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11. 发明授权

US08508031B2 Electronic device and method of producing the same 有权
标题翻译：电子装置及其制造方法
公开(公告)号：US08508031B2
公开(公告)日：2013-08-13
申请号：US12907304
申请日：2010-10-19
申请人： Nobuyuki Hayashi , Yasuhiro Yoneda , Teru Nakanishi , Masaru Morita
发明人： Nobuyuki Hayashi , Yasuhiro Yoneda , Teru Nakanishi , Masaru Morita
IPC分类号： H01L23/48 , H01L21/00
CPC分类号： H01L23/433 , H01L23/4006 , H01L2223/6611 , H01L2224/16225 , H01L2924/09701 , H01L2924/15311 , H05K3/303 , H05K3/3436 , H05K2201/10409 , H05K2201/10734 , H05K2203/0278 , Y02P70/613
摘要： An electronic device includes a wiring board; a semiconductor device arranged at an upper side of the wiring board with an electrically conductive member being arranged therebetween; a covering member arranged at an upper side of the semiconductor device; and a supporting member arranged at a lower side of the wiring board, the supporting member having a convex portion facing the wiring board, the supporting member being connected to the covering member and supporting the wiring board at the convex portion.
摘要翻译：一种电子装置，包括：布线板; 布置在所述布线板的上侧的半导体器件，其间布置有导电构件; 布置在所述半导体器件的上侧的覆盖部件; 以及布置在所述布线板的下侧的支撑构件，所述支撑构件具有面向所述布线板的凸部，所述支撑构件连接到所述覆盖构件并且在所述凸部处支撑所述布线板。

12. 发明授权

US08378687B2 Method of measuring characteristics regarding safety of battery 有权
标题翻译：测量电池安全性的方法
公开(公告)号：US08378687B2
公开(公告)日：2013-02-19
申请号：US12247449
申请日：2008-10-08
申请人： Yasuhiro Yoneda , Katsusada Motoyoshi , Yukiko Wakino , Kensuke Yoshida
发明人： Yasuhiro Yoneda , Katsusada Motoyoshi , Yukiko Wakino , Kensuke Yoshida
IPC分类号： G01N27/416
CPC分类号： G01R31/3662 , G01R31/3651
摘要： A measuring method of a battery includes the step of measuring frequency characteristics of an internal impedance of the battery by an AC impedance method, and determining a parameter of an element representing ease of mobility of charges on a surface of a positive electrode of the battery and that of an element representing the ease of mobility of charges on the surface of a negative electrode.
摘要翻译：电池的测量方法包括通过AC阻抗法测量电池的内部阻抗的频率特性的步骤，以及确定代表电池正极的电荷迁移率的元素的参数;以及表示负极表面上电荷迁移容易度的元素。

13. 发明申请

US20110063812A1 ELECTRONIC DEVICE, METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC EQUIPMENT 审中-公开
标题翻译：电子设备，制造电子设备的方法和电子设备
公开(公告)号：US20110063812A1
公开(公告)日：2011-03-17
申请号：US12853647
申请日：2010-08-10
申请人： Teru NAKANISHI , Nobuyuki Hayashi , Masaru Morita , Yasuhiro Yoneda
发明人： Teru NAKANISHI , Nobuyuki Hayashi , Masaru Morita , Yasuhiro Yoneda
IPC分类号： H05K7/02 , H05K3/30
CPC分类号： H05K3/3426 , G01R31/2853 , H01L23/3121 , H01L23/367 , H01L23/4006 , H01L23/49827 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/03828 , H01L2224/111 , H01L2224/11334 , H01L2224/13011 , H01L2224/13099 , H01L2224/131 , H01L2224/73253 , H01L2224/81054 , H01L2224/8121 , H01L2224/81815 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/19041 , H05K3/3436 , H05K3/3484 , H05K2201/10257 , H05K2201/10265 , H05K2201/10984 , H05K2201/2036 , Y02P70/613 , Y10T29/4913
摘要： An electronic device includes a circuit board having a first electrode formed on a main surface thereof, a semiconductor device disposed toward the main surface of the circuit board, the semiconductor device having a second electrode formed on a surface thereof opposed to the main surface, and a connection member electrically connecting between the first and second electrodes. The connection member includes a hollow cylindrical member and a conductive member disposed within the hollow cylindrical member.
摘要翻译：电子设备包括：电路板，具有形成在其主表面上的第一电极，半导体器件设置在电路板的主表面上，该半导体器件具有形成在与主表面相对的表面上的第二电极，电连接在第一和第二电极之间的连接构件。连接构件包括中空圆柱形构件和设置在中空圆柱形构件内的导电构件。

