plate is disposed between the spring member and the printed wiring board and has a third stiffness that is greater than the second stiffness. The spring actuator engages the spring member to apply force to the backside stiffener plate, causing the substrate, the interposer and the printed wiring board to be held in contact.
摘要翻译：一种用于向多芯片模块施加力的装置，印刷线路板和插入件，以便于其间的电接触，包括多个负载柱，负载传递板，弹簧构件，后侧加强板和弹簧执行器。负载柱固定在多芯片模块上并通过印刷电路板。载荷传递板具有第一刚度。弹簧构件设置在负载传递板附近并且具有小于第一刚度的第二刚度。背面加强板设置在弹簧构件和印刷线路板之间，并且具有大于第二刚度的第三刚度。弹簧致动器接合弹簧构件以向后侧加强板施加力，使得基板，插入器和印刷线路板保持接触。

5. 发明授权

US08363404B2 Implementing loading and heat removal for hub module assembly 失效
标题翻译：实现轮毂模块组装的加载和除热
公开(公告)号：US08363404B2
公开(公告)日：2013-01-29
申请号：US12967854
申请日：2010-12-14
申请人： John L. Colbert , Jason R. Eagle , Roger D. Hamilton , Kenneth C. Marston , Steven P. Ostrander
发明人： John L. Colbert , Jason R. Eagle , Roger D. Hamilton , Kenneth C. Marston , Steven P. Ostrander
IPC分类号： H05K7/20 , F28F7/00 , H01L23/34
CPC分类号： G06F1/20 , G06F2200/201 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A method and apparatus are provided for implementing loading and heat removal for a hub module assembly. The hub module assembly includes a hub chip and a plurality of optical modules attached by land grid array (LGA) assembly disposed on a top surface metallurgy (TSM) LGA residing on a hub ceramic substrate. The ceramic substrate is connected to a circuit board through a bottom surface metallurgy (BSM) LGA assembly. A base alignment ring includes a plurality of alignment features for engaging the circuit board and locating an LGA interposer of the BSM LGA assembly. Each of a pair of top alignment rings includes cooperating alignment features for engaging and locating a respective LGA interposer of respective LGA sites of the TSM LGA assembly. The two LGA interposers of the TSM LGA assembly align, retain, and make the electrical connection between the optical modules and the hub chip.
摘要翻译：提供了一种用于实现轮毂模块组件的加载和除热的方法和装置。集线器模块组件包括集线器芯片和多个光学模块，其通过设置在驻留在轮毂陶瓷衬底上的顶表面冶金（TSM）LGA上的焊盘网阵列（LGA）组件连接。陶瓷基板通过底表面冶金（BSM）LGA组件连接到电路板。基座对准环包括用于接合电路板和定位BSM LGA组件的LGA插入器的多个对准特征。一对顶部对准环中的每一个包括用于接合和定位TSM LGA组件的相应LGA位置的相应LGA插入器的协作对准特征。 TSM LGA组件的两个LGA插入器对齐，保持并使光学模块与集线器芯片之间的电连接。

6. 发明申请

US20120147563A1 IMPLEMENTING LOADING AND HEAT REMOVAL FOR HUB MODULE ASSEMBLY 失效
标题翻译：实现加载和散热用于集体模块组装
公开(公告)号：US20120147563A1
公开(公告)日：2012-06-14
申请号：US12967854
申请日：2010-12-14
申请人： John L. Colbert , Jason R. Eagle , Roger D. Hamilton , Kenneth C. Marston , Steven P. Ostrander
发明人： John L. Colbert , Jason R. Eagle , Roger D. Hamilton , Kenneth C. Marston , Steven P. Ostrander
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , G06F2200/201 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A method and apparatus are provided for implementing loading and heat removal for a hub module assembly. The hub module assembly includes a hub chip and a plurality of optical modules attached by land grid array (LGA) assembly disposed on a top surface metallurgy (TSM) LGA residing on a hub ceramic substrate. The ceramic substrate is connected to a circuit board through a bottom surface metallurgy (BSM) LGA assembly. A base alignment ring includes a plurality of alignment features for engaging the circuit board and locating an LGA interposer of the BSM LGA assembly. Each of a pair of top alignment rings includes cooperating alignment features for engaging and locating a respective LGA interposer of respective LGA sites of the TSM LGA assembly. The two LGA interposers of the TSM LGA assembly align, retain, and make the electrical connection between the optical modules and the hub chip.
摘要翻译：提供了一种用于实现轮毂模块组件的加载和除热的方法和装置。集线器模块组件包括集线器芯片和多个光学模块，其通过设置在驻留在轮毂陶瓷衬底上的顶表面冶金（TSM）LGA上的焊盘网阵列（LGA）组件连接。陶瓷基板通过底表面冶金（BSM）LGA组件连接到电路板。基座对准环包括用于接合电路板和定位BSM LGA组件的LGA插入器的多个对准特征。一对顶部对准环中的每一个包括用于接合和定位TSM LGA组件的相应LGA位置的相应LGA插入器的协作对准特征。 TSM LGA组件的两个LGA插入器对齐，保持并使光学模块与集线器芯片之间的电连接。

7. 发明授权

US5617296A Printed circuit board covers for an electronics package 失效
标题翻译：电子封装的印刷电路板盖
公开(公告)号：US5617296A
公开(公告)日：1997-04-01
申请号：US443216
申请日：1995-05-17
申请人： James A. Melville , Roger D. Hamilton
发明人： James A. Melville , Roger D. Hamilton
IPC分类号： H05K1/14 , H05K7/14 , H05K1/11
CPC分类号： H05K7/1424 , H05K1/144
摘要： An electronics package for protective enclosure and connection of the circuit to a system backplane having electromagnetic shielding and enhanced packaging density is provided. The electronics package comprises an enclosure having a first cover and a second cover. Each cover of the enclosure is formed from a multilayer circuit board having an insulating support layer of a selected thickness and of a sufficient rigidity to serve as a protective covering for the electronics package, and a shielding layer formed by a conductive plane of a thickness less than the selected thickness of the insulating support layer. At least one cover of the enclosure is a multilayer circuit board having an electronic circuit formed thereon. The electronics package further comprises a circuit card positioned within the housing and having a connector positioned on the back for mating and connection with the system backplane.
摘要翻译：提供了一种用于保护外壳的电子封装以及电路与具有电磁屏蔽和增强的封装密度的系统背板的连接。电子组件包括具有第一盖和第二盖的外壳。外壳的每个盖由具有选定厚度和足够刚性的绝缘支撑层的多层电路板形成，用作电子封装的保护覆盖物，以及由厚度较小的导电平面形成的屏蔽层比所选择的绝缘支撑层的厚度。外壳的至少一个盖是其上形成有电子电路的多层电路板。电子封装还包括定位在外壳内的电路卡，并具有位于背面的连接器，用于与系统背板配合和连接。

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