14. 发明授权

US07604751B2 Polishing liquid composition 有权
标题翻译：抛光液组成
公开(公告)号：US07604751B2
公开(公告)日：2009-10-20
申请号：US11434074
申请日：2006-05-16
申请人： Yasuhiro Yoneda , Ryoichi Hashimoto , Toshiya Hagihara
发明人： Yasuhiro Yoneda , Ryoichi Hashimoto , Toshiya Hagihara
IPC分类号： H01L21/302
CPC分类号： C09K13/06 , C09G1/02 , C23F3/00 , C23F3/04 , C23F3/06 , H01L21/31053 , H01L21/3212
摘要： A polishing liquid composition is applicable as a means of forming embedded metal interconnections on a semiconductor substrate. In a surface to be polished comprising an insulating layer and a metal interconnection layer, the polishing liquid composition is capable of maintaining a polishing speed of the metal layer, of suppressing an etching speed, and of preventing dishing of the metal layer.
摘要翻译：抛光液组合物可用作在半导体衬底上形成嵌入金属互连的手段。在包括绝缘层和金属互连层的待抛光表面中，抛光液组合物能够保持金属层的抛光速度，抑制蚀刻速度，并且防止金属层的凹陷。

15. 发明授权

US07247082B2 Polishing composition 有权
标题翻译：抛光组成
公开(公告)号：US07247082B2
公开(公告)日：2007-07-24
申请号：US11328149
申请日：2006-01-10
申请人： Hiroyuki Yoshida , Toshiya Hagihara , Ryoichi Hashimoto , Yasuhiro Yoneda
发明人： Hiroyuki Yoshida , Toshiya Hagihara , Ryoichi Hashimoto , Yasuhiro Yoneda
IPC分类号： C09K13/06
CPC分类号： C09G1/02 , C09K3/1463 , H01L21/31053
摘要： A polishing composition comprising an improver of a ratio of a polishing rate of an insulating film to that of a stopper film, wherein the polishing rate of the stopper film is selectively decreased, comprising one or more compounds selected from the group consisting of a monoamine or diamine compound; a polyamine having three or more amino groups in its molecule; an ether group-containing amine; and a heterocyclic compound having nitrogen atom. The polishing composition can be used for removing an insulating film which has been embedded for isolation into a trench formed on a silicon substrate and sedimented outside the trench, thereby planing a surface of the silicon substrate.
摘要翻译： 1.一种抛光组合物，其特征在于，包括：绝缘膜的抛光速度与阻挡膜的研磨速度的比例的提高剂，其中所述阻挡膜的研磨速度选择性地降低，所述抛光组合物包含一种或多种选自以下的化合物：单胺或二胺化合物; 在其分子中具有三个或更多个氨基的多胺; 含醚基的胺; 和具有氮原子的杂环化合物。抛光组合物可以用于将已经嵌入以隔离的绝缘膜去除形成在硅衬底上的沟槽并沉淀在沟槽外部，从而平面化硅衬底的表面。

16. 发明授权

US07059941B2 Polishing composition 失效
公开(公告)号：US07059941B2
公开(公告)日：2006-06-13
申请号：US10701606
申请日：2003-11-06
申请人： Hiroyuki Yoshida , Toshiya Hagihara , Ryoichi Hashimoto , Yasuhiro Yoneda
发明人： Hiroyuki Yoshida , Toshiya Hagihara , Ryoichi Hashimoto , Yasuhiro Yoneda
IPC分类号： C09K13/06
CPC分类号： C09G1/02 , C09K3/1463 , H01L21/31053
摘要： A polishing composition comprising an improver of a ratio of a polishing rate of an insulating film to that of a stopper film, wherein the polishing rate of the stopper film is selectively decreased, comprising one or more compounds selected from the group consisting of a monoamine or diamine compound; a polyamine having three or more amino groups in its molecule; an ether group-containing amine; and a heterocyclic compound having nitrogen atom. The polishing composition can be used for removing an insulating film which has been embedded for isolation into a trench formed on a silicon substrate and sedimented outside the trench, thereby planing a surface of the silicon substrate.

17. 发明申请

US20060113283A1 Polishing composition for a semiconductor substrate 审中-公开
标题翻译：半导体衬底抛光组合物
公开(公告)号：US20060113283A1
公开(公告)日：2006-06-01
申请号：US11262852
申请日：2005-11-01
申请人： Yasuhiro Yoneda , Mami Shirota
发明人： Yasuhiro Yoneda , Mami Shirota
IPC分类号： C09K13/00 , B44C1/22 , H01L21/461
CPC分类号： H01L21/31053 , C09G1/02 , C09K3/1436 , C09K3/1463
摘要： A polishing composition containing at least one or more aminocarboxylic acids selected from the group consisting of serine, cysteine and dihydroxyethylglycine, ceria particles and an aqueous medium; a polishing process of a semiconductor substrate, including the step of polishing a semiconductor substrate with a polishing composition for a semiconductor substrate, containing at least one or more aminocarboxylic acids selected from the group consisting of serine, cysteine and dihydroxyethylglycine, ceria particles and an aqueous medium; a method for manufacturing a semiconductor device including the step of polishing a semiconductor substrate having a film formed on its surface, the film containing a silicon atom and having a shape with dents and projections, with a polishing pad pressed against a semiconductor substrate at a polishing load of from 5 to 100 kPa in the presence of a polishing composition for a semiconductor substrate, containing at least one or more aminocarboxylic acids selected from the group consisting of serine, cysteine and dihydroxyethylglycine, ceria particles and an aqueous medium.
摘要翻译：一种抛光组合物，其含有选自丝氨酸，半胱氨酸和二羟乙基甘氨酸，二氧化铈颗粒和水性介质中的至少一种或多种氨基羧酸; 包括半导体衬底的抛光工艺，其包括用半导体衬底抛光组合物抛光半导体衬底的步骤，其包含至少一种或多种选自丝氨酸，半胱氨酸和二羟乙基甘氨酸的氨基羧酸，二氧化铈颗粒和水性中; 一种制造半导体器件的方法，包括以下步骤：在其表面上研磨具有形成膜的半导体衬底，所述膜含有硅原子并具有凹陷和突起的形状，抛光垫在抛光时被压靠在半导体衬底上在含有至少一种或多种选自丝氨酸，半胱氨酸和二羟乙基甘氨酸的氨基羧酸，二氧化铈颗粒和水性介质的半导体衬底抛光组合物存在下，载荷为5至100kPa。

18. 发明申请

US20050098882A1 Multilayer wiring circuit board 有权
标题翻译：多层布线电路板
公开(公告)号：US20050098882A1
公开(公告)日：2005-05-12
申请号：US11017785
申请日：2004-12-22
申请人： Toshihiro Kusagaya , Yasuhiro Yoneda , Daisuke Mizutani , Kazuhiko Iijima , Yuji Suwa
发明人： Toshihiro Kusagaya , Yasuhiro Yoneda , Daisuke Mizutani , Kazuhiko Iijima , Yuji Suwa
IPC分类号： H05K1/02 , H05K1/11 , H05K3/00 , H05K3/46 , H01L21/44 , H01L23/48 , H01L29/76 , H01L31/062
CPC分类号： H05K3/4641 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2924/01087 , H05K1/0216 , H05K1/113 , H05K3/0035 , H05K3/4602 , H05K3/4623 , H05K3/4626 , H05K3/4652 , H05K3/4655 , H05K3/4688 , H05K2201/0129 , H05K2201/0154 , H05K2201/09309 , H05K2201/09518 , H05K2201/09536 , H05K2201/096 , H05K2203/1394
摘要： An inexpensive multilayer wiring circuit board capable of conducting high frequency switching operation on the circuit while the generation of high frequency noise is being suppressed by reducing the inductance of the circuit in provided. A multilayer wiring circuit board comprising: an uppermost layer designated as a first layer on which parts are mounted; a second layer on which one of a ground layer and an electric power source layer is arranged; a third layer on which the other is arranged; and an insulating layer arranged between the ground layer and the electric power source layer. A resin layer having a thermoplastic adhesion property on both faces is used as material of the insulating layer arranged between the electric power source layer and the ground layer.
摘要翻译：能够通过降低所提供的电路的电感来抑制在产生高频噪声的同时对电路进行高频开关动作的便宜的多层布线电路板。一种多层布线电路板，包括：被指定为第一层的最上层，其上安装有部件; 布置有接地层和电源层中的一个的第二层; 另一个排列在其上的第三层; 以及布置在接地层和电源层之间的绝缘层。作为在电源层和接地层之间配置的绝缘层的材料，使用两面具有热塑性粘合性的树脂层。

19. 发明授权

US06403289B1 Developer for photosensitive polyimide resin composition 失效
标题翻译：光敏聚酰亚胺树脂组合物显影剂
公开(公告)号：US06403289B1
公开(公告)日：2002-06-11
申请号：US09183341
申请日：1998-10-30
申请人： Akira Tanaka , Kei Sakamoto , Yasuhiro Yoneda , Kishio Yokouchi
发明人： Akira Tanaka , Kei Sakamoto , Yasuhiro Yoneda , Kishio Yokouchi
IPC分类号： G03F732
CPC分类号： G03F7/322 , G03F7/037
摘要： The invention relates to a developer for photosensitive polyimide resin compositions, comprising an alkaline aqueous solution containing a basic compound (A) represented by a formula (1): wherein X+ is N+ or P+, R is an alkyl group having 1 to 20 carbon atoms or an aryl group having 6 to 10 ring forming carbon atoms, Y− is a monovalent anion, m is 0 or 1, n is 3 or 4, and m+n is 4, with the proviso that when m is 0, n is 4, and R is an alkyl group, the total number of carbon atoms of 4 alkyl groups is at least 13, or when m is 1, n is 3, and R is an alkyl group, the total number of carbon atoms of 3 alkyl groups is at least 6.
摘要翻译：本发明涉及用于光敏聚酰亚胺树脂组合物的显影剂，其包含含有由式（1）表示的碱性化合物（A）的碱性水溶液：其中X +为N +或P +，R为具有1至20个碳原子的烷基或具有6〜10个形成碳原子的芳基，Y-为一价阴离子，m为0或1，n为3或4，m + n为4，条件是当m为0时，n为 4，R为烷基，4个烷基的碳原子数为13个以上，或者m为1时，n为3，R为烷基，3个烷基的碳原子总数团体至少6人。

20. 发明授权

US5886136A Pattern forming process 失效
标题翻译：图案形成过程
公开(公告)号：US5886136A
公开(公告)日：1999-03-23
申请号：US819111
申请日：1997-03-17
申请人： Akira Tanaka , Masami Koshiyama , Kei Sakamoto , Yasuhiro Yoneda , Kishio Yokouchi , Daisuke Mizutani , Yoshikatsu Ishizuki
发明人： Akira Tanaka , Masami Koshiyama , Kei Sakamoto , Yasuhiro Yoneda , Kishio Yokouchi , Daisuke Mizutani , Yoshikatsu Ishizuki
IPC分类号： C08G73/10 , G03F7/037 , H05K1/00 , H05K3/28 , C08G73/00
CPC分类号： C08G73/101 , C08G73/1025 , G03F7/037 , H05K3/287 , H05K3/4676
摘要： Disclosed herein is a pattern forming process comprising the steps of coating a substrate with a photosensitive resin composition comprising a polyamic compound having, at each terminal thereof, an actinic ray-sensitive functional group which has substituent groups each having a photopolymerizable carbon-carbon double bond, a photosensitive auxiliary having a photopolymerizable functional group, a photopolymerization initiator, and a solvent to form a film; subjecting the film to pattering exposure; and then developing the thus-exposed film with an alkaline developer or alkaline aqueous solution.
摘要翻译：本文公开了一种图案形成方法，其包括以下步骤：用包含聚酰胺化合物的感光性树脂组合物涂布基材，所述聚酰胺化合物的每个末端具有具有可光聚合碳 - 碳双键的取代基的光化射线敏感性官能团具有可光聚合官能团的光敏助剂，光聚合引发剂和溶剂形成膜; 使电影曝光; 然后用碱性显影剂或碱性水溶液显影这样暴露的薄膜。

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